JP2001007589A - Shielding structure for printed-board power device - Google Patents
Shielding structure for printed-board power deviceInfo
- Publication number
- JP2001007589A JP2001007589A JP11178106A JP17810699A JP2001007589A JP 2001007589 A JP2001007589 A JP 2001007589A JP 11178106 A JP11178106 A JP 11178106A JP 17810699 A JP17810699 A JP 17810699A JP 2001007589 A JP2001007589 A JP 2001007589A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- power supply
- shield case
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002184 metal Substances 0.000 claims abstract description 57
- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000002344 surface layer Substances 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 abstract description 7
- 230000003449 preventive effect Effects 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、各種機器に搭載さ
れる電源装置のシールド構造に関し、特に、プリント基
板電源装置用シールド構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield structure of a power supply device mounted on various devices, and more particularly to a shield structure for a printed circuit board power supply device.
【０００２】[0002]
【従来の技術】従来行われているＥＭＩ（Ｅｌｅｃｔｒ
ｏ Ｍａｇｎｅｔｉｃ Ｉｎｔｅｒｆｅｒｅｎｃｅ）電
磁波妨害対策は、ユニット型電源では、電源全体をシー
ルドケースに収容する構成とすることにより発生する電
磁波の影響を防いできた。2. Description of the Related Art Conventionally performed EMI (Electr
o Magnetic Interference) As a measure against electromagnetic wave interference, in a unit-type power supply, the effect of an electromagnetic wave generated by accommodating the entire power supply in a shield case has been prevented.
【０００３】一方、プリント基板を用いたカード型電源
では、プリント基板を収納する筐体との接続方式等によ
り、基板全体をシールドケースに収容することが困難な
構造になっているため、図４に示すように、プリント基
板１６の電子部品１７の搭載面をシールドケース１５で
覆う構造が採用されていた。On the other hand, a card type power supply using a printed board has a structure in which it is difficult to house the entire board in a shield case due to a connection method with a housing for housing the printed board. As shown in FIG. 1, a structure in which the mounting surface of the printed circuit board 16 on which the electronic component 17 is mounted is covered with the shield case 15 has been adopted.
【０００４】しかし、この構造ではプリント基板とシー
ルドケースで構成される電磁波遮蔽空間のプリント基板
側の電磁波を遮蔽する効果が充分ではなく、電磁波防止
対策として不充分であった。However, this structure has an insufficient effect of shielding the electromagnetic wave on the printed circuit board side in the electromagnetic wave shielding space formed by the printed circuit board and the shield case, and is insufficient as an electromagnetic wave preventing measure.
【０００５】上記の問題点を考慮して、実開平２−４５
６９６号公報において、金属コアプリント基板を用い、
基板の周縁部に金属コア露出部を設け、基板の表裏両側
からプリント基板を挟み込むようにシールドケースを着
設して、発生する電磁波の影響を防止するシールド構造
が提案されている。In view of the above problems, Japanese Utility Model Application Laid-Open No. 2-45
No. 696, using a metal core printed circuit board,
There has been proposed a shield structure in which a metal core exposed portion is provided on a peripheral portion of a substrate, and a shield case is provided so as to sandwich the printed circuit board from both sides of the substrate, thereby preventing the influence of generated electromagnetic waves.
【０００６】しかし、この実開平２−４５６９６号公報
記載のシールド構造では、プリント基板の両面にシール
ドケースを装着するために、電源装置部分がスペースを
大きく占拠し、装置筐体が大きくなってしまうという問
題があった。However, in the shield structure described in Japanese Utility Model Application Laid-Open No. 2-45696, since the shield cases are mounted on both sides of the printed circuit board, the power supply unit occupies a large space and the device housing becomes large. There was a problem.
【０００７】[0007]
【発明が解決しようとする課題】そこで、本発明は上記
従来のプリント基板電源装置用シールド構造における問
題点に鑑みてなされたものであって、コンパクトであっ
て、かつ、電磁波の漏出を防ぎ、電磁波防止効果の大き
いプリント基板電源装置用シールド構造を提供すること
を目的とする。SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above-described problems in the conventional shield structure for a printed circuit board power supply device, and is compact and prevents leakage of electromagnetic waves. An object of the present invention is to provide a shield structure for a printed circuit board power supply having a large electromagnetic wave prevention effect.
