JP2001015986A - Electronic component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable an electronic component mounting device to quickly mount electronic component on a printed board, by providing a component supplying section and a plurality of mounting heads which take out the electronic component from the component supplying section and mount the component on the printed board by individually revolving on an endless track passing over the printed board. SOLUTION: An electronic component mounting device is provided with a component mounting section 3 and a component mounting section 5 on a base 2 and an endless track 8 which guides the movement of a plurality of mounting heads 7 through the sections 3 and 5 is laid above the sections 3 and 5. By individually revolving the mounting heads 7 on the endless track 8, electronic component is sucked by means of suction nozzles 19 detachably attached to the heads 7 and positioned and mounted on printed board 9. Therefore, the electronic component mounting device can quickly mount the component on the printed board 9 on the endless track 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus that takes out an electronic component from a component supply unit and mounts the electronic component on a printed circuit board.

[0002]

2. Description of the Related Art An example of an electronic component mounting apparatus in which a mounting head takes out an electronic component from a component supply section and mounts the electronic component on a printed circuit board can be seen in Japanese Patent Application Laid-Open No. Hei 10-224090. In this prior art, a plurality of mounting heads are arranged on the periphery of a rotary table, and the mounting head takes out an electronic component from a component supply unit by intermittent rotation of the rotary table, and mounts the electronic component on a printed circuit board mounted on an XY table. . The component supply unit reciprocates to position a desired component at a suction station where the mounting head stops intermittently.

[0003]

However, in the prior art, since each mounting head performs various operations in parallel at each stop station, high-speed mounting is possible. However, the mounting heads are provided at predetermined intervals on the rotary table. Each mounting head must stop at stations that do not need to stop other mounting heads each time the mounting head performs component mounting. You have to match the slowest of the parts. In addition, since the component supply unit moves to position the individual units that supply components while keeping the component suction position of the mounting head constant, the moving range of the component supply unit must be ensured. There was also a tendency to be large.

[0004] Therefore, an object of the present invention is to enable electronic components to be mounted at a high speed.

[0005]

SUMMARY OF THE INVENTION Accordingly, the present invention provides an electronic component mounting apparatus that takes out an electronic component from a component supply unit and mounts the electronic component on a printed circuit board. A plurality of mounting heads are provided to take out electronic components from the component supply unit by individually rotating and mount the electronic components on a printed circuit board.

With this arrangement, the mounting heads can be individually moved and do not stop even if the other heads stop, so that the mounting head can be moved at a high speed even if the acceleration of the movement is kept small. Further, it can be moved at a moving speed suitable for the component, and the interval between the mounting heads can be changed according to the case.

Further, in the present invention, it is preferable that the printed circuit board is mounted on a moving table which moves in a direction orthogonal to the track.

With this configuration, the mechanism for moving the table on which the printed circuit board is placed can be simplified.

In the present invention, preferably, the track is linear on the component supply unit, and a plurality of component supply units are directed to the component supply unit in a direction perpendicular to the track. This is a configuration in which they are arranged.

With this configuration, the space between the component supply units can be reduced without moving the component supply unit, and the space between the component supply units can be reduced.

In the present invention, a recognition unit for recognizing an electronic component held by the mounting head is provided below the track.

Further, in the present invention, the mounting head has a detachable suction nozzle for sucking and holding an electronic component, and a nozzle replacement section for replacing a suction nozzle of the mounting head is provided below the track. It is.

[0013]

Since there is no need to stop at a useless position, the speed can be increased even if the acceleration is slow. If you pick up parts that move at high speed, you can move the parts at your own maximum speed.

An embodiment of the present invention will be described with reference to the drawings.

In the electronic component mounting apparatus 1 shown in FIG. 1, a component supply unit 3 and a component mounting unit 5 are provided on a base 2. Above the component supply unit 3 and the component mounting unit 5, an endless track 8 that guides the movement of the mounting head 7 via these components is arranged. Since the endless track 8 is constituted by a linear motor, the plurality of mounting heads 7 can individually orbit on the endless track 8 independently.

Transport conveyors 10 and 11 for transporting the printed circuit board 9 are provided on the base 2 adjacent to the component supply unit 3.

The component supply unit 3 includes a component supply unit 1
A plurality of reference numerals 2 are arranged side by side in the substrate transfer direction (hereinafter, referred to as X direction) of the transfer conveyors 10 and 11.

