JP2001230453A - Led lamp and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an LED lamp having a good directional characteristic in the small number of processes and at good yield. SOLUTION: The LED lamp with a lead electrode is formed in such a way that, in a region in which the lead electrode is not sealed with a molding resin, at least a solder region is used as an object, that protruded burr parts which is generated at a time when a lead electrode is punched and worked is flattened, and that a lusterless plating operation is executed to the surface of the lead electrode.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED lamp that emits light using an LED chip, and more particularly to a highly reliable LED lamp having excellent directivity characteristics.

[0002]

2. Description of the Related Art LED lamps are small, efficiently emit vivid colors, and have excellent initial drive characteristics, so that they can display light / write light sources such as optical sensors and optical printers, backlight light sources, and various data. It is used in various fields such as display devices.

FIG. 6 shows a specific example of such an LED lamp. The light emitting element 1 is arranged on the bottom surface of a cup formed at the tip of the first lead 2 of the pair of two or more lead electrodes. One electrode of the light emitting element 1 is electrically connected to the first lead 2 and the other electrode is electrically connected to the second lead 3 using a conductive wire 5 or the like. The mold member 4 is provided by a translucent resin or the like. LE like this
When the D lamp is connected to a driving substrate or the like to supply power, light is emitted relatively isotropically.

The light-transmitting sealing resin used for the mold member 4 protects against external force from the external environment, moisture and the like, and also has a lens function. it can. Further, the light emission output can be improved by changing the shape of the cup on the first lead 2. As described above, by adjusting the shape of the resin lens and the shape of the reflection portion, desired emission characteristics can be obtained.

The lead electrodes 2 and 3 are formed by punching a metal plate made of a material such as iron, copper alloy or iron nickel alloy at right angles to the surface of the metal plate to form a lead of a desired shape. After forming a cup by pressing in the longitudinal direction of the lead 2 to form a cup, the surface of the lead is covered with silver, gold, palladium or the like.

By plating the leads as described above,
The bonding property when the light emitting element 1 is die-bonded on the cup is improved. In addition, First Read 2
By adjusting the glossiness of the plating layer on the inner surface of the cup, light can be spread with good directivity characteristics. In addition, the surface of the plating layer having low gloss (hereinafter referred to as matte plating) is rough, and the adhesion to the mold member is improved as compared with the glossy surface.

[0007]

However, when matte plating is applied to the entire lead electrode, the adhesion to the mounting substrate has been reduced in some cases. Such a mounting defect causes a large decrease in yield and reliability when a large number of LED lamps are mounted.

Accordingly, the present invention has good directional characteristics,
Another object of the present invention is to provide an LED lamp having good productivity.

[0009]

That is, an LED lamp according to the present invention comprises: a first lead 2 on which a light emitting element 1 is mounted on a bottom surface of a cup provided at a tip portion; An LED lamp comprising lead electrodes 2 and 3 constituted by connected second leads 3, wherein at least the light emitting element 1 and the tip portions 2 and 3 of the leads are sealed by a molding member 4, The lead electrodes 2 and 3 are characterized in that at least the burr portion 12 is flattened and that the entire surface of the lead electrodes 2 and 3 is subjected to matte plating made of the same material.

[0010] The term “matte” is characterized in that the glossiness D represented by the following formula is in the range of 0.05 to 0.5. D = log (1 / R) (where R is the reflectance in the 45-degree direction, and R = (reflected light quantity / incident light quantity))

With such a configuration, light emitted from the lateral direction of the light emitting element can be diffused on the inner surface of the cup of the first lead 2, and a light pattern close to non-directional can be formed. Also, the burr portion 12
Is flattened, minimizing the rise of the mold resin in the direction of the soldering area of the lead electrode, which is observed when the mold member 4 is provided on the matte plated lead electrodes 2 and 3. it can.

Each of the lead electrodes 2 and 3 has a first region whose surface is covered with a mold member 4 and a second region exposed outside the mold member 4. At least the burr portion 12 is flattened.

According to this structure, the first region of the lead electrode has a surface in consideration of directivity of light emission and adhesion to the mold member, and the second region has a solderability at the time of mounting. Is considered, and the LED lamp can be handled in the same manner as in the related art and has improved directivity.

