JP2001189333A - Semiconductor device and manufacturing method therefor - Google Patents
Semiconductor device and manufacturing method thereforInfo
- Publication number
- JP2001189333A JP2001189333A JP37249099A JP37249099A JP2001189333A JP 2001189333 A JP2001189333 A JP 2001189333A JP 37249099 A JP37249099 A JP 37249099A JP 37249099 A JP37249099 A JP 37249099A JP 2001189333 A JP2001189333 A JP 2001189333A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- component
- inorganic filler
- molding
- molding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000012778 molding material Substances 0.000 claims description 31
- 239000003822 epoxy resin Substances 0.000 claims description 27
- 229920000647 polyepoxide Polymers 0.000 claims description 27
- 239000011256 inorganic filler Substances 0.000 claims description 19
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 19
- 239000005011 phenolic resin Substances 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 238000001746 injection moulding Methods 0.000 claims description 7
- 238000004898 kneading Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 238000001721 transfer moulding Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- -1 amine compounds Chemical class 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- WTBFOZMTLBFIFD-UHFFFAOYSA-N C(C=C1)=CC=C1[P+](C1=CC=CC=C1)(C1=CC=CC=C1)C1=CC=CC=C1.P.P.P.P Chemical class C(C=C1)=CC=C1[P+](C1=CC=CC=C1)(C1=CC=CC=C1)C1=CC=CC=C1.P.P.P.P WTBFOZMTLBFIFD-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910001439 antimony ion Inorganic materials 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- OSCBARYHPZZEIS-UHFFFAOYSA-N phenoxyboronic acid Chemical class OB(O)OC1=CC=CC=C1 OSCBARYHPZZEIS-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】 本発明は、射出成形によ
り封止された半導体装置及びその製造方法に関するもの
である。The present invention relates to a semiconductor device sealed by injection molding and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】ＩＣ、ＬＳＩ、デイスクリート等の半導
体素子は、主にエポキシ樹脂成形材料を用いてトランス
ファー成形により封止されており、低コスト、高信頼性
及び生産性に適した方法として従来から用いられてい
る。トランスファー成形では、大部分がエポキシ樹脂成
形材料をタブレット状に賦形したものを金型内のポット
に投入し、加熱溶融させながらプランジャーで加圧し、
金型キャビテイ内に移送し、硬化させて成形するのが一
般的である。2. Description of the Related Art Semiconductor devices such as ICs, LSIs, and discretes are encapsulated mainly by transfer molding using an epoxy resin molding material, and are conventionally used as a method suitable for low cost, high reliability and productivity. Used from. In transfer molding, the majority of the epoxy resin molding material shaped into a tablet is put into a pot in a mold, and heated and melted, and pressed with a plunger.
In general, the resin is transferred into a mold cavity, cured, and molded.
【０００３】このエポキシ樹脂成形材料は、エポキシ樹
脂、フェノール樹脂、硬化促進剤、無機質充填材を必須
成分とし、各成分を所定量秤量して混合した後、混練機
で加熱溶融混練し、冷却後に粉砕しタブレット状に賦形
して製造された後、冷暗所に保管される。又使用する際
は冷暗所から取り出した後、成形材料が室温に戻るまで
常温放置するのが一般的である。しかしながら、混練機
で加熱溶融、混練、冷却、粉砕したエポキシ樹脂成形材
料をタブレット状に賦形するまで長時間を要する場合、
あるいはタブレットに賦形した後等は、成形材料の品質
を損なわないように１０℃〜−２０℃程度の冷暗所に保
管し、又タブレット状にする前に１０数時間程度の常温
戻しの処理をして賦形する。更に成形時に全量使用され
れば問題ないが成形材料が残った場合、再度冷暗所に保
管する必要がある。冷暗所保管をしないと、その保存期
間にもよるが著しく品質が劣化し、又常温戻しの処置を
せずに使用すれば温度環境差による結露が発生し吸水状
態となり、著しく品質が劣化してしまう等取り扱い上の
問題があり、これらの点から低コスト化、大量生産性、
省人化等に限界がある。This epoxy resin molding material contains an epoxy resin, a phenol resin, a curing accelerator, and an inorganic filler as essential components, weighs and mixes each component in a predetermined amount, heat-melts and kneads with a kneading machine, and after cooling, After being crushed and shaped into tablets, it is stored in a cool, dark place. When used, it is generally taken out of a cool and dark place and then left at room temperature until the molding material returns to room temperature. However, if it takes a long time to shape the epoxy resin molding material that has been heated, melted, kneaded, cooled, and pulverized with a kneader into tablets,
Alternatively, after forming into tablets, etc., store in a cool dark place at about 10 ° C to -20 ° C so as not to impair the quality of the molding material. To shape. There is no problem if the entire amount is used at the time of molding, but if the molding material remains, it must be stored again in a cool and dark place. If not stored in a cool and dark place, the quality will deteriorate significantly depending on the storage period, and if used without normal temperature restoration, condensation will occur due to differences in temperature environment and water will be absorbed, resulting in significant deterioration of quality. There are problems in handling such as these, cost reduction, mass productivity,
There is a limit to labor saving.
