JP2001236892A - Electrode, method for manufacturing electrode, plasma display device, and method for manufacturing plasma display device - Google Patents

Abstract

(57) [Problem] To provide a PDP electrode and panel having low resistance, low cost, and no discoloration or edge curl of the electrode. SOLUTION: Using a photosensitive paste material, printing, drying and exposure are repeated a plurality of times, and then development is performed at once. The photosensitive paste contains at least one of Ag, Cu, and Al. Further, the line width decreases as the number of stacked films increases.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electrode, a method for manufacturing an electrode, a plasma display device, and a method for manufacturing a plasma display device.

[0002]

2. Description of the Related Art Conventionally, a plasma display panel, which has attracted attention as a thin display device, has, for example, a structure shown in FIG.

[0003] This plasma display panel has a front substrate 300 and a rear substrate 301 which are arranged to face each other.
And The display electrode 302 is provided on the front substrate 300.
And 303, a dielectric layer 304, and an MgO dielectric protection film 305 are formed. An address electrode 306 and a dielectric layer 307 are formed on the rear substrate 301, and a partition 308 is further formed thereon. Then, the side surface of the partition wall 308 and the dielectric layer 30
7 is coated with a phosphor layer 309.

A discharge gas 310 (for example, a mixed gas of Ne—Xe) is provided between the front substrate 300 and the rear substrate 301.
Are sealed at a pressure of 66,500 Pa to 80,000 Pa. The discharge gas 310 is supplied to the display electrodes 302 and 3
By generating an ultraviolet ray by discharging during the period 03 and irradiating the ultraviolet ray to the phosphor layer 309, an image display including a color display can be performed.

Usually, the display electrodes 302 and 303
And the front substrate 3 so that the
00 and the back substrate 301 are arranged, but in FIG. 6, the front plate is rotated by 90 degrees for convenience of explanation.

FIG. 4 shows an example of a conventional method for manufacturing an electrode composed of a laminated metal film. First, the glass substrate 202
Next, a photosensitive paste is applied by printing or the like to form a photosensitive metal electrode film A201 (FIG. 4A). Next, the photosensitive metal electrode film A201 is dried (FIG. 4B). Next, when the ultraviolet rays 204 are irradiated through the exposure mask A205, the exposed portions 207 and the unexposed portions 20 are formed on the photosensitive metal electrode film A203.
6 is formed (FIG. 4C). Next, when development is performed, only the exposed portion 207 remains on the substrate (FIG. 4D). Next, when baking is performed, the photosensitive metal electrode film A remaining on the substrate
Shrinks (FIG. 4 (e)). The above steps are repeated from (f) to (j) in the figure, and the photosensitive metal film is laminated by this method. In the figure, reference numeral 208 denotes the photosensitive metal electrode film A after development, and 209 denotes the fired photosensitive metal electrode film A.
210, the photosensitive metal electrode film B after printing, 211, the photosensitive metal electrode film B after drying, 212, ultraviolet light, 2
13 is an exposure mask B, 214 is an unexposed portion of the photosensitive metal electrode film B, 215 is an exposed portion of the photosensitive metal electrode film B,
Reference numeral 216 denotes the photosensitive metal electrode film B after development, and 217 denotes the photosensitive metal electrode film B after firing.

[0007]

(First Problem) In the case of an electrode composed of a metal film using a photosensitive paste, it is possible to prevent foreign matter in the conventional electrode film, disconnection of the electrode due to pinholes, etc. In order to improve the reliability, the electrodes were formed in a laminated configuration. In the case of manufacturing the electrode having the laminated structure, a metal film A using a photosensitive paste is formed on a substrate such as glass by screen printing or the like as shown in FIG.
Thereafter, light such as ultraviolet rays is exposed according to a desired electrode pattern, and developed by a developer containing an alkali or the like to leave the metal film A having only the electrode pattern on the substrate, and thereafter, the patterned metal film A is fired. By doing so, the organic components and the like in the paste are vaporized, the bonding of Ag particles is promoted, and a metal electrode having excellent conductivity is formed. Further, by using the photosensitive paste on which the metal film A is formed for the metal film B, the printing, the exposure, the development, and the baking are performed again,
An electrode having a reliable stacked structure is formed. However, since these manufacturing steps include the developing step and the baking step a plurality of times, there is a disadvantage that the manufacturing tact is long and the manufacturing cost is high. Further, it has been desired that the resistance value of the formed electrode is lower.