Each of the component supply units 12 normally accommodates a large number of electronic components (not shown) of the same type and supplies the components to a predetermined supply position. Different component supply units 12 supply electronic components of different types. Since the components are stored, a large number of component supply units 12 collectively supply many types of components. The supply positions of the component supply units 12 are arranged on a straight line in the X direction in a state where the component supply units 12 are attached to the component supply unit 3. Since the endless track 8 is provided so as to pass over the supply position of the component supply unit 12, the endless track 8 is provided on the component supply unit 3 on a straight line extending in the X direction. The component supply unit 3 is fixed on the base 2.

The component supply unit 12 is disposed so that its longitudinal direction coincides with the Y direction orthogonal to the X direction. Although the component supply direction is also the Y direction, the component supply direction is a direction in which the components are arranged on the tape if the electronic components are sealed in the tape, that is, the direction in which the tape is guided, If the parts are supplied in a loose state, the direction of the chute is such that the parts are aligned and sequentially fed. Since the component supply units 12 are arranged in this manner, they are arranged so that there is almost no space between the units 12, and the installation space is minimized.

In the component mounting section 5, the printed circuit board 9 is placed on a Y table 14 which moves in the Y direction, and the endless track 8 is provided on the component mounting section 5 in a straight line extending in the X direction. . Accordingly, the electronic component to be attracted by the mounting head 7 can be mounted at an arbitrary position on the printed circuit board 9 placed on the Y table 14. Further, the Y table 14 moves to a position where the substrate 9 can be transferred to and from the transport conveyors 10 and 11. The conveyor 10 receives the printed circuit board 9 from the upstream device and conveys the printed circuit board 9 to supply the same to the Y table 14. Is what you do.

A component recognition camera 16 is provided below the endless track 8 and in front of the component mounting section 5, and recognizes a displacement of the electronic component sucked by the mounting head 7 with respect to the head 7. . The camera 16 may be configured to stop the mounting head 7 above and capture an image of an electronic component, or may be configured to capture an image while the mounting head 7 is moving. Alternatively, a line sensor that captures the image by moving the mounting head 7 may be used. An interval is provided between the arrangement position of the camera 16 and the Y table 14 so that one mounting head 7 can be on standby.

Also, along the endless track 8, the component mounting section 3
The nozzle stocker 18 is arranged at the next position of
A suction nozzle 19 that is detachably attached to the mounting head 7 and suctions electronic components is disposed along the endless track 8. The suction nozzle 19 is replaced according to the type of electronic component. An interval is also provided between the nozzle stocker 18 and the Y table 14 so that one mounting head 7 can be on standby. The suction nozzle 19 is also configured to rotate about a vertical axis with respect to the mounting head 7, so that the electronic component can be rotated about the vertical axis to perform angular positioning.

The operation of the above configuration will be described below.

First, the mounting head 7 should be sucked in accordance with mounting data in which the XY coordinate position of the substrate 9 to be mounted, the rotation angle position about the vertical axis, and the type of the component to be mounted are specified for each mounting order (not shown). Adsorb electronic components. That is, the mounting head 7 is driven by the linear motor on the endless track 8 to move to the position facing the component supply unit 12 that supplies the component of the designated component type, stops, and the electronic component is moved by the lowering of the suction nozzle 19. Is vacuum-adsorbed.

Next, the mounting head 7 holding the components is driven by the linear motor, moves on the endless track 8 and stops on the recognition camera 16. The imaging by the camera 16 recognizes how much the component is held with respect to the suction nozzle 19 with respect to the XY direction and the rotation angle.

Next, the mounting head 7 for which component recognition has been completed moves to the component mounting section 3 and XY to be corrected based on the recognition result.
In consideration of the positional deviation in the direction, the positioning on the endless track 8 is performed in the X direction, and the Y table 1 is positioned in the Y direction.
4 is moved and positioned. In addition, the suction nozzle 19 is rotated and positioned by a rotation driving mechanism (not shown) in consideration of the displacement in the rotation direction.

Next, the suction nozzle 19 is lowered to mount the electronic component at the position indicated by the above-described mounting data on the printed circuit board 9.

After the components are sucked, the mounting head 7 can move to a position facing the camera 16 without stopping. Therefore, it is possible to achieve high speed without increasing the acceleration, and it is possible to move at high speed even the mounting head 7 that holds the electronic component that is likely to be shifted when a large acceleration is applied. In addition, such components can be gradually decelerated with a small deceleration so that no deviation occurs. However, when traveling on a curved portion, it is necessary to set a speed such that no deviation occurs due to centrifugal force.

As described above, even a component that is likely to be displaced can be moved at a high speed. However, for example, a component that is less likely to be displaced is immediately moved at a high speed by increasing the acceleration. be able to.
Therefore, if a component whose acceleration can be increased is taken out immediately after a component whose acceleration cannot be increased, the mounting head which moves later may not be able to move at the original speed because it is held in front. Therefore, it is preferable that a mounting order in which components are taken out in an order in which acceleration can be increased is specified in the mounting data.