Further, in the second region, a burr portion 1 is formed.
2 and the sag portion 13 are flattened. With this configuration, the soldering region of the lead electrode has a substantially symmetrical shape, and the soldering strength in the mounting process is improved. In addition, it becomes possible to provide the matte plating layer more uniformly and thinly. In the present invention, the preferable thickness of the matte plating layer is 2 μm to 6 μm.

Further, the molding member 4 is characterized by being a translucent sealing resin having a lens surface formed on an LED chip.

In the manufacturing method of the present invention, the first lead 2 having the light emitting element 1 mounted on the bottom surface of the cup provided at the tip and the second lead 3 electrically connected to the light emitting element 1 are provided. An LE comprising the configured lead electrodes 2 and 3, wherein at least the light emitting element 1 and the tip of each lead are sealed by a mold member 4.
In a method for manufacturing a D lamp, at least the following LED
It is characterized by having lamp manufacturing steps (A) to (C). (A) Step of forming lead electrodes 2 and 3 in which first lead 2 and second lead 3 are connected by tie bar 7 by punching a flat plate of a lead electrode material. (B) a step of pressing the projecting portions 12 formed on the bottom surfaces of the lead electrodes 2 and 3 in the direction opposite to the punching side by the punching at least upward from the bottom surface. (C) A step of plating the entire surface of the lead electrode matlessly.

Further, the above-mentioned "matte" is characterized in that the glossiness D represented by the following formula is in the range of 0.05 to 0.5. D = log (1 / R) (where R is the reflectance in the 45-degree direction, and R = (reflected light quantity / incident light quantity))

According to this manufacturing method, even when matte plating made of the same material is applied to the entire surface of the lead electrode at one time,
The pressed and flattened burrs serve as stoppers for suppressing the rise of the mold resin to be formed later, and the area mainly responsible for light emission (first area) and the ease of handling mainly during mounting are improved. It is possible to provide an LED lamp having a configuration that can be used in each of the area where it is carried (the second area), and it is possible to manufacture the LED lamp with a small number of man-hours with high productivity.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION The inventor of the present invention
The present inventors have found that the yield of the LED lamp varies greatly depending on the form of the lead electrode, and have accomplished the present invention.

The lead electrode is formed by punching a base plate made of a raw material metal. However, since a flat base plate is punched at right angles to the surface, a projecting protrusion is formed on the bottom edge of the base plate. Burrs occur. In order to make such a rough surface smooth, the surface is plated to improve the bonding property of the light emitting element and the wire and the corrosion resistance of the lead electrode. In addition, a good directional characteristic can be obtained by providing a matte plating layer having low gloss on the inner surface of the cup of the first lead 2.

However, if the plating layer is provided with a thickness enough to cover the projecting burrs, the dimensions may have to be adjusted by polishing or the like, without adapting to the diameter of the through hole of the mounting board. In addition, when the light emitting device is mounted on a display substrate, the light emitting device needs to be mounted as densely as possible in order to improve the resolution. Therefore, it is necessary to provide a thin plating layer on the surface of the lead electrode.

Further, in order to simplify the plating process, if matte plating considering light emission characteristics is applied to one surface of the lead electrode, even if it is intended to coat only the tip portion of the lead electrode with the mold resin, It spreads over the desired area and crawls up to the soldering area. This is because the matte surface has better wettability with the mold member than the glossy surface. This causes soldering failure. This is because if the mold member reaches the soldering area of the lead electrode, mounting becomes impossible. In particular, when the lead electrode surface having burrs is thinly coated by matte plating having good wettability with resin, electricity is concentrated on the burrs, plating is thicker than other surfaces, and a uniform layer cannot be obtained. . The plated portion on the burr which has become the convex portion becomes a path for the resin to climb up, and the resin significantly climbs up to the soldering region in combination with the wettability of the matte plating.

As a method for deburring a lead electrode generated by punching, there is a swaging process using a wire brush or the like. However, it is difficult to remove burrs so as to have a fixed shape by the swaging process, which causes a variation in thickness of a plating provided later. In addition, if the cross section of the soldering part of the lead electrode is asymmetrical, the surface in contact with the mounting board will be unstable, and the soldering strength will decrease, or the solder will be mounted with a slant when inserted into the through hole of the mounting board Color unevenness tends to occur.
Also, since the operation takes time, the surface of the lead electrode may be oxidized and corroded during processing.

Therefore, the present invention uses a mold designed in accordance with the preferred shape of the lead electrode, and presses the burr portion at least from the burr direction to flatten the burr portion and crush the burr to a constant shape. After that, a thin matte plating is provided on one surface of the lead electrode. by this,
A matte plating layer having a preferable outer shape is obtained, and the subsequent mounting process can be performed favorably.