【０００４】一方、エポキシ樹脂と無機質充填材を混
合、加熱溶融、混練、破砕したものと、フェノール樹脂
と硬化促進剤及び無機質充填材を混合、加熱溶融、混
練、破砕した材料を再混合した状態でタブレット状に賦
形しトランスファー成形を行うと、成形物の賦形は可能
であるが、エポキシ樹脂とフェノール樹脂との硬化反応
が起こらず、成形物にひび割れ、フクレ等が発生する問
題があり、成形・硬化可能なエポキシ樹脂成形材料を得
ることが困難であった。On the other hand, an epoxy resin and an inorganic filler are mixed, heated and melted, kneaded and crushed, and a phenol resin, a curing accelerator and an inorganic filler are mixed, heated and melted, kneaded and crushed, and the material is remixed. When transfer molding is performed by shaping into a tablet shape, molding of the molded product is possible, but there is a problem that the curing reaction between the epoxy resin and the phenol resin does not occur and the molded product cracks, blisters, etc. It was difficult to obtain a moldable and curable epoxy resin molding material.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、長期常温保
存が可能な材料を用いて半導体素子をスクリューインラ
イン方式の射出ユニットを有する射出成形機により封止
してなる半導体装置及びその製造方法を提供するもので
ある。SUMMARY OF THE INVENTION The present invention relates to a semiconductor device in which a semiconductor element is sealed with an injection molding machine having a screw-in-line type injection unit using a material which can be stored at room temperature for a long time, and a method of manufacturing the same. To provide.
【０００６】[0006]
【課題を解決するための手段】本発明は、エポキシ樹
脂、フェノール樹脂、硬化促進剤、無機質充填材を必須
成分とするエポキシ樹脂成形材料であって、エポキシ樹
脂と無機質充填材を混合、加熱溶融、混練、破砕したＡ
成分と、フェノール樹脂と硬化促進剤及び残余の無機質
充填材を混合、加熱溶融、混練、破砕したＢ成分とを、
加熱成形前に混合した成形材料を用いて、半導体素子を
スクリューインライン方式の射出ユニットを有する射出
成形機により封止してなる半導体装置及びその製造方法
である。SUMMARY OF THE INVENTION The present invention relates to an epoxy resin molding material comprising an epoxy resin, a phenol resin, a curing accelerator, and an inorganic filler as essential components, wherein the epoxy resin and the inorganic filler are mixed and heated and melted. A, kneaded and crushed
The component, a phenolic resin, a curing accelerator and the remaining inorganic filler are mixed, heated and melted, kneaded, and the crushed B component,
A semiconductor device in which a semiconductor element is sealed by an injection molding machine having a screw-in-line type injection unit using a molding material mixed before heat molding, and a method of manufacturing the semiconductor device.