The present invention has been made in view of these disadvantages, and an object of the present invention is to provide an electrode having a low resistance value, capable of shortening a manufacturing process while maintaining reliability, and a method of manufacturing the electrode.

(Second Problem) When manufacturing an electrode having the above-mentioned laminated structure, the thickness of the metal film B formed on the exposed portion of the metal film A becomes extremely large. As a result, as shown in FIG. Shape. As a result, there are drawbacks such as shrinkage during firing, warpage of the film, and exfoliation in the worst case. The present invention has been made in view of these inconveniences, and it is possible to control a desired film thickness when forming a multilayer electrode film at a time, to shorten a manufacturing process, and to reduce reliability without shrinkage or peeling. An object of the present invention is to provide an electrode having:

The present invention provides an electrode which can be controlled to a desired film thickness when forming a laminated electrode film at a time, can reduce a manufacturing process, and is free from shrinkage and peeling, and a method for manufacturing the same. It is intended to be.

[0011]

The electrode according to the present invention is characterized in that printing, drying and exposure are repeated a plurality of times by using a photosensitive paste material, and then the development is carried out collectively.

Further, in the photosensitive paste, Ag, Cu,
It is characterized by containing at least one of Al.

Further, the invention is characterized in that the line width decreases as the number of laminated films increases.

The method is characterized in that the patterned photosensitive paste is fired at once.

[0015] Further, it is characterized in that it is an electrode for a plasma display panel.

The method for manufacturing an electrode according to the present invention is characterized in that printing, drying and exposure are repeated a plurality of times using a photosensitive paste material, and then development is performed at once.

Further, the drying temperature profile is rectangular.

The feature is that the line width of the exposure mask decreases as the number of laminated films increases.

Further, the invention is characterized in that the developer contains an alkaline solution.

The method is characterized in that the patterned photosensitive paste is fired at once.

Further, the present invention is characterized in that it is an electrode for a plasma display panel.

The electrode and the method of manufacturing the same according to the present invention
An electrode composed of a metal film, wherein the metal electrode is formed by laminating electrode films having different exposure doses using a photosensitive paste.

Further, in the laminated electrode films, the exposure amount of the outermost electrode film is lower than that of the electrode film immediately below.

Further, after exposure with different exposure amounts, development is performed at once.

Further, in the laminated electrode films, the line width of the outermost electrode film is smaller than the line width of the electrode film immediately below.

Further, among the electrode films to be laminated, the lowermost electrode film is a non-photosensitive electrode film.

[0027] Further, the lowermost electrode film of the laminated electrode films has a lower visible light transmittance than the uppermost electrode film.

Further, the invention is characterized in that a black pigment is contained in the electrode film formed by lamination.

Further, the laminated electrode films are formed of different components.

Further, the photosensitive electrode paste is formed by screen printing.

Further, the substrate on which the electrode film is formed is made of a glass substrate, silicon oxide, or silicon nitride.

Further, the present invention is characterized in that it is an electrode for a plasma display panel.

According to the electrode of the present invention and the method for producing the same,
The manufacturing process is shortened, a low resistance value, a highly reliable electrode can be obtained, and when the present invention is employed, a display device using a highly reliable, high quality electrode can be stably obtained. There are advantages.

The reason why the manufacturing steps can be shortened by the above means and the reason why the resistance value becomes low will be described below.

First, the reason why the manufacturing process can be shortened will be described. In the case of forming an electrode having a laminated structure, if a pattern is formed by a single exposure, disconnection is likely to occur due to dust adhering to an exposure mask. However, if the number of exposures is increased a plurality of times, the possibility of dust adhering to the same location as the first exposure mask is extremely low, and a highly reliable electrode without disconnection or the like can be formed. In addition, since the development and baking steps are performed at the same time in laminating the metal films, the manufacturing steps can be shortened. In particular, the tact is long,
By performing the firing step with high power consumption at once, the manufacturing cost can be reduced.

Next, the reason why the resistance value can be reduced will be described. When the photosensitive paste is exposed, the photosensitive components in the paste undergo a cross-linking reaction by light irradiation to polymerize and polymerize. The density of the polymerized portion due to crosslinking changes more sparsely than the unexposed portion. As a result, the solvent absorbability of the exposed portion is higher than that of the unexposed portion. When the photosensitive paste is further formed in a film shape in which the exposed portion and the unexposed portion exist at the same time as described above, the laminated paste moves to the exposed portion during drying due to a difference in solvent absorbency between the exposed portion and the unexposed portion. concentrate. If the drying profile at this time has a sharp rectangular temperature gradient, the difference in the film thickness reduction ratio between the paste on the exposed portion and the paste on the unexposed portion is significantly different. As a result, the film on the exposed portion becomes extremely thick, so that the film thickness after baking becomes large, and the cross-sectional area becomes larger than that of an electrode formed in a conventional manufacturing process of performing development and baking a plurality of times. Therefore, since the resistance value is inversely proportional to the cross-sectional area, the resistance value of the formed electrode can be reduced.