An embodiment according to the present invention will be described below with reference to the drawings. FIG. 1 shows a schematic sectional view of the LED lamp of the present invention. Iron-containing copper is used as a material for the lead electrodes 2 and 3, and the entire surface of the lead electrodes 2 and 3 is subjected to matte silver plating. One of the lead electrodes 2 and 3 is a first lead 2 provided with a cup,
In the vicinity of the cup, there is provided a recess having a buffer function for increasing the thickness of the cup and preventing distortion generated during press working or the like. The shape of the cup is a track shape that is long in a direction parallel to the direction between the lead electrodes 2 and 3. The portions of the lead electrodes 2 and 3 that are not covered with the mold resin 4 are pressed to flatten the burrs.

The light emitting element 1 is mounted on the bottom surface of the cup of the first lead 2. In FIG. 1, an LED chip having a nitride semiconductor in a light emitting layer is die-bonded with an epoxy resin. Each electrode of the LED chip and the tip portion on the second lead 3 and the first lead 2 are wire-bonded by the gold wire 5, respectively, so that the LED chip 1 and the tip portions of the lead electrodes 2, 3 have a lens effect. An elliptical mold member 4 made of a conductive epoxy resin is formed. As viewed from the light emission observation surface, the major axis direction of the elliptical shape of the mold member 4 is formed in a cup shape whose parallel direction is longer than vertical. With such a configuration, an LED lamp with stable light emission characteristics and high yield can be obtained. Hereinafter, the configuration of the present invention will be described in detail.

(Glossiness D) Glossiness D used in the present invention is represented by the following formula, and the value is measured using a photometer of Densitometer Model 144 manufactured by GAM. is there. The same applies to the embodiment. However, a minute area (area), for example, the bottom of a reflection section (cup) is measured using a small area color difference meter VSR 300A manufactured by Nippon Denshoku Industries Co., Ltd. D = log (1 / R) (where R is the reflectance in the 45-degree direction, and R = (reflected light quantity / incident light quantity))

Here, the principle of the measuring device will be briefly described. As shown in FIG. 5, a measuring object 10 is placed at a predetermined position, and a light source 8 irradiates the surface of the measuring object 10 with light. The light reflected from the surface of the measurement object 10 is detected by the detector 9 in the direction of 8 to 45 degrees. At this time, when the surface has gloss, the D value is large, and when the surface is relatively glossy, the D value is small.

(Lead electrodes 2 and 3) Lead electrodes 2 and 3
Is formed by punching a metal plate into a desired shape. The lead electrodes 2 and 3 used in the present invention have a thickness of 0.1 mm.
A 5 mm, 35 mm long, 150 mm wide iron-containing copper plate is stamped and formed. The punched lead electrodes 2 and 3 are shown in FIG.
As shown in (1), the tie bar 7 has a shape in which a plurality of lead electrodes are connected. The lead electrode includes a first lead 2 on which the light emitting element is mounted, and a second lead 3 which is electrically connected to the electrode of the light emitting element by a wire or the like. The first lead 2 can form a concave portion such as a cup having a flat bottom surface on which the LED chip is to be disposed by partially applying pressure from the top.

Also, when the metal plate is punched at right angles to the plane, some metal flows to the bottom side of the metal plate. The flowed portion becomes a projection and burrs are generated. In the present invention, it is considered that the burr portion 12 further promotes the crawling of the resin when the entire surface of the lead electrode is coated with a thin matte plating,
By applying the matte plating after the burr portion 12 is flattened by pressing, the creeping up of the mold resin seen in the matte plating is suppressed to a minimum.

In the present invention, the press work for flattening the burr portion 6 is not necessary for the entire surface of the lead electrodes 2 and 3, and at least the lead of the soldering area which is the second area not sealed by the mold member 4. What is necessary is just to give to an electrode. In the first region sealed by the mold member 4, it is preferable that the burr portion 6 be left without being pressed in consideration of the adhesion to the mold resin. In the second region, at least only a portion to be a soldering region at the time of mounting or only a peripheral portion thereof may be subjected to burring, and it is sufficient that the second region is applied only to this portion. That is, the burrs need not necessarily cover the entire lead electrode, but may be partial.

