JP2000104131A - High strength and high conductivity copper alloy and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a high strength and high conductivity copper alloy sheet excellent in press punchability. SOLUTION: This alloy sheet it the one composed of a copper alloy contg., by weight, 0.2 to 3.0% Fe, 0.001 to 0.2% P and 0.05 to 1.0% Zn, satisfying the Fe content conditional inequality shown in the following, and the balance substantial Cu with inevitable impurities, in which Fe or/and the intermetallic compds. of Fe are precipitated, the average crystal grain size in the sheet width direction of the rolled surface is 3 to 60 μm, and the number of the crystal grains with the dimensions of 80 to 120% of the value is >=70% of all crystal grains: [Fe]-3.6×([P]-0.18×[Ni]-0.26×[Co]-0.20×[Cr]-0.85×[Mg])>=0.5, where [Fe], [P], [Ni], [Co], [Cr] and [Mg] denote the wt.% of each element in the copper alloy.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
High strength and high conductivity copper alloy plate on which Fe-based intermetallic compound represented by Fe and / or Fe-P is deposited, especially for electric and electronic parts such as semiconductor lead frames, terminals, connectors, bus bars, etc. The high-strength and high-conductivity copper alloy sheet to be used and the method for producing the same have good press punching properties.

[0002]

2. Description of the Related Art When an intermetallic compound typified by Fe and / or Fe-P is precipitated in a Cu alloy, a copper alloy having high strength and high conductivity can be obtained relatively easily.
0 (Cu-2.3 wt% Fe-0.03 wt% P-0.
1 wt% Zn), C19700 (Cu-0.6 wt% F)
A wide variety of Fe-containing copper alloys such as e-0.2 wt% P-0.05 wt% Mg) have been used in large quantities as materials for electrical and electronic components such as lead frames, terminals, and connectors.

[0003] However, when these materials are processed and formed, the sheet is corrugated or meandered in cold rolling, uneven in residual stress, meandering of a slitted strip, bending or sagging in stamping (stamping). In particular, there is a problem that non-uniform sagging width and sagging height), roughening and cracking of a lead bending portion, and a decrease in strength of a product occur, which lowers a product yield and a productivity at the time of working. Was.

[0004]

By the way, Fe or / and / or
In a copper alloy in which a second phase is precipitated in the alloy, such as the above-mentioned Fe-containing copper alloy in which an Fe-based intermetallic compound is precipitated, recrystallization, crystal grain coarsening and precipitation proceed simultaneously during the heat treatment. Therefore, in the heat treatment step, a structure in which coarsely grown crystal grains and fine crystal grains whose growth is stopped by precipitation during heating are mixed (hereinafter, referred to as a mixed grain structure) is likely to occur. This phenomenon is particularly remarkable in a copper alloy containing 0.2% or more of Fe. Also,
Once it has a mixed grain structure, it is extremely difficult to produce a material with a grain sized structure by subsequent processing and heat treatment. In a material exhibiting a mixed grain structure, coarsened crystal grains have greater deformability and smaller proof stress than fine crystal grains. Therefore, in a material having such a mixed grain structure, a phenomenon occurs in which the deformability and the strength are different depending on the site.

[0005] This mixed grain structure is particularly liable to occur in a copper alloy in which precipitation of Fe typified by C19400 is a main precipitate, and the degree of deformation increases the difference in deformability and strength depending on the degree. Wavy and meandering of the sheet during cold rolling, uneven residual stress, meandering of slitted strips, occurrence of bending and sagging (particularly uneven sagging width and sagging height) in press punching, roughening of the lead bending part This causes problems such as cracking and reduced strength in products. The present invention has been made based on the above findings.
An object of the present invention is to improve the above-described problems, particularly, press punchability, which are observed in a plate (including a strip) made of an e-containing copper alloy.