From the above results, it is possible to provide an electrode which can be controlled to a desired film thickness when forming a laminated electrode film at a time, can reduce a manufacturing process, and has reliability without shrinkage or peeling, and a manufacturing method thereof. it can.

According to the electrode of the present invention and the method for producing the same,
By shortening the manufacturing process, a highly reliable electrode that does not cause shrinkage or peeling can be obtained.When the present invention is adopted, a display device using a highly reliable high quality electrode can be stably obtained. There is an advantage that it can be.

The reason why the thickness of a metal electrode film formed by laminating photosensitive pastes having different exposure amounts can be controlled by the above means will be described below.

When the photosensitive paste is exposed, the photosensitive component in the paste undergoes a cross-linking reaction by light irradiation to polymerize and polymerize. The density of the polymerized portion due to crosslinking changes more sparsely than the unexposed portion. As a result, the solvent absorbability of the exposed portion is higher than that of the unexposed portion. When the photosensitive paste is further formed in a film shape in which the exposed portion and the unexposed portion are present at the same time, the laminated paste moves and concentrates on the exposed portion due to a difference in the absorbency of the solvent between the exposed portion and the unexposed portion. .

As a result, the film on the exposed portion becomes extremely thick.
As the film thickness increases, shrinkage during firing increases, resulting in a defect that peels off.

Unexposed portions not irradiated with light are soluble in the developing solution. Even when exposed, the state of cross-linking changes depending on the exposure amount of the irradiated light, and the higher the exposure amount, the more the cross-linking proceeds. Therefore, it is difficult to dissolve at a high exposure amount, and easily dissolved in a developer at a low exposure amount.

FIG. 3 shows the solubility of the exposed portion of the photosensitive metal paste used in the present invention in the developing solution. It can be seen that the dissolution rate decreases as the exposure amount increases, and insolubilization proceeds. In the figure, the dissolution rate is almost constant at 300 mJ / cm ² or more. Therefore, by setting the exposure amount of each electrode film to be laminated to two or more exposure amounts having different dissolution rates, it is possible to finish each layer with a different film thickness in one development step.

From the above results, it is possible to provide an electrode which can be controlled to a desired film thickness when forming a laminated electrode film at one time, can reduce the manufacturing process, and has reliability without shrinkage or peeling, and a manufacturing method thereof. it can.

[0045]

(Embodiment 1) FIG. 1 is a schematic view showing a main part configuration of an electrode according to the present embodiment and a manufacturing process thereof.

First, a photosensitive metal electrode film A101 is formed on a glass substrate 102 by screen printing a negative photosensitive metal paste containing Ag particles (FIG. 1A).
Next, the temperature of the photosensitive metal electrode film A101 is changed from room temperature to 10 ° C.
When the temperature profile which rises linearly to 5 ° C. is dried by a rectangular IR furnace, the photosensitive metal electrode film A after drying is dried.
103 has a thickness smaller than that of the printed photosensitive metal electrode film A101 (FIG. 1B). Next, the ultraviolet light 104 was applied to a line width of 1
When exposed through a 15 μm exposure mask A105, the exposed portions 107 and unexposed portions 106 are formed on the photosensitive metal electrode film A103.
Is formed (FIG. 1C). Next, on the exposed photosensitive metal electrode film A, the same photosensitive paste as that of the photosensitive metal electrode film A is screen-printed using a photosensitive metal electrode film B10.
8, the thickness of the photosensitive metal electrode film B on the exposed portion 107 of the photosensitive metal electrode film A and the thickness of the photosensitive metal electrode film B on the unexposed portion 106 of the photosensitive metal electrode film A It becomes thin (FIG. 1D). Next, when the film is dried in an IR furnace having a rectangular temperature profile, the film thickness of the photosensitive metal electrode film A on the exposed portion 107 is changed to the unexposed portion 10 of the photosensitive metal electrode film A.
A photosensitive metal electrode film B109 thicker than the upper film 6 is formed (FIG. 1E). Next, the ultraviolet light 110 is irradiated with a line width of 85.
Exposure through a μm exposure mask B111 forms an exposed portion 113 and an unexposed portion 112 on the photosensitive metal electrode film A109 (FIG. 1F). Next, when development is performed with a developer containing 0.4% by weight of sodium carbonate, unexposed portions are removed in FIGS. 1C and 1F, and the exposed portions of the photosensitive metal electrode film A115 are removed. Only the photosensitive metal electrode film B114 remains (FIG. 1 (g)). Next, when baking is performed, the photosensitive metal electrode film A115 and the photosensitive metal electrode film B114 remaining after the development shrink and shrink, and the photosensitive metal electrode films A117 and B116 having good conductivity are formed. (FIG. 1 (h)). When the electrode is manufactured in this manufacturing process, the conventional electrode manufacturing method shown in FIG.
A shortened manufacturing process can be provided.

