JP2001144249A - Composite semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To connect a control terminal with a control circuit substrate, without making any soldering operation at all. SOLUTION: A control terminal stand 16 is formed in the part of a side wall of an insulation resin case 2, and an insert mold is performed, so as to expose an upper end part 4b and a lower end part 4a to this control terminal stand 16, and a control circuit substrate 7 is engaged with a pedestal 13 provided at a top end part of the control terminal stand 16 by spring action, whereby the conductor part of the control circuit substrate 7 is brought into pressure contact with the upper end part of the control terminal 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to a composite semiconductor device, and more particularly to a composite semiconductor device having an improved connection structure between a control terminal drawn out of a semiconductor element inside the control terminal and a control circuit board.

[0002]

2. Description of the Related Art An example of the structure of a composite semiconductor device of this kind is shown in FIG.
11 to FIG. 9 is a plan view showing a schematic structure of the composite semiconductor device with the control circuit board removed, FIG. 10 is a sectional view taken along the line CC of FIG. 9, and FIG. 11 is a state with the control circuit board attached. It is a front view of a composite semiconductor device.

In these figures, a composite semiconductor device 1 includes an insulating resin case 2 having openings at both ends, and a heat sink 3 so as to close one opening end of the insulating resin case 2. An electric circuit board (not shown) is fixed on the heat radiating plate 3, and for example, IGBT, M
Semiconductor elements such as OS FETs, thyristors, and transistors are mounted alone or as modules.

A control terminal 4 is insert-molded in the side wall of the insulating resin case 2, an upper end of the terminal 4 is exposed from the upper part of the insulating resin case 2 to the outside, and a lower end of the terminal is located inside the insulating resin case. It is exposed (not shown). The exposed end of the lower end of the control terminal 4 and the semiconductor element are connected by a bonding wire (not shown).

A main terminal 5 is insert-molded in the side wall of the insulating resin case 2 like the control terminal 4. The upper and lower ends of the main terminal 5 are also exposed to the outside similarly to the control terminal 4, and the lower end is connected to the conductor pattern of the electric circuit board by bonding wires (not shown).

[0006] At the four corners of the upper surface of the insulating resin case 2, there are provided cylindrical screw fixing stands 6, and the control circuit board 7 is screwed to the screw fixing stands 6.

That is, as shown in FIG. 11, one end of the control terminal 4 is inserted into a through hole (not shown) of the control circuit board 7, and a conductor pattern formed on the upper or lower surface of the control circuit board 7 and the solder fixing 8. At the same time, the control circuit board 7 is screwed to the screw base 6 with screws 9.

An external conductor bar 10 is attached to the upper surface of the main terminal 5 in advance, and is pulled out horizontally from a gap 11 formed between the upper surface of the insulating resin case 2 and the lower surface of the control circuit board 7. It has become.

[0009]

Since the conventional composite semiconductor device 1 has the above-described structure, there are the following problems to be solved. Since the control terminal 4 and the control circuit board 7 are connected by soldering, the reliability of the composite semiconductor device itself is difficult due to the influence of flux and the like, poor connection, and the like. Assembly work such as soldering work is complicated and takes a lot of time,
It was difficult to reduce the manufacturing cost. The present invention has been made to solve the above problems, eliminates any soldering work, can maintain high reliability,
It is another object of the present invention to provide a composite semiconductor device capable of reducing the manufacturing cost.

[0010]

According to a first aspect of the present invention, an electric circuit board is mounted on a heat sink so as to close one opening of an insulating resin case, and the circuit board is mounted on the heat sink. In a composite semiconductor device in which a circuit is formed by mounting electronic components such as semiconductor elements on a conductor pattern of a substrate, and a main terminal and a control terminal are drawn out of the circuit, a lower end of the control terminal is provided on the insulating resin case. A conductor of a control circuit board, which is insert-molded so that a part thereof is exposed from a lower end of the side wall, and an upper end of the control terminal is exposed above the insulating resin case and is arranged at a predetermined distance from the heat sink. The portion is brought into pressure contact with the portion via an elastic means.