[0006]

The Fe-containing copper alloy is heat-treated during the manufacturing process for the purpose of softening, aging and the like.
As described above, the mixed grain structure tends to be formed, and once the mixed grain structure is formed, it is difficult to eliminate the mixed grain structure, which causes a great problem in the manufacturing process and the stamping process. Conversely, when the first heat treatment performed during the step of cold rolling the hot-rolled material and the horizontally continuous cast material has a grain-sized structure, and then aging treatment is performed to precipitate Fe or / and Fe-based intermetallic compounds, the cooling is further reduced. Even if the elongation-heat treatment is performed, a mixed grain structure does not occur, and the above-described problem does not occur.

[0007] From these viewpoints, as a result of examining various conditions for obtaining a grain-sized structure, the following copper alloy sheet and manufacturing method were obtained. The high-strength and high-conductivity copper alloy excellent in press punching property according to the present invention is Fe: 0.2 to 3.0 wt%,
P: 0.001-0.2 wt%, Zn: 0.05-1.
0 wt%, satisfying the Fe content condition expressed by the following formula, the balance being substantially composed of Cu and a copper alloy which is an unavoidable impurity, Fe or / and an Fe-based intermetallic compound is precipitated, and the rolling surface The average crystal grain size in the plate width direction is 3 to 60 μm
And the number of crystal grains having a size of 80 to 120% of that value is 70% or more of all the crystal grains. [Fe] −3.6 × ([P] −0.18 × [Ni] −0.26 ×
[Co] −0.20 × [Cr] −0.85 × [Mg]) ≧ 0.5 where [Fe], [P], [Ni], [Co], [C
[r] and [Mg] represent wt% of each element contained in the copper alloy as an additional element or an unavoidable impurity.

[0008] If necessary, the copper alloy according to the present invention may contain N
One, two or more of i, Co, Cr, and Mg are contained in a total amount of 0.01 to 0.5 wt%, or Al, Sn,
One or more of Mn, Zr, In, and Ti are contained in a total amount of 0.005 to 0.5 wt%. You may contain both of these. Further, in place of part or all of P in the above range, or in addition to P in the above range, 0.3% or less of S
i can be added so that the total amount of P and Si is 0.001 wt% or more (in this case, P: 0 to 0.2
wt%). In the above copper alloy, it is desirable that O: 100 ppm or less and H: 10 ppm or less. Furthermore, in the copper alloy, Ag, Cd, Au, Pt, Hf, Th, Sr,
Pd, S, C, Y, Pb, Ga, Ge, As, Se, S
In some cases, b, Bi, Te, B, and the like may be mixed in from raw metal ingots, scraps, furnace materials, and the like. Of these elements, Pb and S are each 0.01 wt% or less,
If the other elements are not more than 0.005 wt% and the total amount of these elements is not more than 0.01 wt%, the properties of the alloy will not be significantly impaired.

The method for producing a copper alloy sheet according to the present invention is characterized in that the cold working ratio from the time when hot rolling is completed to the heat treatment for first causing recrystallization to 90% is performed on the copper alloy having the above composition.
It is characterized as follows. Alternatively, prior to the aging treatment for precipitating the Fe or / and Fe-based intermetallic compound, the temperature is raised to a temperature range of 450 to 950 ° C at a rate of 0.1 ° C / sec or more, and the temperature is increased for 5 seconds to 10 minutes. An aging treatment for precipitating Fe and / or an Fe-based intermetallic compound after holding and recrystallizing is performed.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The reasons for limiting the components and various conditions as described above will be described below. <Fe content> If the Fe content is less than 0.2% wt,
Since the amount of e or Fe-based intermetallic compound deposited is small, it cannot sufficiently meet the recent demand for higher strength and higher heat resistance required for lead frames, terminals, and connectors. Therefore, the Fe content needs to be 0.2 wt% or more. On the other hand, if the Fe content exceeds 3.0% by weight, a large amount of coarse Fe crystallized substances are generated, and these crystallized substances hardly contribute to the improvement in strength, but rather deteriorate the bending workability and press-punch. The Fe content must be less than 3.0% to sometimes wear the mold. Therefore, the Fe content is set to 0.2 to 3.0 wt%. A desirable range in this range is 0.5 to 2.6 wt%, and a more desirable range is 1.0 to 2.1 wt%.