Also, in the present invention, it is preferable to press the sag portion simultaneously with the burr portion of the lead electrode. The sagging portion refers to a convex curved surface portion generated in a direction opposite to the burr when the lead metal plate is punched at right angles to the surface. The shape of the sag differs depending on the amount of punching of the lead metal plate and does not become a constant shape. Further, in order to form a thin and uniform plating layer on the lead electrode, it is preferable that the shape of the underlying lead electrode is closer to left-right symmetry. Therefore, in the present invention, the lead electrode can be formed into a shape close to a regular polygon by simultaneously performing press working from both sides in the burr direction and the sag direction.

As a specific press working method, a preferably designed die as shown in FIG. 7 can be used. As for the mold, in two right-angled portions of a U-shape having one side of 0.5 mm and two sides of 0.25 mm, r is 0.
It is preferable that the shape be a shape excluding an isosceles triangle having a bottom angle of 45 ° C. and 1 mm. If the angle is larger or smaller than 45 ° C., the contact area with the through-hole of the mounting board becomes small, and it is unstable. The surface of the lead electrode obtained by pressing from the burr side or from both sides of the burr and the sag using the mold designed in this way is optimal for providing a thin and uniform matte plating. In addition, when the semiconductor device is inserted into the through hole of the mounting board, eight points of contact between the hole and the lead electrode can be taken at a preferable interval, and the stability in mounting is improved, which is preferable.

Further, in order to enhance the suppression of the mold resin from climbing up, before plating, a concave portion is provided by punching above the burrs on the second region or on both sides where burrs and sagging occur, or A groove may be provided on the end face of the lead electrode. With such a configuration, the concave portions and the grooves preferably serve as stoppers for rising the resin.

As described above, the lead electrode punched out from the base plate made of iron-containing copper and subjected to press working is:
First, a degreasing treatment with pure water is performed as a pretreatment. Thereafter, copper plating is preferably applied to one surface of the lead electrode as a base plating, since the surface is smooth and is preferable. Then, silver plating, which is matte plating, is coated on the surface of the lead electrode for finishing.

In the present invention, the gloss D of the matte plating provided on the surfaces of the lead electrodes 2 and 3 is 0.05 to 0.5.
5 and preferably in the range of 0.1 to 0.3. Because, if the glossiness is less than 0.05, for example, the emission of light outside the adjusted directivity angle of the reflection unit increases,
The brightness as an LED lamp is greatly reduced. Also,
If it exceeds 0.5, the radiation intensity will be biased, and when a plurality of light emitting diodes are arranged and observed, the variation in luminance among the light emitting diodes will start to be noticeable.
Further, when the angle is in the range of 0.1 or more and 0.3 or less, even when the directional half angle is wide, for example, 120 ° or more, good light spread is realized, and the directional characteristic diagram has a smooth pattern. It becomes a curve.

Here, the method of adjusting the D value (glossiness) of the matte plating provided on the lead electrodes 2 and 3 so as to be in the above-mentioned range is not particularly limited, but the surface is not smooth and the surface is fine. Some have irregularities. Specifically, the lead electrodes 2 and 3 are usually plated. In this case, a method of adjusting the plating conditions to obtain a surface having a preferable glossiness is performed. There is a method of providing such a method, a method of providing fine irregularities after plating, and the like. The degree of the unevenness at this time may be such that light is appropriately spread within the narrowed directivity angle without impairing the directivity. Here, as a method of adjusting the plating conditions, the amount of the additive in the plating bath is adjusted to change the form of the formed plating, for example, from a dense and uniform one, to a coarse and uneven one. Etc. As a method of plating after forming unevenness on the surface, or providing unevenness after plating, a generally known method such as blasting may be used.

Further, by using the lead electrodes 2 and 3 whose glossiness (D value) is adjusted within the above range, the bonding property of the LED chip 1 is improved, and the adhesion to the mold member 4 is also improved. More specifically, the fine irregularities on the surfaces of the lead electrodes 2 and 3 improve the adhesiveness and the adhesion since the surface area and the adhesive area are larger than those of the related art. More preferably, the D value is in the range of 0.1 to 0.3.

In the present invention, the preferable thickness of the matte plating layer is 2 μm to 6 μm. By providing a thin plating layer in this manner, the thickness of the plating can be kept within the allowable range of the dimensions of the lead electrode, and the design of the lead electrode and the subsequent mounting process can be easily performed. Further, it is possible to sufficiently cope with downsizing of the light emitting device.