【０００８】[0008]
【課題を解決するための手段】請求項１記載の発明は、
表面層に電源回路用電子部品が実装されたプリント基板
と、該プリント基板の前記電源回路用電子部品が実装さ
れた面側を覆うように装着される金属シールドケースと
で構成されるプリント基板電源装置用シールド構造にお
いて、前記プリント基板は、表面層以外の少なくとも一
層の全面に導電性金属板を有し、前記金属シールドケー
スと前記プリント基板の前記導電性金属板とが電気的に
接続されていることを特徴とする。According to the first aspect of the present invention,
A printed circuit board power supply comprising: a printed circuit board on which a power supply circuit electronic component is mounted on a surface layer; and a metal shield case mounted so as to cover a surface of the printed circuit board on which the power supply circuit electronic component is mounted. In the device shield structure, the printed board has a conductive metal plate on at least the entire surface of at least one layer other than the surface layer, and the metal shield case and the conductive metal plate of the printed board are electrically connected. It is characterized by being.
【０００９】請求項２記載の発明は、前記金属シールド
ケースが、前記プリント基板の略々全面、または一部分
の領域を覆うように装着されることを特徴とする。The invention according to claim 2 is characterized in that the metal shield case is mounted so as to cover substantially the entire surface of the printed circuit board or a partial area thereof.
【００１０】請求項３記載の発明は、前記金属シールド
ケースと前記導電性金属板との電気的接続が、前記プリ
ント基板に設けられた複数個の導通孔を介して行われる
ことを特徴とする。According to a third aspect of the present invention, the electrical connection between the metal shield case and the conductive metal plate is made through a plurality of conduction holes provided in the printed circuit board. .
【００１１】請求項４記載の発明は、さらに、前記プリ
ント基板のグランドパターン部と前記金属シールドケー
スとを電気的に接続することを特徴とする。The invention according to claim 4 is further characterized in that a ground pattern portion of the printed circuit board and the metal shield case are electrically connected.
【００１２】そして、請求項１記載の発明によれば、プ
リント基板が表面層以外の少なくとも一層の全面に導電
性金属板を有し、金属シールドケースと前記プリント基
板の前記導電性金属板とが電気的に接続されているた
め、前記プリント基板の前記電源回路用電子部品が実装
された面を前記金属シールドケースと前記プリント基板
の前記導電性金属板とで遮蔽し、コンパクトな電磁波遮
蔽空間を構成することができる。According to the first aspect of the present invention, the printed circuit board has a conductive metal plate on at least one entire surface other than the surface layer, and the metal shield case and the conductive metal plate of the printed circuit board are connected to each other. Since it is electrically connected, the surface of the printed circuit board on which the power supply circuit electronic components are mounted is shielded by the metal shield case and the conductive metal plate of the printed circuit board, and a compact electromagnetic wave shielding space is formed. Can be configured.
【００１３】請求項２記載の発明によれば、前記金属シ
ールドケースが、前記プリント基板の略々全面、または
一部分の領域を覆うように装着されるため、プリント基
板の電磁波の遮蔽対象となる領域のみをシールドケース
で覆うことができ、よりコンパクトな電磁波遮蔽空間を
構成することができる。According to the second aspect of the present invention, since the metal shield case is mounted so as to cover substantially the entire surface or a partial region of the printed circuit board, an area of the printed circuit board to be shielded from electromagnetic waves. Only the shield case can be covered, and a more compact electromagnetic wave shielding space can be configured.
【００１４】請求項３記載の発明によれば、前記金属シ
ールドケースと前記導電性金属板との電気的接続が、前
記プリント基板に設けられた複数個の導通孔を介して行
われるため、接合部の設置面積を小さくできるととも
に、簡便に前記シールドケースと前記導電性金属板とを
接続することができる。According to the third aspect of the present invention, the electrical connection between the metal shield case and the conductive metal plate is performed through a plurality of conductive holes provided in the printed circuit board. The installation area of the portion can be reduced, and the shield case and the conductive metal plate can be easily connected.
【００１５】請求項４記載の発明によれば、さらに、前
記プリント基板のグランドパターン部と前記金属シール
ドケースとを電気的に接続することで、接地効果が強化
され、さらに安定した電磁波防止効果を上げることがで
きる。According to the fourth aspect of the present invention, the ground effect is further enhanced by electrically connecting the ground pattern portion of the printed circuit board and the metal shield case, and a more stable electromagnetic wave prevention effect is obtained. Can be raised.
【００１６】[0016]
【発明の実施の形態】次に、本発明にかかるプリント基
板電源装置用シールド構造の実施の形態の具体例を図面
を参照しながら説明する。Next, a specific example of an embodiment of a shield structure for a printed circuit board power supply device according to the present invention will be described with reference to the drawings.