Table 1 shows an example of the film thickness and resistance of the electrode formed according to the present embodiment, and an example of the film thickness and resistance of the electrode formed by the conventional electrode manufacturing method.

[0048]

[Table 1]

The resistance values in Table 1 are examples of the resistance value of an electrode having a length of 960 mm and a width of 100 μm. The electrode formed according to the present embodiment has a smaller resistance value because it has a larger film thickness than the electrode formed by the conventional electrode manufacturing method.

In the present embodiment, the photosensitive paste does not have to be a negative paste and is not limited to the present embodiment. Further, the photosensitive paste does not need to contain Ag and is not limited to the present embodiment. Also, the metal paste A and the metal electrode B of the photosensitive paste may not be the same, and are not limited to the present embodiment.
In addition, the number of layers to be stacked is not limited to two and is not limited to this embodiment. Further, the photosensitive paste does not have to be formed by screen printing, and is not limited to the present embodiment. Further, drying after printing may not be performed in the IR furnace, and is not limited to the present embodiment. Further, the drying temperature does not have to be 105 ° C. and is not limited to the present embodiment. Further, the line width of the exposure mask is not limited to 115 μm or 85 μm, and is not limited to this embodiment. In addition, the line width of the exposure mask in each layer does not need to be smaller as it goes to an upper layer, and is not limited to this embodiment. Further, the developer does not need to contain 0.4 wt% of sodium carbonate, and is not limited to the present embodiment. Also,
The substrate on which the electrode film is formed need not be a glass substrate, and is not limited to this embodiment. Further, a transparent electrode or the like may be formed in advance on a substrate such as glass. Further, the values in (Table 1) are merely examples, and if the relationship between the film thickness and the resistance value of the comparative example and the example is satisfied,
The absolute value is not limited to the values in Table 1.

(Embodiment 2) FIG. 2 is a schematic diagram showing a main part configuration of an electrode according to the present embodiment and a manufacturing process thereof.
This is the same as the conventional example, and FIG. 2 will be described in detail.

First, a photosensitive metal electrode film 1 is formed on a glass substrate by screen printing of a photosensitive metal paste (FIG. 2A).

Next, the photosensitive metal electrode film 1 is exposed with a desired pattern and an exposure amount of 1 (FIG. 2B).

Next, a photosensitive metal electrode film 2 is formed on the exposed photosensitive metal electrode film 1 by screen printing using the same photosensitive paste as that of the photosensitive metal electrode film 1 (FIG. 2).
(C)).

The photosensitive metal electrode film 2 on the exposed photosensitive metal electrode film 1 is thicker than the unexposed portion (FIG. 2).
(C)).

Next, the photosensitive metal electrode film 2 is exposed with a desired pattern and an exposure amount of 2.

Here, the exposure amounts 1 and 2 are: exposure amount 1> exposure amount 2
(FIG. 2D).

Next, the electrode film on which the photosensitive metal electrode films 1 and 2 are laminated is developed with a developing solution to be patterned (FIG. 2).
(E)).

Since the exposure amounts 1 and 2 satisfy the relationship of exposure amount 1> exposure amount 2, the solubility of the metal electrode film 2 is high and the film thickness is about the same as or thinner than the metal electrode film 1. Thus, a laminated metal film can be formed without increasing the thickness of the metal electrode film 2.

At this time, the line width of the electrode film changes in accordance with the exposure amount, and as the exposure amount increases, the line width increases. Therefore, in the present embodiment, the line width of the electrode film on the surface is smaller than the line width of the electrode film immediately below.

Table 2 shows the thicknesses of the metal electrode films 1 and 2 when the exposure amount 1 and the exposure amount 2 are variously changed.