<P content> P forms a stable intermetallic compound with Fe and precipitates in a Cu matrix to improve the proof stress and heat resistance of the copper alloy. Furthermore, Ni, Co, C
By generating a compound with r and Mg, it precipitates in the alloy and improves the shearing workability. However, when the content of P is 0.2
If the content exceeds wt%, the hot workability decreases. On the other hand, P
Is less than 0.001 wt%, deoxidation during melting and casting is insufficient, and the viscosity of the molten metal increases. As a result, the oxide is easily entrained during casting, and the entrained oxide becomes a product defect. Therefore, a sound ingot cannot be obtained, which is not preferable. Therefore, the content of P is 0.001-0.
2 wt%. A more preferred range is P: 0.01 to
0.1 wt%.

<Zn Content> Zn improves the effect of reducing the wear of the press die, prevents migration, and improves the heat-peeling resistance of copper alloy solder and Sn plating. If the Zn content is less than 0.05 wt%, the desired effect cannot be obtained.
On the other hand, if the content exceeds 1.0% by weight, the solder wettability decreases. In addition, the decrease in conductivity also becomes severe. Therefore, the content of Zn is set to 0.05 to 1.0 wt%. A more preferred range is 0.1 to 0.3 wt%.

<Ni, Co, Cr, Mg content> Ni, C
o, Cr, and Mg generate a compound with P and precipitate in the alloy to improve the shearing property (press punching property and the like).
If this compound is dispersed in the alloy, there is no metallurgical continuity with the base material, so stress will be concentrated during shearing and it will be a source of micro cracks, significantly improving the shearability. Can be. This effect is remarkably exhibited when the total of one or more of these elements is 0.01% by weight or more. However, compared to the Fe-P compound, it is easy to precipitate as a coarse compound, and the coarse precipitate exerts a pinning effect when the crystal grows. At this time, if the distribution of the coarse precipitates is not uniform, the crystal growth becomes uneven when heat treatment is performed, and as a result, a mixed grain structure is likely to be formed. This phenomenon becomes significant when one or more of Ni, Co, Cr, and Mg exceeds 0.5 wt%. Therefore, one or two of Ni, Co, Cr, and Mg
The total of the species or more is 0.01 to 0.5 wt%. A more desirable range is 0.02 to 0.3 wt%.

<Fe quantity conditional expression> P is Fe, Ni, Co,
Both Cr and Mg form compounds and precipitate in the base material. However, when the content of the above-mentioned element contained as an additional element or an unavoidable impurity satisfies the above-mentioned conditional expression, a substance that precipitates as Fe alone without generating a compound with P appears. The Fe precipitated as a simple substance has the effect of increasing the strength and increasing the heat resistance as compared with the precipitation as an Fe-P compound. On the other hand, in order to respond to recent demands for reducing the weight and thickness of various electric and electronic devices and improving the mounting density, a technique for reducing residual stress generated by shearing during press punching has been developed and has become popular. In this technique, when punching a lead, a heat treatment is performed once for a short time of several seconds to several minutes while the tip of the lead is not cut off and cut off to release the residual stress generated when the side surface of the lead is pulled out. Thereafter, when the residual stress is reduced, the tip of the lead is cut off to ensure flatness. In order to apply this technology, high heat resistance is required so that the material itself does not soften due to annealing during the punching process. When the composition of the copper alloy plate satisfies the above condition of the amount of Fe, it is possible to meet this requirement. Therefore, the composition of the copper alloy sheet according to the present invention is F
e It was assumed that the condition expression was satisfied. If there are Al, Sn, Mn, Zr, In, and Ti, which will be described later,
The heat resistance can be dramatically increased, which is optimal when heat treatment is performed during press punching.

