JP2000349128A - Method for connection of prober side of probing device with tester side thereof and structure thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to correspond to a change in the shapes of a pogo ring and a probe card in the method of the connection of the side of the prober of a probing device with the side of the tester of the probing device, by a method wherein the structures of inner rings are constituted in common and the shapes only of adaptor rings are changed. SOLUTION: In the method of the connection of the side of a prober of a probing device with the side of a tester of the probing device, even though a probe card 1 on the side of the prober and a pogo ring 2 on the side of the tester are respectively formed in different shapes, inner rings 3 of the same structure are used and the unsatisfactory state of the matching property of the shape of the pogo ring with the shape of the inner rings 3 is disappeared by making adaptor rings 9 interpose between both of the pogo ring 2 and the inner rings 3 and the side of a prober is contrived so that it is made to connect with the side of the tester.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stylus connected to a tester by mounting a wafer on a stage chuck in order to measure electrical characteristics of a plurality of semiconductor devices formed on the wafer. The present invention relates to a prober device for sequentially bringing a (probe needle) into contact with an electrode pad of each semiconductor device, and particularly to a method of connecting a tester side and a prober side and a structure thereof.

[0002]

2. Description of the Related Art In the manufacture of semiconductor chips, it is performed to check whether a large number of devices formed on a wafer operate normally. This is performed so that a defective device that does not operate normally is removed from the subsequent assembly process, thereby improving productivity and promptly feeding back an inspection result as to whether the manufacturing process is normal. When inspecting semiconductor devices formed on a wafer,
A wafer is set on a prober device, and a stylus is brought into contact with an electrode pad of a device. Then, an electric signal is applied to a predetermined stylus from an IC tester, and an electric signal output to another stylus is detected. The wafer inspected in this way is cut by a dicing device and then assembled.

In this prober device, a probe card is used to apply an electric signal from an IC tester to an electrode pad of a semiconductor device. The probe card has, on the lower side, a stylus in contact with the electrode pad of the semiconductor device, and on the upper side, a connection terminal electrically connected to the stylus. To firmly connect the connection terminal of this probe card and the connection terminal in the pogo ring on the tester side,
Conventionally, an inner ring has been used. That is, the inner ring is interposed between the probe card and the prober-side head stage and the tester-side pogo ring, and is detachably fixed to each of the inner ring, so that the connection terminal of the probe card on the prober side and the tester side are connected. The connection terminal is connected, and an electric signal from the IC tester is applied to the electrode pad of the semiconductor device.

However, due to differences in wafer manufacturers, wafer shapes, 6 inches or 8 inches, and different patterns of wafers, the arrangement and number of electrode pads are different due to various structures. Probe card is present. Furthermore, the shape of the pogo ring on the tester side varies depending on the manufacturer and product of the tester. In order to connect the tester side and prober side connection terminals well, it is necessary to adapt the probe card and pogo ring of these various structures, so that the inner ring structure is very diverse and complicated. Required a simple structure.

[0005]

SUMMARY OF THE INVENTION In view of the above-mentioned problems, it is an object of the present invention to provide a prober having excellent compatibility with a tester and excellent productivity on a prober side without having to prepare complicated and various types of inner rings. An object of the present invention is to provide a method of connecting a tester side and a prober side of an apparatus and a connection structure thereof. Further, since the prober interface can be prepared in advance, the delivery time of the product can be shortened.

[0006]

According to the present invention, there is provided a method for connecting a tester side and a prober side of a prober apparatus and a structure thereof according to the present invention. I will provide a. The connection method according to claim 1, wherein the inner ring and the adapter ring having a shape adapted to the shape of the pogo ring on the tester side and the shape of the inner ring are employed, so that the shape of the inner ring is constant and constant. This enables the shape to be obtained, and eliminates the need to prepare complicated and various types of inner rings.

In the connection method according to the second aspect, even when the shape of the pogo ring on the tester side is different, it is possible to cope with a change in the connection structure by changing only the shape of the adapter ring which is a simple structure. I can do it. The connection structure according to claim 3 is the connection structure according to claim 1.
The second method is changed to a product, and has the same effect as the effect of the connection method of the first and second aspects.

A method of connecting a prober side and a tester side of a prober device according to an embodiment of the present invention and a structure thereof will be described below with reference to the drawings. FIGS. 1, 2 and 3 show that the probe card 1 on the prober side and the pogo ring 2 on the tester side have different shapes, respectively, while the inner ring 3 having the same structure is used. 2 shows a structure in which the tester and the tester are connected.