[0062]

[Table 2]

It can be seen from Table 2 that a good film thickness can be obtained by performing exposure with different exposure amounts. As a comparative example, Table 1 shows the film thickness when the exposure amount 1 and the exposure amount 2 are the same.

The photosensitive paste does not have to be the same for the metal electrode film 1 and the metal electrode film 2 and is not limited to the present embodiment. In addition, the number of layers to be stacked is not limited to two and is not limited to this embodiment.
Further, the photosensitive paste does not have to be formed by screen printing, and is not limited to the present embodiment. Further, the substrate on which the electrode film is formed may not be a glass substrate, and is not limited to this embodiment. Further, a transparent electrode or the like may be formed in advance on a substrate such as glass.

[0065]

As described above, according to the electrode and the method of manufacturing the same according to the present invention, a low-resistance laminated metal electrode film can be formed in a short manufacturing process.

Further, according to the electrode and the method of manufacturing the same according to the present invention, the laminated metal electrode film can be controlled to a desired film thickness of each layer, and a good electrode without shrinkage or peeling can be formed in a short manufacturing process. I can do it.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a configuration of a main part of an electrode according to an embodiment of the present invention and a manufacturing process thereof.

FIG. 2 is a schematic diagram showing a main part configuration of an electrode according to an embodiment of the present invention and a manufacturing process thereof.

FIG. 3 is a schematic diagram illustrating the solubility of a photosensitive paste in a developer in an exposed portion according to an embodiment of the present invention.

FIG. 4 is a schematic diagram showing a main part configuration of a conventional electrode and a manufacturing process thereof.

FIG. 5 is a schematic view showing a configuration of a main part of a conventional electrode.

FIG. 6 is a structural diagram of a conventional plasma display panel.

[Explanation of symbols]

 Reference Signs List 101 Photosensitive metal electrode film A after printing 102 Glass substrate 103 Photosensitive metal electrode film A after drying 104 Ultraviolet 105 Exposure mask A 106 Unexposed part of photosensitive metal electrode film A 107 Exposed part of photosensitive metal electrode film A 108 Photosensitive metal electrode film B after printing 109 Photosensitive metal electrode film B after printing 110 Ultraviolet 111 Exposure mask B 112 Unexposed portion of photosensitive metal electrode film B 113 Exposure portion of photosensitive metal electrode film B 114 After development The photosensitive metal electrode film B 115 The photosensitive metal electrode film A 116 after development The photosensitive metal electrode film B 117 after baking The photosensitive metal electrode film A 201 after baking The photosensitive metal electrode A 201 after printing 202 The glass substrate 203 Photosensitive metal electrode A 204 after drying Ultraviolet ray 205 Exposure mask A 206 Unexposed portion of photosensitive metal electrode film A 207 Photosensitive metal electrode film Exposure part 208 Photosensitive metal electrode film A 209 after development Photosensitive metal electrode film A 210 after firing Photosensitive metal electrode film B 211 after printing Photosensitive metal electrode film B 212 after drying Ultraviolet 213 Exposure mask B 214 Unexposed portion of photosensitive metal electrode film B 215 Exposed portion of photosensitive metal electrode film B 216 Photosensitive metal electrode film B 217 after development Photosensitive metal electrode film B after firing

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Hideki Marunaka 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Tadashi Nakagawa 1006 Odaka Kadoma Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (72) Inventor Keisuke Sumita 1006 Kadoma, Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. 1006 Okadoma Kadoma, Fumonma-shi Matsushita Electric Industrial Co., Ltd. (72) Inventor Hiroyoshi Tanaka 1006 Okadoma Kadoma, Kadoma-shi Osaka Pref. AA01 5C040 GC02 GC03 GC05 GC18 GC19 JA15 JA21 KA04 KA16 KB14 MA12 MA24 MA26 5C094 AA21 AA43 BA31 CA19 DA14 EA04 EA07 EB02 FB12

Claims (29)