【００１７】図１及び図２は、本発明にかかるプリント
基板電源装置用シールド構造の一実施例を示し、電源装
置用基板であるプリント基板６の上面に電源回路用の電
子部品７が実装され、電子部品７の実装面を覆うように
して金属シールドケース５が装着されている。FIGS. 1 and 2 show an embodiment of a shield structure for a printed circuit board power supply device according to the present invention, wherein an electronic component 7 for a power supply circuit is mounted on the upper surface of a printed circuit board 6 which is a substrate for a power supply device. The metal shield case 5 is mounted so as to cover the mounting surface of the electronic component 7.
【００１８】プリント基板６は、９層の多層基板として
構成され、絶縁基材２の間に導電性金属板（以下、「メ
タルコア」という。）１、を挟むように形成され、グラ
ンド用銅箔（グランドパターン部）４が絶縁基材２の層
間及びプリント基板６の表面上に形成されている。ま
た、電子部品７は、プリント基板６の上部表面層に形成
された配線パターン部８に実装されている。The printed circuit board 6 is configured as a nine-layered multi-layer board, is formed so as to sandwich a conductive metal plate (hereinafter, referred to as a “metal core”) 1 between insulating base materials 2, and has a copper foil for ground. (Ground pattern portion) 4 is formed between the insulating substrate 2 and the surface of the printed circuit board 6. The electronic component 7 is mounted on a wiring pattern section 8 formed on the upper surface layer of the printed circuit board 6.
【００１９】導通孔３は、プリント基板６のメタルコア
１の層までの非貫通孔であり、孔内には銅メッキが施さ
れ、遮蔽が必要である領域を囲むようにして、複数個配
置されている。The conductive holes 3 are non-through holes up to the layer of the metal core 1 of the printed circuit board 6, and a plurality of conductive holes 3 are plated in the holes and are arranged so as to surround a region where shielding is required. .
【００２０】メタルコア１は、銅製の板であって、これ
により導通孔３の銅メッキとの電気的接続を可能にして
いる。また、グランド用銅箔４は導通孔３を介してメタ
ルコア１と電気的に接合されている。さらに、プリント
基板６上の両端には、交流電流入力用コネクタ９と直流
電流出力用コネクタ１０が備えられている。The metal core 1 is a copper plate, which enables electrical connection with the copper plating of the conduction hole 3. The ground copper foil 4 is electrically connected to the metal core 1 via the conduction hole 3. Further, at both ends on the printed circuit board 6, an AC current input connector 9 and a DC current output connector 10 are provided.
【００２１】金属シールドケース５は、プリント基板６
の遮蔽が必要である領域を囲むようにして配置されてい
る導通孔３を結んで形成される形状に対応する形に、外
枠の形状を形成してある。The metal shield case 5 includes a printed circuit board 6
The shape of the outer frame is formed so as to correspond to the shape formed by connecting the conductive holes 3 arranged so as to surround the area where the shielding is required.
【００２２】図３は、金属シールドケース５と導通孔３
の接合方法の一実施例であり、金属シールドケース５と
導通孔３の銅メッキパターン部との接触部を直接半田付
けにより接合している（半田付け部１１）。尚、半田の
他に導電性の接着剤等を用いても良い。FIG. 3 shows a metal shield case 5 and a conductive hole 3.
In this embodiment, a contact portion between the metal shield case 5 and the copper plating pattern portion of the conduction hole 3 is directly joined by soldering (soldering portion 11). Note that a conductive adhesive or the like may be used in addition to the solder.
【００２３】次に、上記構成を有するプリント基板電源
装置用シールド構造の動作について図１及び図２を参照
して説明する。Next, the operation of the shield structure for a printed circuit board power supply device having the above configuration will be described with reference to FIGS.
【００２４】主要な電磁波発生源となる電子部品７が実
装されている面に、同面に配置された導通孔３に対応す
るように外枠を形成された金属シールドケース５を被
せ、導通孔３及びグランド用銅箔４と金属シールドケー
ス５との接触部を半田付けによって固定し、電気的に接
続させる。A metal shield case 5 having an outer frame formed so as to correspond to the conductive hole 3 disposed on the surface on which the electronic component 7 serving as a main electromagnetic wave generation source is mounted is covered with the conductive hole. 3 and a contact portion between the copper foil 4 for ground and the metal shield case 5 are fixed by soldering and are electrically connected.
【００２５】以上のように構成されたプリント基板６を
図示しない装置の筐体に組み込み、始動させる。The printed circuit board 6 constructed as described above is assembled in a housing of a device (not shown) and started.