As a specific material for matte plating, silver is used in the present invention. Silver is preferable because it has good thermal conductivity and a light-emitting device with low power consumption can be formed by plating one surface of the electrode with silver. Further, it is possible to form a light emitting device which does not have a harmful substance such as solder and has a problem of environmental pollution, which is compatible with the present. Also, it is easy to handle because it does not dissolve even at high temperatures.

As shown in FIG. 3B, the shape of the lead electrode has a complicated bent shape in the first region sealed by the mold member. With such an angle, the pressure received during bonding can be reduced. In addition, by providing a surface in the direction perpendicular to the long axis direction of the lead electrode, peeling of the lead electrode and the mold member due to an attractive force received when the lead electrode is removed from the casting case in the mold member forming step can be suppressed. Further, it is preferable that the lead electrode is formed so that the mount lead on which the light emitting element is mounted is wider than the other second leads. With this configuration, the heat dissipation of the light emitting device is improved.

(Light-Emitting Element 1) As the light-emitting element 1, GaAlN, Z
nS, ZnSe, SiC, GaP, GaAlAs, Al
What is formed as a semiconductor structure such as InGaP, InGaN, GaN, and AlInGaN is used. Examples of the semiconductor structure include a homostructure having a MIS junction, a PIN junction, and a pn junction, a heterostructure, and a double heterostructure. The emission wavelength can be variously selected from ultraviolet light to infrared light depending on the material of the semiconductor layer and the degree of mixed crystal thereof.

In the present invention, the number of LED chips mounted on the first lead 2 is not limited to one, and a plurality of LED chips having different element structures or luminescent colors, or a plurality of LED chips having the same color or the same color are used. The LED chip may be mounted on one first lead 2 or a plurality of first leads 2 on which these LED chips are mounted may be combined and sealed with a mold member.

(Mold Member 4) The mold member 4 is preferably provided to protect the light emitting elements 1 and the conductive wires 5 from the outside, and is generally formed using a resin. Further, by forming the resin mold into a desired shape, it is possible to have a lens effect of converging or diffusing light emitted from the light emitting element 1. In the present invention, the form of the mold resin may be circular or elliptical when viewed from the light emission observation surface side. Further, the resin mold itself may be colored to serve as a filter that cuts an undesired wavelength. As a material of the resin mold, a transparent resin having excellent weather resistance such as an epoxy resin and a urea resin is suitably used.

Hereinafter, an LED lamp according to an embodiment of the present invention will be described. Note that the present invention is not limited to only the examples described below.

[Embodiment 1] LE according to an embodiment of the present invention
The D lamp is shown in FIG. This LED lamp has a pair of lead electrodes 2 and 3, and one
A reflector for mounting the LED chip 1 is provided at the tip of the lead 2. The lead electrodes 2 and 3 are parallel in an upward direction from the bottom surface side in the entire second region not sealed by the mold member 4 in order to flatten a burr portion 6 on the bottom surface of the lead electrode generated in advance when the lead electrode is punched. Has been pressed. After copper plating as a base treatment, matte silver plating made of silver adjusted to a gloss level of D = 0.1 is 3 μm on the entire lead electrodes 2 and 3.
It is applied with a film thickness.

The lead electrodes 2 and 3 formed as described above
In _0.05 Ga _0.95 capable of emitting blue light (470 nm) as the light emitting element 1 on the bottom surface of the cup of the first lead 2 of FIG.
An LED chip 1 made of N semiconductor is die-bonded with an epoxy resin. LED chip 1 as viewed from the light emitting side
One of the electrodes and the tip of the second lead 3 are wire-bonded to each other with a gold wire having a diameter of 0.03 mm, which is the first conductive wire 5, for electrical continuity. Similarly, the first on the opposite side through the cup and recess
The distal end of the lead 2 and the other electrode of the LED chip 1 are wire-bonded to each other with a gold wire having a diameter of 0.03 mm, which is the second conductive wire 5, to achieve electrical continuity.

The tips of the lead electrodes 2 and 3 electrically connected to the LED chip 1 are placed in a casting case, filled with epoxy resin, cured at 150 ° C. for 5 hours, and the mold member 4 is viewed from the light emitting side. To form an elliptical shape.

With the above configuration, an LED lamp can be produced with a high yield. In addition, LE having excellent light emission characteristics having a light pattern close to non-directivity is provided.
A D lamp is obtained.