A second invention is characterized in that the elastic means is a spring portion formed integrally with the control terminal.

A third invention is characterized in that the spring portion is a spring portion formed in a bellows shape.

According to a fourth aspect of the present invention, the control terminal spring is a spring formed in a coil shape.

According to a fifth aspect of the present invention, a part of a side wall of the insulating resin case receives and fixes the control circuit board, a pedestal part, an accommodation part for accommodating an upper end part of the control terminal, And a control terminal block comprising a control terminal molding portion for insert-molding a lower end portion of the terminal.

According to a sixth aspect of the present invention, the control circuit board mounted on the pedestal portion of the control terminal board is provided at a predetermined position on the control circuit board via the distal end of the control terminal and the elastic means. It comes into contact with and is pressed and fixed from above by a spring stopper inserted into the upper surface of the pedestal portion.

According to a seventh aspect of the present invention, the storage portion for storing the upper end portion of the control terminal comprises a two-part main body terminal block having complementary shapes and an auxiliary plate portion combined with the main body. It is characterized by the following.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a composite semiconductor device of the present invention with a control circuit board removed, and FIG. 2 is a cross-sectional view taken along line AA of FIG. In the present invention, in order to eliminate the soldering of the control terminal and the control circuit board drawn out to the outside via the surface electrode of the semiconductor element and the bonding wire, the control circuit board uses a spring action on the pedestal portion of the control terminal block. The control terminals and the conductors of the control circuit board are brought into pressure contact with each other when fixed.

Hereinafter, embodiments of the present invention will be described in detail. The composite semiconductor device 1 of the present invention is fixed on the heat sink 3 so that one opening of the insulating resin case 2 is closed as in the conventional case. An electric circuit board (not shown) is mounted on the radiator plate 1, and electronic components such as semiconductor elements are fixed on the conductor pattern to form a circuit, and the main terminal 5 is formed from the circuit via a bonding wire. And the control terminal 4 is drawn out.

The control terminal 4 is connected to the insulating resin case 2
The control terminal 4 is insert-molded so that the lower end 4a of the control terminal 4 is exposed from the lower end of the side wall, and the upper end 4b of the control terminal 4 is exposed from the upper end of the side wall of the insulating resin case 2.

The main terminal 5 is also similar to the control terminal 4,
Insert molding is performed on the side wall of the insulating resin case 2 so that both ends are exposed. That is, insert molding is performed so that the lower end 5a of the main terminal 5 is exposed from the lower end of the side wall of the insulating resin case 2 and the upper end 5b of the main terminal 5 is exposed from the upper end of the side wall of the insulating resin case 2. Have been. A cap nut 12 is housed directly below the upper end 5b, and the cap nut 12 is bent at a right angle to prevent the cap nut 12 from coming off.

In the above embodiment, the main terminal 5 is insert-molded on the side wall of the insulating resin case 2. However, the main terminal 5 does not necessarily have to be insert-molded, but may be directly drawn from the conductor pattern.

The upper end 4b of the control terminal 4 is connected to a conductor (not shown) of the control circuit board 7 which is disposed above the insulating resin case 2 with a predetermined distance 11 from the heat radiating plate 3. Pressure contact is made through the means.

That is, as shown in FIG. 3, a control terminal block 16 is formed on a part of the side wall of the insulating resin case 2.
The control terminal block 16 includes a pedestal section 13 for receiving and fixing the control circuit board 7 and an upper end section 4 of the control terminal 4.
b, and a lower end 4 of the control terminal 4
a control terminal molding portion 15 that is insert-molded so that a is exposed.

In the storage section 14 of the control terminal block 16,
The upper end 4b of the control terminal 4 is housed.
It is an elastic means, that is, a bellows-like spring 17 or a coil spring (not shown) in this embodiment.

The elastic means may be a coil spring or the like made of a material different from the control terminal 4 and may be stored in the storage section 14.