【００２６】この時、プリント基板６の内層のメタルコ
ア１及びグランド用銅箔４と金属シールドケース５とで
電磁波遮蔽空間が形成されており、プリント基板６上の
電子部品７より発生する電磁波の漏出を防止する。At this time, an electromagnetic wave shielding space is formed by the metal core 1 and the ground copper foil 4 in the inner layer of the printed circuit board 6 and the metal shield case 5, and leakage of electromagnetic waves generated from the electronic components 7 on the printed circuit board 6. To prevent
【００２７】また、銅箔の層に比べ厚みのあるメタルコ
アを使用することにより単位面積当たりの抵抗が少なく
なり、グランドの強化につながるとともに、銅箔のみに
より同様の効果を上げるためには、内層のグランド用銅
箔を多層化し、高多層基板にする必要がありメタルコア
基板よりもコストが増大するため、メタルコア基板を使
用する優位性がある。In addition, by using a metal core having a thickness greater than that of a copper foil layer, the resistance per unit area is reduced, which leads to strengthening of the ground. It is necessary to multiply the ground copper foil into a multi-layer board to increase the cost as compared with the metal core board. Therefore, there is an advantage in using the metal core board.
【００２８】尚、以上の実施例中においては、メタルコ
ア１は一層として説明したが、プリント基板６の多層中
に複数層のメタルコアを挟むことも可能である。In the above embodiment, the metal core 1 is described as a single layer. However, a plurality of metal cores may be sandwiched between multiple layers of the printed circuit board 6.
【００２９】[0029]
【発明の効果】以上説明したように、請求項１または２
記載の発明によれば、プリント基板の片側に、メタルコ
アと金属シールドケースのみでコンパクトな電磁波遮蔽
空間を構成でき、また、金属シールドケースが、遮蔽を
必要とする領域のみ、部分的にプリント基板を覆うよう
に装着されることにより、さらにコンパクトな電磁波遮
蔽空間を構成することが可能なプリント基板電源装置用
シールド構造を提供することができる。As described above, claim 1 or claim 2
According to the described invention, on one side of the printed circuit board, a compact electromagnetic wave shielding space can be formed only by the metal core and the metal shield case, and the metal shield case only partially covers the printed circuit board in an area requiring shielding. A shield structure for a printed circuit board power supply device capable of forming a more compact electromagnetic wave shielding space by being mounted so as to cover can be provided.
【００３０】請求項３記載の発明によれば、接合部の設
置面積を小さくできるとともに、簡便にシールドケース
と導電性金属板を接続することが可能なプリント基板電
源装置用シールド構造を提供することができる。According to the third aspect of the present invention, there is provided a shield structure for a printed circuit board power supply device in which the installation area of the joint can be reduced and the shield case and the conductive metal plate can be easily connected. Can be.
【００３１】請求項４記載の発明によれば、プリント基
板内部のグランド用銅箔及び金属板の二重のグランドを
有することにより接地効果が強化され、さらに安定した
電磁波防止効果を上げることができるプリント基板電源
装置用シールド構造を提供することができる。According to the fourth aspect of the invention, the grounding effect is enhanced by having the double ground of the ground copper foil and the metal plate inside the printed circuit board, and a more stable electromagnetic wave prevention effect can be achieved. A shield structure for a printed circuit board power supply device can be provided.
【図１】本発明にかかるプリント基板電源装置用シール
ド構造の実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of a shield structure for a printed circuit board power supply device according to the present invention.
【図２】図１のＡ−Ａ線断面図である。FIG. 2 is a sectional view taken along line AA of FIG.
【図３】金属シールドーケースと導通孔の接合方法の一
例を示す図である。FIG. 3 is a diagram showing an example of a method of joining a metal shield case and a conduction hole.
【図４】従来のプリント基板のシールドケース構造を示
す断面図である。FIG. 4 is a sectional view showing a conventional shield case structure of a printed circuit board.
１ メタルコア ２ 絶縁基材 ３ 導通孔 ４ グランド用銅箔 ５ 金属シールドケース ６ プリント基板 ７ 電子部品 ８ 配線パターン部 ９ 交流電流入力用コネクタ １０ 直流電流出力用コネクタ １１ 半田付け部 DESCRIPTION OF SYMBOLS 1 Metal core 2 Insulating base material 3 Conducting hole 4 Copper foil for ground 5 Metal shield case 6 Printed circuit board 7 Electronic component 8 Wiring pattern part 9 Connector for AC current input 10 Connector for DC current output 11 Solder part
Claims (4)
たプリント基板と、該プリント基板の前記電源回路用電
子部品が実装された面側を覆うように装着される金属シ
ールドケースとで構成されるプリント基板電源装置用シ
ールド構造において、 前記プリント基板は、表面層以外の少なくとも一層の全
面に導電性金属板を有し、 前記金属シールドケースと前記プリント基板の前記導電
性金属板とが電気的に接続されていることを特徴とする
プリント基板電源装置用シールド構造。1. A printed circuit board having a power supply circuit electronic component mounted on a surface layer, and a metal shield case mounted so as to cover a surface of the printed circuit board on which the power supply circuit electronic component is mounted. In the shield structure for a printed circuit board power supply device, the printed circuit board has a conductive metal plate on at least the entire surface other than the surface layer, and the metal shield case and the conductive metal plate of the printed circuit board are electrically connected. A shield structure for a printed circuit board power supply device, wherein the shield structure is electrically connected.