<Average grain size, degree of sizing> The alloy of the present invention is heat-treated, cold-rolled or cold-rolled, and then subjected to a low-temperature-short-time heat treatment for improving elongation, tension-annealed, or a tension leveler. In any case, the crystal grain size in the sheet width direction measured on the rolled surface has an average value of 3 to 60 μm and the degree of sizing (80 to 120% of the average crystal grain size). (The ratio of the number of grains to the total number of crystal grains) must be 70% or more. Here, the reason why the crystal grain size in the sheet width direction is measured on the sheet surface is that the crystal grain size in the sheet width direction hardly changes even after annealing and subsequent rolling.

The reason why the average value of the crystal grain size is limited to 3 to 60 μm is that when the crystal grain size is less than 3 μm, the bending workability is rather deteriorated. This is because it becomes defective, and the sagging width and sagging height during press punching are large and non-uniform (for this reason, when the sagging part is viewed from diagonally above or below, the sagging part appears to be a series of irregularities. ... It is also said that the linearity of the sagging portion is poor). The reason why the sizing degree is limited to 70% or more is that if it is less than 70%, bending workability, press punching workability, and strength of the material decrease. Further, the average crystal grain size is more preferably 5 to 40 μm, and the degree of sizing is more preferably 80% or more. Within this range, press punching workability and bending workability are further improved. The average crystal grain size is measured by a cutting method defined in JIS H0501, using an optical microstructure photograph of a sample whose surface has been etched. The degree of sizing can be determined by analyzing the structure photograph with an image analyzer.

<Amounts of Al, Sn, Mn, Zr, In, and Ti> Al, Sn, Mn, Zr, In, and Ti not only improve the strength by forming a solid solution in the alloy but also improve the Fe precipitates (Fe And / or a Fe-based intermetallic compound) in which the heat resistance is dramatically improved. In order to remove the residual stress generated by the shearing process of press punching, it is important to heat the material so that dislocations in the material can be easily moved. The residual stress is removed by the dislocation movement. However, when dislocations move, the dislocations annihilate and the dislocation density decreases. In other words, the work-hardened material is softened by the introduction of dislocations. At this time, Al, Sn, Mn, Zr, I
When n and Ti are in solid solution, the affinity between these atoms and vacancies is strong, and these atoms fill the vacancy sites. As a result, the amount of vacancies in the alloy is reduced. For this reason, it is difficult for the dislocation ascending motion to occur, and the dislocations trapped in the Fe precipitates are less likely to move. As a result, dissociation of dislocations is suppressed, and the heat resistance is increased. This characteristic is similar to Al, Sn,
If the total of one or more of Mn, Zr, In, and Ti is less than 0.005 wt%, it is not sufficient, and 0.5 wt%
Exceeding the ratio is not preferred because the conductivity is lowered and the solder wettability is lowered. Therefore, the content of one or more of these elements is 0.005 to 0.5 wt%.
And A more desirable range is 0.02 to 0.3 wt%.

<O content> O easily reacts with P. O is 1
If it exceeds 00 ppm, the reacted P is Ni as described above,
Compounds with Co, Cr and Mg cannot be formed. As a result, the effect of improving the shearability cannot be obtained. O is S
easily reacts with i.
Oxides are formed in large amounts and the cleanliness of the ingot is impaired.
Therefore, the content of O is set to 100 ppm or less, more preferably, 30 ppm or less. <H content> H is, when the O content is 10 ppm or more,
When the amount of H exceeds 10 ppm, it is combined with O in the cooling process during casting to form steam, and this steam causes blowhole defects in the ingot. Therefore, the content of H is defined as "10 ppm or less, preferably 4 ppm or less, more preferably 2 ppm or less."

