JP2001019833A - Epoxy resin composition and semiconductor device - Google Patents

Abstract

(57) [Problem] To provide an epoxy resin composition capable of significantly reducing secondary carbon black aggregates. An epoxy resin composition comprising an epoxy resin, a phenol resin, an inorganic filler, a curing accelerator, and carbon black having an average particle size of not more than 45 μm and not more than 500 ppm and a maximum particle size of not more than 500 μm. An epoxy resin composition for encapsulating a semiconductor, comprising 0.1 to 1.0% by weight of the carbon black in all epoxy resin compositions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation for preventing leakage and conductivity between inner leads and between wires inside a semiconductor device, and a semiconductor device using the same. It is.

[0002]

2. Description of the Related Art Conventionally, carbon black has been used in epoxy resin compositions for encapsulating semiconductor devices. However, the main purpose is to color the molded product after curing, and the type and amount of carbon black are appropriately determined and blended according to the required color of the molded product. Although the average particle size of the carbon black as a colorant is as small as 10 to 100 nm, it does not exist as a single substance, and a certain number of carbon blacks are present in agglomerated form. ,
Although varying depending on the brand, a range of about 0.1 μm to a maximum of about 5 mm is mixed and varies.

On the other hand, as a method for producing an epoxy resin composition for semiconductor encapsulation, each component such as an epoxy resin, a phenol resin, a curing accelerator, an inorganic filler, carbon black, a silane coupling agent, and silicone oil is usually mixed. After dry-mixing, etc., the mixture is melt-kneaded with a mixing roll, a co-kneader, etc., but in the obtained epoxy resin composition, agglomeration of secondary generated carbon black having a larger particle size than the used carbon black In recent years, with the fine pitch of semiconductor devices, gaps between inner leads and wires have been rapidly narrowed, and aggregates of carbon black have entered these gaps, resulting in leakage and conductivity. Problems due to carbon black agglomerates that can respond to fine pitch A resin composition is required.

[0004]

DISCLOSURE OF THE INVENTION The present invention focuses on the size and amount of carbon black agglomerates that have an adverse effect on insulation reliability, and as a result of intensive studies, as a result, the secondary The inventors have found that carbon black agglomerates generated can be significantly reduced, and have completed the present invention.

[0005]

The present invention provides (A) an epoxy resin, (B) a phenolic resin, (C) an inorganic filler,
(D) curing accelerator, and (E) 45 μm or more is 500p
1. An epoxy resin composition containing carbon black having an average particle size of not more than pm and a maximum particle size of not more than 500 μm, wherein said epoxy resin composition contains 0.1 to 1.0% by weight of said carbon black in all epoxy resin compositions. An epoxy resin composition for semiconductor encapsulation and a semiconductor device obtained by encapsulating a semiconductor element with the epoxy resin composition.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The epoxy resin used in the present invention is:
It is not particularly limited as long as it is a monomer, oligomer, or polymer having two or more epoxy groups in one molecule. For example, bisphenol type epoxy resin, biphenyl type epoxy resin, phenol novolak type epoxy resin, orthocresol novolak type epoxy resin, naphthalene type epoxy resin, triphenolmethane type epoxy resin, dicyclopentadiene modified phenol type epoxy resin, epoxy containing triazine nucleus Resins. In order to improve the moisture resistance of the resin composition, it is desirable that impurity ions such as Cl ions and Na ions are as small as possible, and the epoxy equivalent is preferably 150 to 300 g / eq from the viewpoint of curability.

The phenolic resin used in the present invention is a monomer having two or more phenolic hydroxyl groups in one molecule,
It is not particularly limited as long as it is an oligomer or a polymer. For example, phenol novolak resin, cresol novolak resin, dicyclopentadiene-modified phenol resin, phenol aralkyl resin, terpene-modified phenol resin and the like can be mentioned. From the viewpoint of curability, the hydroxyl equivalent is preferably from 80 to 250 g / eq. Examples of the inorganic filler used in the present invention include fused silica, crystalline silica, and alumina. As the compounding amount of the inorganic filler,
From the balance of moldability and reliability, 60 to 92% by weight of the total epoxy resin composition is preferable. The curing accelerator used in the present invention may be any one that promotes the reaction between an epoxy group and a hydroxyl group, and those generally used for a sealing material can be used. For example, 1,8-diazabicyclo (5,4,0) undecene-7, triphenylphosphine, benzyldimethylamine, 2-methylimidazole and the like can be mentioned.