[Comparative Example] On the other hand, in comparison with the first embodiment, except that the burr portion 6 on the bottom surface side of the lead electrode, which is generated when the lead electrodes 2 and 3 are punched, is used without being flattened. When an LED lamp is formed and a current is supplied in the same manner as in the first embodiment, some lamps do not emit light.
Inspection of the non-lighting products that do not emit light reveals that the resin of the mold member 4 has crawled up to the soldering area of the lead electrodes 2 and 3 in all of them, and the soldering with the mounting surface is insufficient.

[Embodiment 2] When burrs of the lead electrodes 2 and 3 are crushed, only the region from the tie bar position of the second region to the end of the second region in the same direction as the first region is parallel upward from the bottom side. Is pressed to form an LED lamp similar to that of the first embodiment except that the burrs in only the above-mentioned region are flattened. The same effect as that of the first embodiment can be obtained.

Example 3 When burrs of the lead electrodes 2 and 3 were crushed, except that the lead electrodes 2 and 3 were pressed so as to sandwich the lead electrodes 2 and 3 from both sides from the bottom side and the top side in the entire second region. When the LED lamp is formed in the same manner as in the first embodiment, the same effects as in the first embodiment can be obtained.

[Embodiment 4] When the burrs of the lead electrodes 2 and 3 are crushed, only the region from the position of the tie bar 7 in the second region to the end of the second region in the same direction as the first region is viewed from the bottom surface side and the top surface. When the LED lamp is formed in the same manner as in the first embodiment except that pressing is performed so as to sandwich the lead electrodes 2 and 3 from both sides, the same effect as in the first embodiment can be obtained.

Example 5 An LED was manufactured in the same manner as in Example 1 except that the glossiness of the surfaces of the lead electrodes 2 and 3 was 0.3.
When the lamp is formed, the same effect as in the first embodiment can be obtained.

[Embodiment 6] Red (66)
0 nm), which is composed of a GaAsAsN semiconductor capable of emitting light.
The ED chip is die-bonded to the bottom surface of the cup of the lead electrode formed in the same manner as in Example 1 using an epoxy resin containing silver powder. The electrodes on the surface of the LED chip 1 and the tips of the inner leads 3 are wire-bonded by a gold wire 5 having a diameter of 0.03 mm when viewed from the side of the light-emitting side to establish electrical continuity.

An LED lamp is formed in the same manner as in the first embodiment except that a circular shell-shaped resin lens is provided as a molding member 4 at the tip of the lead electrodes 2 and 3 electrically connected to the LED chip 1. Thus, the same effect as in the first embodiment can be obtained.

Embodiment 7 As shown in FIG. 4, when an LED lamp is formed in the same manner as in Embodiment 1 except that red, blue, and green LED chips are used as the light emitting element 1, Similar effects can be obtained.

Further, in the obtained LED lamp, the directivity characteristics when each element emits light are in good agreement, and even if different elements are mounted on the same mount lead 2, the LED lamp will Good color mixing properties can be obtained. In the present embodiment, simply placing each element on the reflecting portion can easily achieve good matching of directivity over almost the entire range of a wide viewing angle.
Lamp can be designed.

[Embodiment 8] When matte plating is performed, first, a surface of the lead electrode is matted with silver having a thickness of 2 μm and matte silver plating is further applied.
When an LED lamp is formed in the same manner as in Example 1 except that a matte silver plating is applied with a film thickness of, a higher-output LED lamp is obtained.

Ninth Embodiment An LED lamp is manufactured in the same manner as in the first embodiment except that a plurality of recesses are formed by punching on the upper side of the surface of the second region of the lead electrode where burrs occur before matte plating is performed. When it is formed, it is possible to further suppress the rise of the resin.

[Embodiment 10] When an LED lamp is formed in the same manner as in Embodiment 9 except that the concave portion is provided on both the side of the second area where burrs occur and the side where sagging occurs, the resin further rises. Can be suppressed.

Example 11 Before applying the matte plating,
When the LED lamp is formed in the same manner as in the first embodiment except that a groove is provided on the upper end surface of the second region of the lead electrode, it is possible to further suppress the resin from rising.

[0063]

As described above, the LE according to the present invention is used as described above.
In the second region of the D lamp which is not sealed with the molding resin of the lead electrode, at least the soldering region is subjected to press working to crush the burrs and flatten, and then to apply silver plating whose glossiness is adjusted to matte. Thus, it is possible to obtain an LED lamp capable of realizing the spread of light with good directional characteristics with a small number of man-hours and a good yield.