Further, if the component supply units 12 are arranged from the right side of FIG. 1 in the order of mounting, it is not necessary to wait for the mounting head 7 running ahead of the mounting head 7 to finish the suction at the time of suction. Even if the mounting order is not set in the order in which they can be moved at a high speed, this arrangement eliminates the need to wait for suction.

When the electronic component to be sucked is large, the mounting head 7 for sucking the component is set so that the space between the mounting head 7 and the mounting head 7 before and after the component does not interfere with another head 7 or another component. Move or stop.

If the mounting head 7 is stopped for recognition by the recognition camera 16 or a component is mounted in the component mounting section 5, the next mounting head 7 stops before the device and waits. There is a need. During the waiting period, the plurality of mounting heads 7 wait at a minimum interval, so that the mounting of the parts can be performed at a higher speed than when the rotary head is mounted on the rotary table without changing the interval. In addition, even if there is a slow mounting head 7, the other mounting heads 7 are not affected as long as they cannot be used. In particular, the mounting head 7 moving to the component mounting unit 5 can move the head 7 at the highest speed and mount components.

These operations are performed by a CPU (not shown).
It is automatically controlled based on a program optimized to perform such an operation and the above-described mounting data (not shown).

Next, when the pick-up nozzle is replaced in accordance with the electronic component to be sucked next with respect to the mounting head 7 that has passed the component mounting unit 5 after mounting the component in the component mounting unit 5, The current suction nozzle 19 at the position
Remove the suction nozzle 1 to be installed at another position
9 is installed.

Incidentally, a plurality of suction nozzles 19 may be attached to the mounting head 7, and the suction nozzles 19 used may be exchanged by switching the suction nozzles. The plurality of suction nozzles 19 may be provided, for example, on a rotating body that rotates around a vertical axis, or may be provided so as to stand up around a rotating body that rotates around a horizontal axis.

When the preceding mounting head 7 is replacing the suction nozzle 19 on the nozzle stocker 18, the immediately following mounting head 7 is on standby.

The mounting head 7 that has passed through the nozzle stocker 18 is driven by the linear motor on the endless track 8 toward the component supply unit 3 and moves, and the same component suction operation as described above is continued. At this time, as long as the preceding mounting head 7 has not stopped before it reaches the position facing the component supply unit 12 to be taken out from the nozzle stocker 18, it does not stop.
It can move at the highest speed reached at the highest acceleration and stop at the highest deceleration. These operations are not shown in the CP.
This is performed under the control of U.

[0038]

As described above, according to the present invention, since the respective mounting heads can be individually moved, it is possible to speed up the mounting of components on the orbiting orbit.

Further, since the printed circuit board is mounted on the moving table which moves in the direction orthogonal to the endless track, the mechanism for moving the table on which the printed circuit board is mounted can be simplified.

The endless track is a straight line on the component supply section, and a plurality of component supply units are arranged in the component supply section with their component supply directions directed in a direction orthogonal to the endless track. Accordingly, the space between the component supply units can be reduced without moving the component supply unit, and the arrangement interval of the component supply units can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view showing an electronic component mounting apparatus.

[Explanation of symbols]

 Reference Signs List 1 electronic component mounting device 3 component supply unit 5 component mounting unit 7 mounting head 8 endless track 9 printed circuit board 12 component supply unit 14 Y table (moving table) 16 component recognition camera (recognition unit) 18 nozzle stocker (nozzle replacement unit) 19 Suction nozzle

Claims (5)

[Claims] 1. An electronic component mounting apparatus for taking out an electronic component from a component supply unit and mounting the electronic component on a printed circuit board, wherein the electronic component individually circulates on an endless track passing over the component supply unit and the printed circuit board. An electronic component mounting apparatus, comprising a plurality of mounting heads for taking out electronic components and mounting them on a printed circuit board. 2. The electronic component mounting apparatus according to claim 1, wherein the printed circuit board is mounted on a moving table that moves in a direction orthogonal to the track. 3. The track is straight on the component supply unit, and a plurality of component supply units are arranged in the component supply unit with the component supply direction directed in a direction orthogonal to the track. The electronic component mounting device according to claim 1 or 2, wherein: 4. The electronic component mounting apparatus according to claim 1, further comprising a component recognition unit that recognizes an electronic component held by the mounting head below the track. 5. The mounting head has a detachable suction nozzle for sucking and holding an electronic component, and a nozzle replacement unit for replacing a suction nozzle of the mounting head is provided below the track. The electronic component mounting device according to claim 1 or 2, wherein