The exposed end of the control terminal 4 in which the upper end 4b is accommodated in the accommodating portion 14 of the control terminal block 16 and the lower end 4a is insert-molded, as shown in FIG. The surface electrodes of the semiconductor chip 19 mounted and fixed on the electric circuit board 18 are connected by bonding wires 20. In addition, since it is difficult to integrally form the accommodating portion 14 for accommodating the bellows-like spring 17 as elastic means integrated with the upper end portion 4b by resin molding, the accommodating portion 14 is divided into two parts and the auxiliary plate portion 22 is combined. I have to. FIG. 4 is a view of the control terminal block 16 as viewed from above, and the same parts as those in FIG. 3 are denoted by the same reference numerals.

Next, a procedure for connecting the control terminal 4 to the control circuit board 7 in a so-called solderless manner will be described with reference to FIGS. FIG. 5 is a partial cross-sectional view showing the locked state between the control circuit board and the control terminal block. FIG. Although illustration is omitted on the lower surface side of the control circuit board 7,
A predetermined conductor pattern is formed, and various electric circuit components such as a resistor and a capacitor are mounted and fixed.

With the surface of the control circuit board 7 on which the conductor pattern is formed facing downward, the end of the circuit board 7 is slid along the inclined head 13 a of the pedestal 13.
It is inserted and fixed using the spring action of the pedestal 13.

By doing so, the control terminal block 1
Since the tip of the control terminal 4 is exposed to the outside from the upper end of the housing 14 of the control circuit board 6, the control circuit board 7 presses the exposed end downward against the spring force of the bellows-like spring 17, and The conductor of the control circuit board 7 and the control terminal 4 are electrically contacted under pressure by so-called solderless.

Finally, a screw 9 is provided on the screw fixing table 6 provided on the peripheral edge of the side wall of the insulating resin case 2 from the upper surface side of the control circuit board 7.
To secure the circuit board 7. In addition,
Before attaching the control circuit board 7 to the control terminal block 16, the external conductor bar 10 drawn out in the horizontal direction of the composite semiconductor device 1 is fixed to the main terminal 5 as shown in FIGS. 6 and 7. .

With the above configuration, the control terminals 4 and the conductors of the control circuit board 7 can be electrically connected without soldering, the adverse effects associated with the soldering work can be avoided, and high reliability and high reliability can be achieved. By reducing the number of assembling steps, a composite semiconductor device having a low manufacturing cost can be obtained.

Next, another embodiment of the control terminal block will be described with reference to FIG. The control terminal block 116 of this embodiment includes:
As in the previous embodiment, the main body 21 has a two-part structure and an auxiliary plate 22 and are complementary to each other. However, as in the previous embodiment, a pedestal (see FIG. 3) is provided on the head. I do not have.

As described above, the lower portions of the plurality (three in the figure) of the control terminals 4 are insert-molded in the step portion 23 of the main body portion 21. Further, the main body 21 has bottomed holes 24a, 24b, 24c.

On the other hand, corresponding to the bottomed holes 24a, 24b, 24c, a projection 25a,
25b, 25c are provided, and the projections 25a, 25b,
By fitting 25c into the bottomed holes 24a, 24b, 24c, a control terminal block 116 is formed in which the main body 21 and the auxiliary plate 22 are integrated.

A concave portion 26 is formed in the auxiliary plate portion 22, and when the auxiliary plate portion 22 is combined with the main body portion 21, the concave portion 26 is formed on an upper portion of the control terminal 4. It becomes a storage part 14 of a bellows-like spring 17 as a means.

At the upper end of the main body 21, there is provided a bottomed hole 29 into which the leg 28 of the spring stopper 27 is inserted and fixed. Next, the procedure for locking the control circuit board 7 to the control terminal block 116 will be described. First, the upper end of the control terminal 4 is pressed slightly downward so that the terminal block 116 is pressed.
The control terminal block 116 is placed on the upper end of the. Next, in this state, by inserting and fixing the spring stopper 27 into the bottomed hole 29, the conductor (not shown) formed on the lower surface side of the circuit board 7 and the upper end surface of the control terminal 4 are pressed against each other.