【０００７】以下に本発明について説明する。本発明で
用いられるエポキシ樹脂成形材料は、全成分が混合、加
熱溶融、混練、されているものではなく、エポキシ樹脂
と無機質充填材を混合、加熱溶融、混練、破砕したＡ成
分と、フェノール樹脂と硬化促進剤及び残余の無機質充
填材を混合、加熱溶融、混練、破砕したＢ成分とを別々
に製造し、加熱成形前にＡ成分とＢ成分を混合し成形材
料として用いるものである。本発明に用いられる成形材
料の形状としては、トランスファー成形で用いられるタ
ブレット状とする必要はなく、Ａ成分及びＢ成分共に粉
末又は顆粒状でならよく、その粒度としては５メッシュ
以下のものが好ましい。Ａ成分とＢ成分を混合した成形
材料としては、射出ユニットのシリンダー内での熱安定
性、金型のキャビテイ内で流動性に優れ、速やかに硬化
することが望ましい。本発明に用いられるＡ成分とＢ成
分は、トランスファー成形で一般に用いられるエポキシ
樹脂成形材料と同様の製造装置を用いて製造することが
できる。Hereinafter, the present invention will be described. The epoxy resin molding material used in the present invention is not one in which all components are mixed, heated and melted, kneaded, but mixed with an epoxy resin and an inorganic filler, heated and melted, kneaded, crushed, and a phenol resin. And a hardening accelerator and the remaining inorganic filler are mixed, heated and melted, kneaded, and crushed to separately produce a B component. The A component and the B component are mixed before heat molding and used as a molding material. The shape of the molding material used in the present invention does not need to be in the form of a tablet used in transfer molding, and both component A and component B may be in the form of powder or granules, and the particle size is preferably 5 mesh or less. . It is desirable that the molding material in which the component A and the component B are mixed has excellent thermal stability in the cylinder of the injection unit, excellent fluidity in the cavity of the mold, and is quickly cured. The component A and the component B used in the present invention can be produced using the same production apparatus as the epoxy resin molding material generally used in transfer molding.
【０００８】本発明のＡ成分は、エポキシ樹脂と無機質
充填材を所定量秤量して、例えばミキサーで混合した
後、加熱ニーダーや二軸混練機あるいは熱ロールにより
加熱溶融・混練して、続いて冷却、粉砕して製造され
る。Ｂ成分は、フェノール樹脂と硬化促進剤及び残余の
無機質充填材を所定量秤量して、同様にして製造され
る。Ａ成分、Ｂ成分共に均一分散の点から、かみあい式
の同方向回転二軸混練機を用いるのが好ましい。Ａ成分
とＢ成分は、エポキシ樹脂と硬化剤であるフェノール樹
脂が一緒に混合、加熱混練されていないので硬化反応促
進を防止するための冷暗所保管を必要とせず、成形する
前に混合機を用いてＡ成分とＢ成分を均一混合するだけ
で成形材料の準備が可能となり、トランスファー成形用
の材料で採用されていたような使用前に低温から常温に
戻す処置が不要となる特徴がある。The component A of the present invention is prepared by weighing a predetermined amount of an epoxy resin and an inorganic filler, mixing them with, for example, a mixer, and then heating and melting and kneading them with a heating kneader, a twin-screw kneader or a hot roll. It is manufactured by cooling and crushing. The B component is produced in the same manner by weighing a predetermined amount of a phenol resin, a curing accelerator, and a residual inorganic filler. From the viewpoint of uniform dispersion of both the component A and the component B, it is preferable to use a meshing type co-rotating twin-screw kneader. The A component and the B component do not require the epoxy resin and the phenol resin as a curing agent to be mixed and heated and kneaded together, so that it does not need to be kept in a cool and dark place to prevent acceleration of the curing reaction, and uses a mixer before molding. Thus, the molding material can be prepared only by uniformly mixing the component A and the component B, so that there is no need to perform a process of returning the temperature from a low temperature to a normal temperature before use as used in the material for transfer molding.