As shown in FIG. 1, a probe card 1
Has a connection terminal 4 on an upper surface and a stylus (probe needle) 5 on a lower surface. The stylus 5 is brought into contact with the electrode pad of the semiconductor device on the wafer W on the chuck 6 of the stage, and an electrical inspection is performed. Probe card 1
Is attached to the inner ring 3 by appropriate fixing means around the lower part.
Fixed to The inner ring 3 is formed in a fixed shape, and one side is detachably fixed to the probe card 1 and the other side is detachably fixed to the head stage 7 on the prober side.

The pogo ring 2 on the tester side is provided with a connection terminal 8 therein as shown in a cross section in FIG. 1, and when the tester side and the prober side are connected, these connection terminals are connected. The terminal 8 is accurately connected to the connection terminal 4 of the probe card 1. In FIG. 1, the adapter ring 9 is interposed between the pogo ring 2 and the inner ring 3 so that the connection between the tester side and the prober side is made well and the connection terminals 4 and 8 are accurately connected. Is used.
The adapter ring 9 is fixed to the pogo ring 2 and the inner ring 3 by an appropriate fixing means. Even in the case where the matching of the shapes of the pogo ring 2 and the inner ring 3 is poor, the use of the adapter ring 9 having an appropriate shape can solve the problem of the matching between the pogo ring 2 and the inner ring 3. Can be fixed firmly.

FIG. 2 shows a connection structure between a prober side and a tester side when a pogo ring 2 and a probe card 1 having different shapes from FIG. 1 are used. In this case, the shape of the inner ring 3 is the same as that of FIG. For this purpose, an adapter ring 9 having a stepped cross section and having a shape different from that shown in FIG. 1 is interposed between the pogo ring 2 and the inner ring 3. Naturally, the adapter ring 9 is also fixed to the pogo ring 2 and the inner ring 3 by bolts or the like.

FIG. 3 shows a connection structure between a prober side and a tester side when a pogo ring 2 and a probe card 1 having different shapes from those in FIGS. 1 and 2 are used. Also in this case, the inner ring 3 having the same shape as that of the above two cases.
You are using However, in this case, unlike the former two cases, since the shape matching between the pogo ring 2 and the inner ring 3 is good, the prober side and the tester side can be connected without using the adapter ring 9. ing. However, it is necessary to fix the pogo ring 2 and the inner ring 3 using appropriate fixing means. In the present invention, the inner ring 3 is described as having a single integral structure for the sake of explanation. However, the inner ring 3 may be formed by combining a plurality of components. Adjustment can be performed.

[0013]

As described above, according to the connection method between the prober side and the tester side of the prober device of the present invention and its structure, even if the probe card on the prober side and the pogo ring on the tester side change in shape, The inner ring with a complicated structure is left as it is, and the prober and tester sides can be firmly and accurately connected by simply changing the shape of the simple adapter ring. There is no need to prepare a number,
The tester side and the prober side productivity can be improved. In addition, the interface on the prober side can be prepared in advance, and only a simple design of the adapter ring is required, so that it is possible to shorten the delivery time of the product and reduce the cost by reducing the number of design steps. Further, since the types of inner rings to be stored are reduced, inventory management is easy, and troubles due to design mistakes and the like can be avoided. In addition, it is easy to change the tester even in an apparatus delivered to the user.

[Brief description of the drawings]

FIG. 1 is a front view partially showing a connection structure between a prober side and a tester side of a prober device according to an embodiment of the present invention in a longitudinal section.

FIG. 2 is a front view partially showing a connection structure between a prober side and a tester side of the prober device of the present invention when an adapter ring having a shape different from that shown in FIG. 1 is used; is there.

FIG. 3 is a front view partially showing a connection structure between a prober side and a tester side of a prober device in a case where an adapter ring is not used;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Probe card 2 ... Pogo ring 3 ... Inner ring 6 ... Chuck 7 ... Head stage 9 ... Adapter ring

Claims (3)

[Claims] 1. A method of connecting a prober side and a tester side of a prober device, comprising: an inner ring having a fixed shape, an adapter ring having a shape matching the shape of the pogo ring on the tester side and the shape of the inner ring. A method of connecting a prober side and a tester side of a prober device, wherein the connection terminal of a probe card on the prober side and a connection terminal in a pogo ring on the tester side are used. 2. The method according to claim 1, wherein only the shape of the adapter ring is changed in accordance with a change in the shape of the pogo ring on the tester side. . 3. A connection structure between a prober side and a tester side of a prober device, wherein an inner ring having a predetermined shape is fixed to a probe card and a head stage on the prober side, and the shape of the pogo ring on the tester side and the shape of the inner ring are determined. An adapter ring having a shape conforming to the shape of the inner ring is fixed to the pogo ring and the inner ring, whereby the connection terminal of the probe card on the prober side is connected to the connection terminal in the pogo ring on the tester side. The connection structure between the prober side and the tester side of the characteristic prober device.