<Si Content> Si forms a stable intermetallic compound with Fe similarly to P, and precipitates in the parent phase of Cu to improve the heat resistance particularly of the copper alloy. Therefore, instead of part or all of P in the above range, or in addition to P in the above range, Si
Can be added. However, Si is 0.3wt%
If the ratio exceeds the above range, the electrical conductivity is greatly reduced, which is not preferable. On the other hand, Si has a deoxidizing effect like P, and if the total amount of P and Si is less than 0.001 wt%, deoxidation during melting casting becomes insufficient and the viscosity of the molten metal increases. As a result, the oxide is easily entrained during casting, and the entrained oxide becomes a product defect. Therefore, a sound ingot cannot be obtained, which is not preferable. Therefore, when adding Si, P:
0.2 wt% or less (preferably 0.01 to 0.1 wt%
%), Si: 0.3 wt% or less, and the total amount of P and Si is 0.001 wt% or more. Preferably, Si: 0.
005 to 0.1 wt%, the total amount of P and Si is 0.02 to
0.1 wt%. When Si is present, an Fe-Si intermetallic compound is formed in accordance with the amount of Si, but as long as the composition of the copper alloy satisfies the above-mentioned conditional expression, high strength and high heat resistance are equivalent. Action is obtained.

<Cold work ratio until the first recrystallization heat treatment>
The copper alloy of the present invention is produced, for example, by hot rolling, cold rolling, heat treatment for causing recrystallization, and if necessary, further combining cold rolling or / and heat treatment to produce a sheet. One method for obtaining a grain-sized structure defined in the above-mentioned range of crystal grain size in the state of use is to reduce the cold working ratio from the time when hot rolling is completed to the first heat treatment for causing recrystallization to be 90%. % Or less. In the Fe-containing copper alloy having the composition of the present invention, during the heat treatment, recrystallization-coarse grain coarsening and precipitation of Fe and / or Fe-based intermetallic compounds proceed simultaneously, and a mixed grain structure is easily formed.
When the cold work exceeds 90% from the end of hot rolling to the first heat treatment for causing recrystallization, the number of sites to be recrystallized and precipitated increases due to the introduced transitions and point defects. The reaction rate of grain coarsening and precipitation sharply increases. Therefore, if the cold working ratio exceeds 90%, it becomes difficult to obtain a grain-sized structure defined in the above-described crystal grain size range, no matter how the heat treatment conditions are modified except for the special heat treatment conditions described below. Once a mixed grain structure is formed by this heat treatment, it becomes difficult to obtain a grain sized structure by a subsequent thermomechanical treatment.

The first heat treatment for producing recrystallization after hot rolling may be performed, for example, at 450 to 600 ° C. for 30 minutes to 10 hours. More preferably, 500 to 600 ° C x 1 to 5
Time. However, the heat treatment time is a holding time after a predetermined temperature is reached. Heating rate is 0.1 ° C / sec
Less than c is appropriate. This heat treatment also serves as an aging treatment. After this heat treatment, a heat treatment for precipitation can be further performed as necessary. In the case of heat treatment at a temperature and time not accompanied by recrystallization, from the time when hot rolling is completed to the first heat treatment for causing recrystallization,
Even if the heat treatment is performed one or more times, the effect of the present invention is not impaired. Further, once this heat treatment is performed to obtain the above-mentioned grain sized structure, if heat treatment without cold working and / or recrystallization (for example, precipitation treatment, low-temperature annealing) is performed thereafter, of course, It is easy to maintain a sized structure even when a heat treatment involving crystals is performed.