The upper end of the control terminal 4 may be bent in a U-shape to make the contact with the conductor circuit of the control circuit board 7 smooth. As described above, the electrical connection between the control terminal 4 and the control circuit board 7 is made in a simple procedure in a solderless manner and in a pressurized contact state as in the above embodiment.

The number of the control terminal blocks 16 and 116 in the above two embodiments is not particularly limited, and any one may be applied as long as it is provided at a plurality of locations on the side wall of the insulating resin case 2. be able to.

[0039]

The present invention is configured as described above.
The control terminal and the control circuit board can be connected by a simple procedure without soldering, and a highly reliable composite semiconductor device can be obtained at a low cost with a reduced number of assembly steps.

[Brief description of the drawings]

FIG. 1 is a plan view of a composite semiconductor device of the present invention with a control circuit board removed.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a partial cross-sectional view illustrating an example of a control terminal block.

FIG. 4 is a partial plan view of the control terminal block.

FIG. 5 is a partial cross-sectional view showing a state where a control circuit board is mounted on the control terminal block.

FIG. 6 is a plan view showing the entire composite semiconductor device of the present invention.

FIG. 7 is a sectional view taken along the line BB in FIG. 6;

FIG. 8 is a perspective view showing another embodiment of the control terminal block.

FIG. 9 is a plan view showing a schematic structure of a conventional composite semiconductor device with a control circuit board removed.

FIG. 10 is a sectional view taken along line CC of FIG. 9;

FIG. 11 is a front view showing a part of a conventional composite semiconductor device with a control circuit board attached.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Composite semiconductor device 2 Insulating resin case 3 Heat sink 4 Control terminal 5 Main terminal 6 Screw stop 7 Control circuit board 8 Soldering 9 Screw 10 External conductor bar 11 Gap 12 Cap nut 13 Base 13a Inclined head 14 Storage part 15 Control terminal mold section 16, 116 Control terminal block 17 Bellows-like spring 18 Electric circuit board 19 Semiconductor chip 20 Bonding wire 21 Main body section 22 Auxiliary plate section 23 Step section 24a, 24b, 24c Bottom hole 25a, 25b, 25c Projection section 26 Recessed part 27 Spring stopper 28 Leg 29 Hole with bottom

Claims (7)

[Claims] 1. An electric circuit board is mounted on a heat sink so as to close one opening of an insulating resin case, and an electric circuit board is mounted on the heat sink. In a composite semiconductor device having a structure in which an electronic component is mounted and a circuit is formed, and a main terminal and a control terminal are led out of the circuit, a lower end of the control terminal is partially exposed from a lower end of a side wall of the insulating resin case. The upper end of the control terminal is exposed above the insulating resin case, and press-contacts via a resilient means the conductor of the control circuit board disposed at a predetermined distance from the heat sink. A composite semiconductor device comprising: 2. The composite semiconductor device according to claim 1, wherein said elastic means is a spring formed integrally with said control terminal. 3. The composite semiconductor device according to claim 2, wherein said spring portion is a spring portion formed in a bellows shape. 4. The composite semiconductor device according to claim 1, wherein said elastic means is a coil spring formed of a material different from said control terminal. 5. A part of a side wall of the insulating resin case for receiving and fixing the control circuit board, a base for storing an upper end of the control terminal, and a lower end of the control terminal. 2. The composite semiconductor device according to claim 1, wherein the composite semiconductor device is configured as a control terminal block including a control terminal mold portion for insert-molding the semiconductor device. 3. 6. The control circuit board mounted on a pedestal portion of the control terminal board contacts a tip end of the control terminal at a predetermined position of the control circuit board via the elastic means, The composite semiconductor device according to claim 4, wherein the composite semiconductor device is pressed and fixed from above by a spring stopper inserted into an upper surface of the pedestal portion. 7. A storage portion for storing an upper end portion of the control terminal, comprising a main body portion having a two-part configuration complementary to each other and an auxiliary plate portion combined with the main body portion. Item 5. The composite semiconductor device according to item 4.