【０００９】本発明に用いられる射出ユニットとは、加
熱溶融・混練の均一化、温度コントロールの容易さ等の
点からスクリューインライン方式が好ましい。この射出
ユニット方式で用いる材料の形状としては、粉末又は顆
粒状であるのでトランスファー成形の場合のようにタブ
レット状に賦形する必要はない。本発明に用いられるＡ
成分、Ｂ成分中のエポキシ樹脂、フェノール樹脂、硬化
促進剤、無機質充填材は、半導体素子をトランスファー
成形機で封止するために用いるエポキシ成形材料に用い
られている原料と同じもので特に限定するものではな
い。エポキシ樹脂としては、１分子中に２個以上のエポ
キシ基を有するモノマー、オリゴマー、ポリマーを指
す。フェノール樹脂としては、１分子中にフェノール性
水酸基を２個以上有するモノマー、オリゴマー、ポリマ
ーを指す。硬化促進剤としては、エポキシ基とフェノー
ル性水酸基と反応を促進するもので、１，８−ジアザビ
シクロ（５，４，０）ウンデセン−７等のアミン系化合
物、トリフェニルホスフィン、テトラフェニルホスホニ
ウム・テトラフェニルボレート塩等のリン化合物、２−
メチルイミダゾールのイミダゾール化合物等が挙げられ
る。無機質充填材としては、溶融シリカ、結晶シリカ、
アルミナ、窒化珪素、窒化アルミニウム等が挙げられ
る。本発明に用いられる成形材料は、エポキシ樹脂、フ
ェノール樹脂、硬化促進剤、無機質充填材を必須成分と
するが、必要によってトランスファー成形用材料に用い
られている臭素化エポキシ樹脂、酸化アンチモン、イオ
ン捕捉剤、カーボンブラック、離型剤、低応力剤、シラ
ンカップリング剤等をＡ成分、又はＢ成分中に適宜含ん
でいてもよい。The injection unit used in the present invention is preferably a screw-in-line type from the viewpoint of uniformity of heat melting / kneading and easy temperature control. Since the shape of the material used in the injection unit method is powder or granule, it is not necessary to shape it into a tablet as in the case of transfer molding. A used in the present invention
The epoxy resin, the phenol resin, the curing accelerator, and the inorganic filler in the component and the component B are the same as the raw materials used for the epoxy molding material used for sealing the semiconductor element with the transfer molding machine, and are particularly limited. Not something. The epoxy resin refers to a monomer, oligomer, or polymer having two or more epoxy groups in one molecule. A phenol resin refers to a monomer, oligomer, or polymer having two or more phenolic hydroxyl groups in one molecule. The curing accelerator promotes the reaction between the epoxy group and the phenolic hydroxyl group, and includes amine compounds such as 1,8-diazabicyclo (5,4,0) undecene-7, triphenylphosphine, tetraphenylphosphonium tetra Phosphorus compounds such as phenylborate salts, 2-
Examples include an imidazole compound of methyl imidazole. As the inorganic filler, fused silica, crystalline silica,
Examples include alumina, silicon nitride, and aluminum nitride. The molding material used in the present invention contains an epoxy resin, a phenol resin, a hardening accelerator, and an inorganic filler as essential components. If necessary, a brominated epoxy resin, antimony oxide, and ion trapping material used in a transfer molding material are used. A component, a carbon black, a release agent, a low stress agent, a silane coupling agent, and the like may be appropriately contained in the component A or the component B.
【００１０】[0010]
【実施例】以下、本発明を実施例で説明する。配合量の
部は重量部を表す。 実施例１ Ａ成分 オルソクレゾールノボラック型エポキシ樹脂（エポキシ当量２００）１５０部 溶融シリカ（平均粒径２３μｍ） ４８０部 γ−グリシドキシプロピルトリメトキシシラン ３部 離形剤 ４部 着色剤、低応力等の添加剤 ２９部 上記各原料をかみ合い式同方向二軸混練機にて加熱溶
融、混練、粉砕しＡ成分を得た。 Ｂ成分 フェノールノボラック樹脂（水酸基当量１０４） ７３部 溶融シリカ（平均粒径２３μｍ） ２４０部 テトラフェニルホスフォニウム・テトラフェニルボレート ２部 γ−グリシドキシプロピルトリメトキシシラン ２部 離形剤 ３部 着色剤、低応力等の添加剤 １４部 上記各原料をかみ合い式同方向二軸混練機にて加熱溶
融、混練、粉砕しＢ成分を得た。Ａ成分とＢ成分を成形
前に混合して成形材料化し常温保管性を測定した。又混
合して成形材料化し、スクリューインライン方式を有す
る射出ユニットでの加熱溶融・混練を行い流動性、硬化
性、曲げ強度の物性を評価した。更に６４ｐＱＦＰの２
フレーム取り金型でスクリューインライン方式を有する
全自動射出成形システムにて、生産直後のＡ成分とＢ成
分を混合し実成形を行い成形性の評価をした。これらの
評価結果を表１に示す。The present invention will be described below with reference to examples. The parts by weight indicate parts by weight. Example 1 Component A Orthocresol novolak type epoxy resin (epoxy equivalent 200) 150 parts Fused silica (average particle size 23 μm) 480 parts γ-glycidoxypropyltrimethoxysilane 3 parts Release agent 4 parts Colorant, low stress, etc. 29 parts of the above additive were heated and melted, kneaded and pulverized with an interlocking coaxial biaxial kneader to obtain an A component. Component B Phenol novolak resin (hydroxyl equivalent 104) 73 parts Fused silica (average particle size 23 μm) 240 parts Tetraphenylphosphonium / tetraphenylborate 2 parts γ-glycidoxypropyltrimethoxysilane 2 parts Release agent 3 parts Coloring And 14 parts of additives such as low stress, etc. The above materials were heated and melted, kneaded and pulverized by an intermeshing type biaxial kneader to obtain a B component. The components A and B were mixed before molding to form a molding material, and the room temperature storage property was measured. Further, they were mixed to form a molding material, and were heated and melted and kneaded in an injection unit having a screw in-line system to evaluate physical properties such as fluidity, curability and bending strength. 64pQFP 2
In a fully automatic injection molding system having a screw in-line system with a frame forming die, the A component and the B component immediately after production were mixed and subjected to actual molding to evaluate moldability. Table 1 shows the results of these evaluations.