<Conditions for Rapid Heating Treatment Prior to Aging Treatment> Another method for bringing the copper alloy of the present invention into a grain-sized structure defined in the above-mentioned crystal grain size range in a state of use is cold rolling. Prior to the aging treatment, heating is performed more rapidly than in the normal aging treatment, and recrystallization is performed in a short time. This method can also be applied to a manufacturing method in which hot rolling is omitted (for example, use of a continuous thin sheet material), and the working ratio of cold rolling before heat treatment for recrystallization may exceed 90%. . This rapid heating treatment also starts after cold rolling,
This is performed as a first heat treatment for causing recrystallization (if the heat treatment is performed at a temperature and time without recrystallization, one or more heat treatments are performed after the start of cold rolling and before the rapid heating treatment. However, the effect of the present invention is not inhibited). The reason for setting the heating temperature to 450 ° C. or higher in this method is that if the temperature is lower than 450 ° C., the temperature is raised at a rate of 0.1 ° C./second or higher, and recrystallization does not occur even if the temperature is maintained for 5 seconds or longer.
When heating to a temperature exceeding 950 ° C., the heating time is reduced to 5 hours.
This is because the recrystallized grains become coarse even in seconds, and the desired good bending workability and stamping property cannot be obtained. Therefore, the heating temperature range is 450 to 950 ° C. Preferably, it is 600 to 800 ° C. The reason why the heating rate is set to 0.1 ° C./sec or more is that when the heating rate is less than 0.1 ° C./sec, precipitation starts to occur during heating, and a difference occurs in the growth rate of the crystal grains, and the fine crystal grains and This is because a mixed grain structure of crystal grains is formed. Therefore, the heating rate must be at least 0.1 ° C./sec. Preferably it is 0.5 ° C./sec or more.

Further, even if heating under the above conditions, if the holding time is less than 5 seconds, the desired recrystallized structure cannot be obtained,
Even if the temperature is maintained for more than 10 minutes, the growth of crystal grains is stopped, or the crystal grains are rather coarsened. Therefore, the holding time is 5 seconds to 10 minutes. 10 seconds to 5 minutes are more preferred. In addition,
For example, a continuous annealing furnace may be used for the heat treatment for obtaining a grain-sized structure, and a reducing atmosphere (for example, a nitrogen-hydrogen mixed gas atmosphere) is used to prevent surface oxidation and internal oxidation of the material.
In order to prevent precipitation during cooling, it is desirable to rapidly cool after heating. If the cooling rate to room temperature is 5 ° C./sec or more, good characteristics can be obtained by the subsequent aging treatment.

Thereafter, the material having the sized structure is aged. A batch heating type bell furnace or the like is usually used for this aging treatment, but a continuous heat treatment furnace may be used when conductivity is not particularly required. In the case of batch heating,
350 to 650 in which Fe and / or Fe compounds are deposited
A step of heating the material at a temperature of about 1 to 30 hours is employed.
In addition, if the working ratio is 50% or less between the rapid heating treatment for obtaining the grain size structure and the subsequent aging treatment, even if cold rolling is performed, the effect of the present invention is not impaired. In addition,
This cold rolling introduces dislocations and point defects in the material, and
Or / and increase the Fe compound precipitation efficiency,
This is performed to complete the aging precipitation in a shorter time and to increase the conductivity. If the working ratio exceeds 50%, the crystal structure recrystallized to a predetermined degree of sizing by the rapid heating described above starts to locally recrystallize even during aging precipitation, deviating from the desired degree of sizing. . As a result, desired press punching properties cannot be obtained.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments 1 to 3 of the present invention will be described below. In each example, the crystal grain size and sizing degree, tensile strength, electrical conductivity, pressability, bending workability, and solder wettability were investigated by the following methods. (Measurement of crystal grain size and distribution) The crystal grain size was determined by polishing the surface of the sample, etching it, taking an optical micrograph, and using the micrograph of the structure to determine the cutting method specified in JIS H0501. ). The same sample was observed in five visual fields, and the average value was defined as the crystal grain size of each sample. The distribution of the crystal grain size was analyzed by using an image analyzer for the above structure photograph. That is, the length of a line segment crossing a crystal grain in the plate width direction was measured for 300 or more crystal grains, and their average value and frequency distribution were obtained. The sizing degree shown in Table 1 indicates that the average crystal grain size is 80 to 1 based on the frequency distribution.
The number of crystal grains having a size of 20% was obtained, and the number was calculated as a ratio (%) to the total number of crystal grains.