In the LED lamp according to the present invention, the gloss D of the plating layer of the lead electrode is 0.05 to 0.5.
5 is preferred, and more preferably 0.1 to 0.3.
By applying such a plating layer to the surface of the lead electrode, better light spread is realized, the bonding property when the light emitting element is die-bonded on the cup is improved, and the adhesion to the mold member is improved. The property becomes good.

[Brief description of the drawings]

FIG. 1A shows an LE according to an embodiment of the present invention;
It is a schematic plan view of D lamp, (b) is A of (a).
FIG. 4 is a schematic cross-sectional view taken along line -A ′.

FIG. 2A is a schematic plan view of an LED lamp according to a sixth embodiment of the present invention, and FIG. 2B is BB ′ of FIG.
It is a typical sectional view about a line.

FIG. 3A is a schematic plan view of an LED lamp according to a seventh embodiment of the present invention, and FIG. 3B is a CC ′ of FIG.
It is a typical sectional view about a line.

FIG. 4A is an embodiment of the present invention, L
FIG. 3 is a schematic cross-sectional view of a lead electrode used for an ED lamp,
(B) is a schematic cross-sectional view taken along line DD ′ of (a).

FIG. 5 is a schematic diagram illustrating a method for measuring glossiness used in the present invention.

FIG. 6 is a schematic sectional view illustrating a conventional LED lamp.

FIG. 7 is a schematic cross-sectional view illustrating a pressing step used in the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Light emitting element 2 ... First lead 3 ... Second lead 4 ... Mold resin 5 ... Wire 6 ... Flattened burr 7 ... Tie bar 8 ... Light source 9 ... Detector 10 ... Measured object 11 ... Mold 12 ... Burr 13 ... Sag 14 ... Sag in uniform shape

Claims (8)

[Claims] 1. A lead electrode 2 comprising a first lead 2 on which a light emitting element 1 is mounted on a bottom surface of a cup provided at a tip portion, and a second lead 3 electrically connected to the light emitting element 1. An LED lamp comprising at least the light emitting element 1 and the tip portions 2 and 3 of the respective leads are sealed by a molding member 4. The lead electrodes 2 and 3 have at least a burr portion 12 flattened. An LED lamp characterized in that matte plating made of the same material is applied to the entire surfaces of the lead electrodes 2 and 3. 2. The glossiness is a glossiness D represented by the following formula:
The LED lamp according to claim 1, wherein is in the range of 0.05 to 0.5. D = log (1 / R) (where R is the reflectance in the 45-degree direction, and R = (reflected light quantity / incident light quantity)) 3. The lead electrodes 2 and 3 have a first region whose surface is covered with a mold member 4 and a second region exposed outside the mold member 4 and the second region. 3. The LED lamp according to claim 1, wherein at least the burr portion 12 is flattened. 4. The LED lamp according to claim 1, wherein the burr portion and the sag portion are flattened in the second region. 5. The film thickness of the matte plating is 2 μm to 6 μm.
5. The LE according to claim 1, wherein m is m.
D lamp. 6. The LED lamp according to claim 1, wherein the molding member is a light-transmitting sealing resin having a lens surface formed on an LED chip. 7. A lead electrode 2 comprising a first lead 2 on which a light emitting element 1 is mounted on a bottom surface of a cup provided at a tip portion, and a second lead 3 electrically connected to the light emitting element 1. , 3 in which at least the light emitting element 1 and the leading end of each lead are sealed by a mold member 4,
At least the following LED lamp manufacturing steps (A)-
(C) A method for manufacturing an LED lamp, comprising: (A) Step of forming lead electrodes 2 and 3 in which first lead 2 and second lead 3 are connected by tie bar 7 by punching a flat plate of a lead electrode material. (B) a step of pressing the projections 12 formed on the bottom surfaces of the lead electrodes 2 and 3 in a direction opposite to the punching side by the punching at least upward from the bottom surface. (C) A step of plating the entire surface of the lead electrode matlessly. 8. The glossiness is a glossiness D represented by the following formula:
Is in the range of 0.05 to 0.5, the method of manufacturing an LED lamp according to claim 7, wherein D = log (1 / R) (where R is the reflectance in the 45-degree direction, and R = (reflected light quantity / incident light quantity))