The carbon black used in the present invention is 45
μm or more is 500 ppm or less and the maximum particle size is 5
00 μm or less, 0.1 to 0.1 in the total epoxy resin composition
It contains 1.0% by weight. 50 for 45 μm or more
If the maximum particle size exceeds 0 ppm or even if it is less than 500 ppm and the maximum particle size exceeds 500 μm, even if the compounding amount of carbon black in the total epoxy resin composition is 0.1% by weight, the insulation reliability such as leak failure and conduction failure is reduced. Problems arise.
On the other hand, if the amount of carbon black exceeds 1.0% by weight in the total ethoxy resin composition, the probability of occurrence of secondary agglomerates increases, and there is a problem in insulation reliability such as leakage failure and conduction failure. For the particle size of carbon black of 45 μm or more used in the present invention, about 50 g of carbon black is accurately weighed using a Tyler standard sieve 325 mesh (mesh size 45 μm), sieved while washing with water, dried, and the sieved residue is removed. Minutes. The maximum particle size was measured by microscopic observation with the maximum value in the long side direction as the maximum particle size because the shape was irregular. The shape and the like of the carbon black used in the present invention are not particularly limited as long as the carbon black has the above-mentioned properties, but powder is preferable in order to be uniformly dispersed in the resin composition. Further, even if these particles are granulated, there is no particular problem as long as they are easily loosened. By using carbon black having the above characteristics, carbon black agglomerates that are secondarily generated during the production of the resin composition can be significantly reduced, so that the insulation reliability inside the semiconductor device sealed with this resin composition is reduced. Can be improved.

In the present invention, the components (A) to (E) are essential, but if necessary, a silane coupling agent, a flame retardant, a flame retardant auxiliary, a release agent, and a silicone or synthetic rubber Various additives such as a system low stress agent may be appropriately compounded. In order to produce the epoxy resin composition of the present invention, the components (A) to (E) and other additives are mixed by a mixer, melt-kneaded by a hot roll or a kneader, cooled, and ground. It can be a sealing material. In order to manufacture a semiconductor device by encapsulating a semiconductor element using the resin composition of the present invention, a semiconductor device may be cured by a molding method such as transfer molding, compression molding, or injection molding.

[0010]

The present invention will be specifically described below with reference to examples. Example 1 Orthocresol novolak type epoxy resin (softening point 62 ° C, epoxy equivalent 200) 150 parts by weight Phenol novolak resin (softening point 95 ° C, hydroxyl equivalent 100) 80 parts by weight Brominated epoxy resin (bromine content 49% by weight) , Softening point 70 ° C) 20 parts by weight Fused silica powder 700 parts by weight Antimony trioxide 10 parts by weight Carnauba wax 5 parts by weight Silicone oil 5 parts by weight Silane coupling agent 3 parts by weight 1,8-diazabicyclo (5,4,0) Undecene-7 (hereinafter referred to as DBU) 3 parts by weight Carbon black A (45 μm or more, 200 ppm; maximum particle size 140 μm) 4 parts by weight were mixed at room temperature with a mixer, and kneaded at 80 to 110 ° C. with a biaxial kneader. After cooling, it was pulverized to obtain a molding material. Table 1 shows the evaluation results.

Evaluation method Carbon black agglomerate: The obtained molding material is tableted, and is subjected to low pressure transfer molding at 175 ° C. at 7 ° C.
Molded under the conditions of 0 kg / cm ² and 120 seconds, 100φ
(Thickness: 2 mm) was obtained. The number of aggregates of carbon black on the surface of the obtained molded article polished from the surface by 0.2 to 0.3 mm with a water-resistant abrasive paper having a particle size (GRIT No. 180) is counted. The number of molded products is 10. Molded product 10
Observation of 50 to 100 μm aggregates total 3 or more,
One or more aggregates exceeding 100 μm were judged to be defective. Appearance color: The appearance of the molded article was visually inspected, and a patchy one and a gray one were judged to be defective.

Examples 2 to 5 Compounded according to the formulation shown in Table 1, a molding material was obtained in the same manner as in Example 1, and evaluated similarly. Table 1 shows the evaluation results. Comparative Examples 1 to 4 The components were blended according to the formulation shown in Table 2, and a molding material was obtained in the same manner as in Example 1 and evaluated in the same manner. Table 2 shows the evaluation results. Table 3 shows the properties of the carbon blacks used in the examples and comparative examples. The properties of the epoxy resin and phenol resin used in other than Example 1 are as follows. Biphenyl type epoxy resin (melting point: 106 ° C., epoxy equivalent: 195),
Dicyclopentadiene-modified phenolic epoxy resin (hereinafter referred to as DCPE) (softening point: 60 ° C., epoxy equivalent: 260), paraxylylene-modified phenolic resin (softening point: 80 ° C., hydroxyl equivalent: 170).

[0013]

[Table 1]

[0014]

[Table 2]

[0015]

[Table 3]

[0016]

According to the present invention, it is possible to greatly reduce the secondary carbon black aggregates which adversely affect the insulation reliability, thereby reducing the insulation reliability inside the sealed semiconductor device. Can be improved.

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Claims (2)

[Claims] 1. (A) an epoxy resin, (B) a phenolic resin, (C) an inorganic filler, (D) a curing accelerator, and (E) 45 μm or more of 500 ppm or less, and a maximum particle size of 500 μm or less. An epoxy resin composition comprising carbon black as an essential component, wherein said epoxy resin composition contains 0.1 to 1.0% by weight of said carbon black in all epoxy resin compositions. Composition. 2. A semiconductor device comprising a semiconductor element encapsulated with the epoxy resin composition according to claim 1.