【００１１】評価方法 常温保管性：温度１７５℃の金型に、Ａ成分とＢ成分と
を混合した成形材料を７０ｋｇｆ／ｃｍ2の圧力でプラ
ンジャーで注入し、２分間硬化させた時のスパイラルフ
ローの初期値を分母とし、２５℃で保管された成形材料
の経過日数後のスパイラルフローの値を分子とし百分率
で表した。実施例１では、Ａ成分、Ｂ成分を別々に保管
しておき測定の前に混合して評価した。 硬化性：混合した成形材料６ｇをφ３５のタブレット状
に賦形し、このタブレットを用いて（株）オリエンテッ
ク・製のキュラストメーターＶＰＳで金型温度を１７５
℃に保ちトルクの立ち上がりで硬化性を測定した。 曲げ強度：成形材料をＪＩＳ Ｋ ６９１１に準じて試
験片を作成し、（株）オリエンテック・製のテンシロン
材料試験機を用いて２５℃の雰囲気中で測定した。 成形性：充填性と成形品の外観を目視で観察した。 比較例１、２ 比較例１は、表１の配合に従いトランスファー成形用成
形材料と同じ方法で製造し、実施例１と同様に評価し
た。常温保管性は常温放置して評価した。又生産直後の
材料をトランスファー成形した。比較例２は、Ａ成分と
Ｂ成分を混合したものを常温放置して常温保管性を評価
した。生産直後のＡ成分とＢ成分を混合したものをトラ
ンスファー成形した。評価結果を表１に示す。Evaluation method Room temperature storage: Spiral when a molding material obtained by mixing component A and component B is injected into a mold at a temperature of 175 ° C. with a plunger at a pressure of 70 kgf / cm 2 and cured for 2 minutes. The initial value of the flow was used as the denominator, and the value of the spiral flow of the molding material stored at 25 ° C. after the number of days elapsed was expressed as a percentage using the numerator as the numerator. In Example 1, the A component and the B component were separately stored, mixed and evaluated before measurement. Curability: 6 g of the mixed molding material is shaped into a tablet having a diameter of 35 mm, and using the tablet, the mold temperature is set to 175 with a Curastometer VPS manufactured by Orientec Co., Ltd.
C. and the curability was measured at the rise of the torque. Flexural strength: A test piece was prepared from a molding material in accordance with JIS K 6911 and measured in a 25 ° C. atmosphere using a Tensilon material testing machine manufactured by Orientec. Moldability: The filling property and the appearance of the molded article were visually observed. Comparative Examples 1 and 2 Comparative Example 1 was manufactured in the same manner as in the molding material for transfer molding according to the composition shown in Table 1, and evaluated in the same manner as in Example 1. The room temperature storage property was evaluated by standing at room temperature. The material immediately after production was transfer molded. In Comparative Example 2, a mixture of the component A and the component B was allowed to stand at room temperature, and the room temperature storage property was evaluated. A mixture of the component A and the component B immediately after production was subjected to transfer molding. Table 1 shows the evaluation results.