[Claims] 1. An electrode which is patterned and has a shape in which a film thickness near a center portion is larger than a film thickness near an end portion in a cross section in a short side direction. 2. The electrode according to claim 1, wherein the pattern is formed by exposing and developing a photosensitive material. 3. An electrode having a structure in which a second layer is laminated on at least a first layer on which a pattern is formed, wherein a film thickness near a center is larger than a film thickness near an end in a cross section in a short side direction. An electrode having a shape. 4. The method according to claim 1, wherein at least a part of the pattern formation includes:
4. The electrode according to claim 3, wherein the electrode is formed by exposure and development using a photosensitive material. 5. An electrode having a structure in which a second layer is laminated on at least a first layer patterned, wherein the line width of the second layer is smaller than the line width of the first layer. Electrode. 6. At least a part of the pattern formation,
The electrode according to claim 5, wherein the electrode is formed by exposure and development using a photosensitive material. 7. The method according to claim 5, wherein the second layer is an uppermost surface, and the first layer is immediately below the uppermost surface.
The electrode according to 1. 8. The method according to claim 5, wherein the first layer is the lowermost surface, and the electrode film on the lowermost surface is formed without using photosensitivity.
8. The electrode according to any one of items 1 to 7. 9. The method according to claim 5, wherein the first layer contains at least one kind of black material and has a gray to black color.
9. The electrode according to any one of items 1 to 8. 10. The electrode according to claim 9, wherein the black material is a black pigment. 11. The electrode according to claim 10, wherein the black material is ruthenium oxide. 12. An electrode, wherein the electrode films to be formed by lamination are formed of different components. 13. A plasma display device using the electrode according to claim 1. Description: 14. A method of manufacturing an electrode including a structure in which a second layer is laminated on at least a first layer on which a pattern is formed, wherein the pattern formation includes applying a first photosensitive material, exposing, (2) A method for manufacturing an electrode, which comprises applying a photosensitive material, performing exposure, and then developing the batch. 15. The method according to claim 14, wherein the line width of the exposure mask used in forming the first layer is smaller than the line width used in forming the second layer. 16. The method for manufacturing an electrode according to claim 14, wherein an exposure amount when forming the first layer is different from an exposure amount when forming the second layer. 17. The method for manufacturing an electrode according to claim 14, wherein the second photosensitive material is a paste, and the application of the second photosensitive material is performed by printing and drying. 18. The first photosensitive material and the second photosensitive material are pastes, and after printing, drying and exposing the first photosensitive material, printing, drying and exposing the second photosensitive material, The method for manufacturing an electrode according to claim 14, wherein the development is performed at a time. 19. The method for manufacturing an electrode according to claim 14, wherein the temperature profile at the time of drying is rectangular. 20. A step of applying a first photosensitive material, polymerizing it by a cross-linking reaction by light irradiation through a photomask after application, and lowering the density of an exposed portion than an unexposed portion, and further forming a second photosensitive material on the exposed portion. After printing the material, during the step of drying with a rectangular drying profile, the solvent in the second photosensitive material is absorbed in the exposed portion, and the thickness of the exposed portion is made thicker than the unexposed portion. Process and a second process using a photomask.
20. The method for manufacturing an electrode according to claim 14, further comprising a step of exposing the photosensitive material by light irradiation and a step of simultaneously developing the first and second photosensitive materials. 21. A method of manufacturing an electrode including a structure in which a second layer is laminated on at least a first layer on which a pattern is formed, wherein the patterned first material and the second material are simultaneously fired. Method for manufacturing an electrode. 22. The method according to claim 21, wherein at least a part of the pattern formation is performed by applying, exposing, and developing using a photosensitive material. 23. The method according to claim 21, wherein the photosensitive material is a paste, and the coating is performed by screen printing and drying. 24. A method of manufacturing an electrode including a structure in which a second layer is laminated on at least a first layer on which a pattern is formed, comprising: applying a first photosensitive material, exposing the first photosensitive material, and applying a second photosensitive material. A method for producing an electrode, comprising the steps of: exposing a first photosensitive material to light and exposing a second photosensitive material to light, the method comprising: 25. The method according to claim 21, wherein the exposure amount of the second layer is lower than the exposure amount of the first layer. 26. The method for manufacturing an electrode according to claim 21, wherein the second layer is the outermost surface. 27. A step of exposing the first photosensitive material by light irradiation through a photomask after printing and drying, and exposing the second photosensitive material on the same by printing and drying, and then exposing by light irradiation through a photomask. Process and these first,
A step of simultaneously developing the second photosensitive material, and a step of applying and drying the dielectric material thereon and then simultaneously baking the first and second photosensitive materials and the dielectric material simultaneously. Of manufacturing a plasma display device. 28. A method of manufacturing a plasma display device, wherein the electrodes are manufactured by the method of any one of claims 14 to 26. 29. A plasma display comprising a glass substrate, a silicon oxide substrate, or a silicon nitride substrate provided with electrodes manufactured by the method according to claim 14. Description: apparatus.