ト基板の略々全面、または一部分の領域を覆うように装
着されることを特徴とする請求項１記載のプリント基板
電源装置用シールド構造。2. The shield structure for a printed circuit board power supply device according to claim 1, wherein the metal shield case is mounted so as to cover substantially the entire surface or a partial area of the printed circuit board.
属板との電気的接続は、前記プリント基板に設けられた
複数個の導通孔を介して行われることを特徴とする請求
項１または２記載のプリント基板電源装置用シールド構
造。3. The electrical connection between the metal shield case and the conductive metal plate is made through a plurality of conduction holes provided in the printed circuit board. Shield structure for printed circuit board power supply.
ターン部と前記金属シールドケースとを電気的に接続す
ることを特徴とする請求項１乃至３記載のプリント基板
電源装置用シールド構造。4. The shield structure for a printed circuit board power supply device according to claim 1, further comprising electrically connecting a ground pattern portion of said printed circuit board and said metal shield case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11178106A JP2001007589A (en) | 1999-06-24 | 1999-06-24 | Shielding structure for printed-board power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11178106A JP2001007589A (en) | 1999-06-24 | 1999-06-24 | Shielding structure for printed-board power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001007589A true JP2001007589A (en) | 2001-01-12 |
Family
ID=16042764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11178106A Withdrawn JP2001007589A (en) | 1999-06-24 | 1999-06-24 | Shielding structure for printed-board power device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001007589A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004040100A (en) * | 2002-06-28 | 2004-02-05 | Automotive Lighting Reutlingen Gmbh | Electromagnetic shielding apparatus |
| JP2004179561A (en) * | 2002-11-28 | 2004-06-24 | Kyocera Corp | Electronic equipment |
| JP2006116711A (en) * | 2004-10-19 | 2006-05-11 | Seiko Epson Corp | Information processing device |
| CN105392351A (en) * | 2015-12-18 | 2016-03-09 | 天津光电通信技术有限公司 | A shielding box that is convenient to place in the horizontal direction |
| CN107567273A (en) * | 2017-10-25 | 2018-01-09 | 南京尤尼泰信息科技有限公司 | A kind of shielding box |
| JP2021150517A (en) * | 2020-03-19 | 2021-09-27 | 株式会社ソニー・インタラクティブエンタテインメント | Electronic apparatus |
| CN114096137A (en) * | 2021-11-01 | 2022-02-25 | 浙江吉利控股集团有限公司 | Vehicle and electronic equipment thereof |
-
1999
- 1999-06-24 JP JP11178106A patent/JP2001007589A/en not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004040100A (en) * | 2002-06-28 | 2004-02-05 | Automotive Lighting Reutlingen Gmbh | Electromagnetic shielding apparatus |
| JP2004179561A (en) * | 2002-11-28 | 2004-06-24 | Kyocera Corp | Electronic equipment |
| JP2006116711A (en) * | 2004-10-19 | 2006-05-11 | Seiko Epson Corp | Information processing device |
| CN105392351A (en) * | 2015-12-18 | 2016-03-09 | 天津光电通信技术有限公司 | A shielding box that is convenient to place in the horizontal direction |
| CN107567273A (en) * | 2017-10-25 | 2018-01-09 | 南京尤尼泰信息科技有限公司 | A kind of shielding box |
| CN107567273B (en) * | 2017-10-25 | 2024-04-12 | 南京尤尼泰信息科技有限公司 | Shielding box |
| JP2021150517A (en) * | 2020-03-19 | 2021-09-27 | 株式会社ソニー・インタラクティブエンタテインメント | Electronic apparatus |
| US11375606B2 (en) | 2020-03-19 | 2022-06-28 | Sony Interactive Entertainment Inc. | Electronic apparatus |
| JP7562756B2 (en) | 2020-03-19 | 2024-10-07 | 株式会社ソニー・インタラクティブエンタテインメント | Electronics |
| CN114096137A (en) * | 2021-11-01 | 2022-02-25 | 浙江吉利控股集团有限公司 | Vehicle and electronic equipment thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20060905 |