【００１２】[0012]
【表１】 [Table 1]
【００１３】[0013]
【発明の効果】本発明によれば、長期常温保存性に優れ
た成形材料を用いて射出成形機することにより、硬化
性、曲げ強度、かつ充填性、外観に優れた半導体装置を
得ることができる。According to the present invention, a semiconductor device having excellent curability, bending strength, filling property and appearance can be obtained by performing an injection molding machine using a molding material excellent in long-term room temperature storage stability. it can.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｂ２９Ｋ 63:00 Ｂ２９Ｋ 105:20 105:16 Ｂ２９Ｌ 31:34 105:20 Ｈ０１Ｌ 23/30 Ｒ Ｂ２９Ｌ 31:34 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) B29K 63:00 B29K 105: 20 105: 16 B29L 31:34 105: 20 H01L 23/30 R B29L 31:34
Claims (2)
進剤、無機質充填材を必須成分とするエポキシ樹脂成形
材料であって、エポキシ樹脂と無機質充填材を混合、加
熱溶融、混練、破砕したＡ成分と、フェノール樹脂と硬
化促進剤及び残余の無機質充填材を混合、加熱溶融、混
練、破砕したＢ成分とを、加熱成形前に混合した成形材
料を用いて、半導体素子をスクリューインライン方式の
射出ユニットを有する射出成形機により封止してなるこ
とを特徴とする半導体装置。An epoxy resin molding material comprising an epoxy resin, a phenol resin, a curing accelerator, and an inorganic filler as essential components, wherein the epoxy resin and the inorganic filler are mixed, heated and melted, kneaded, and crushed. Using a molding material obtained by mixing a phenolic resin, a curing accelerator and the remaining inorganic filler, heating and melting, kneading, and crushed B components before heat molding, a screw-in-line injection unit for a semiconductor element is formed. A semiconductor device characterized by being sealed by an injection molding machine.
進剤、無機質充填材を必須成分とするエポキシ樹脂成形
材料であって、エポキシ樹脂と無機質充填材を混合、加
熱溶融、混練、破砕したＡ成分と、フェノール樹脂と硬
化促進剤及び残余の無機質充填材を混合、加熱溶融、混
練、破砕したＢ成分とを、加熱成形前に混合した成形材
料を用いて、半導体素子をスクリューインライン方式の
射出ユニットを有する射出成形機により封止してなるこ
とを特徴とする半導体装置の製造方法。2. An epoxy resin molding material comprising an epoxy resin, a phenolic resin, a curing accelerator, and an inorganic filler as essential components, wherein the epoxy resin and the inorganic filler are mixed, heated and melted, kneaded, and crushed. Using a molding material obtained by mixing a phenolic resin, a curing accelerator and the remaining inorganic filler, heating and melting, kneading, and crushed B components before heat molding, a screw-in-line injection unit for a semiconductor element is formed. A method for manufacturing a semiconductor device, wherein the semiconductor device is sealed by an injection molding machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37249099A JP2001189333A (en) | 1999-12-28 | 1999-12-28 | Semiconductor device and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37249099A JP2001189333A (en) | 1999-12-28 | 1999-12-28 | Semiconductor device and manufacturing method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001189333A true JP2001189333A (en) | 2001-07-10 |
Family
ID=18500533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP37249099A Pending JP2001189333A (en) | 1999-12-28 | 1999-12-28 | Semiconductor device and manufacturing method therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001189333A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012029762A1 (en) * | 2010-09-02 | 2012-03-08 | 住友ベークライト株式会社 | Resin molded product and process for producing same, resin composition and process for producing same, and electronic component device |
| JP2013001893A (en) * | 2011-06-21 | 2013-01-07 | Sumitomo Bakelite Co Ltd | Production method of resin raw powder, resin raw powder, resin molded article and electronic component device |
-
1999
- 1999-12-28 JP JP37249099A patent/JP2001189333A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012029762A1 (en) * | 2010-09-02 | 2012-03-08 | 住友ベークライト株式会社 | Resin molded product and process for producing same, resin composition and process for producing same, and electronic component device |
| JP2012072379A (en) * | 2010-09-02 | 2012-04-12 | Sumitomo Bakelite Co Ltd | Resin molded product and process for producing the same, resin composition and process for producing the same, and electronic component device |
| US8957532B2 (en) | 2010-09-02 | 2015-02-17 | Sumitomo Bakelite Company Limited | Resin compact, method for producing resin compact, resin composition, method for producing resin composition and electronic component device |
| JP2013001893A (en) * | 2011-06-21 | 2013-01-07 | Sumitomo Bakelite Co Ltd | Production method of resin raw powder, resin raw powder, resin molded article and electronic component device |
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