(Tensile Strength) A JIS No. 5 test piece with the longitudinal direction of the test piece parallel to the rolling direction was prepared and measured. (Conductivity) Strip-shaped test piece is processed by milling,
It was measured by a double bridge type resistance measuring device. (Heat-resistant temperature) The temperature at which the decrease in Hv after heating for 5 minutes is 20% of Hv before heating is referred to as the heat-resistant temperature.

(Press punching property) The burrs were evaluated by punching a lead having a width of 0.3 mm by a mechanical press and measuring the burring height of the punched lead. The burrs were observed by observing the burrs of the ten leads with a scanning electron microscope, and indicated by the average of the maximum burrs. Dare's evaluation is
Punch 0.3mm width lead by mechanical press,
The sagged portion of the punched lead was visually observed obliquely from above or from below by an optical microscope, and the unevenness level of the sagged portion was evaluated in three stages. (Bending workability) Work was performed by a method of JIS H3130 using a W-shaped bending jig having a bending radius equal to the plate thickness.
The W-bent portion after processing was visually observed, and the workability was evaluated based on the presence or absence of rough skin and cracks.

(Solder wettability) A weakly active flux was applied to a strip-shaped test piece, immersed in a solder bath (Sn / Pb = 60/40) maintained at 245 ± 5 ° C. for 5 seconds, and then pulled up to a test piece. The state of solder adhesion was observed, and evaluation was made based on the presence or absence of deviation and the presence or absence of repelling. (Solder heat-resistant peeling) Solder bath (Sn / P) coated with a weakly active flux on a strip-shaped test piece and kept at 245 ± 5 ° C.
b = 60/40) and then heated to 1000 hr in a 150 ° C. oven. This test piece was
A process was performed at 0 ° bending back, and it was observed whether the solder in the processed portion was peeled off.

Example 1 A copper alloy having a chemical composition shown in Table 1 was placed in an electric furnace in air at a thickness of 50 mm and a width of 80 m.
m, melted into a 200 mm long ingot, and after heating this ingot at 900 to 1000 ° C. for 1 hour, the thickness was 12 m.
m. Next, the surface of the hot-rolled material was chamfered to remove an oxide film, and the subsequent cold working rate was set to 2.5 mm (80%) so as to meet the conditions shown in Table 2.
Finished by facing to 5 mm (90%) and 10 mm (95%). And cold rolling was performed to 0.5 mm. In addition,
The sheet thickness was finished by facing to adjust the processing rate up to the heat treatment to the conditions in Table 2, but the sheet thickness at the end of hot rolling was as shown in Table 2.
(The same applies to the second and third embodiments).

[0030]

[Table 1]

After that, heating is performed for a short period of time in Table 2.
Condition (heating temperature and holding time after reaching that temperature)
Subsequently, the aging precipitation heat treatment was performed under the conditions shown in Table 2. In the case where heating was not performed for a short time, only the aging precipitation heat treatment accompanied by recrystallization was performed. After that, processing rate 50%
Was subjected to cold rolling to produce a test piece having a thickness of 0.25 mm, and the above test was performed. The heating rate for rapid short-time heating was 5 ° C / sec, and the cooling rate after short-time heating was 10 ° C.
° C / sec or more, and the temperature rise rate of the aging precipitation heat treatment is 0.01
° C / sec.

[0032]

[Table 2]

As is evident from Table 2, No. 1 included in the present invention. Nos. 1 to 7 reduce the rate of cold working from the time of completion of hot rolling to the first heat treatment for causing recrystallization to be 90% or less (Nos. 1, 4, and 5), or rapid heating and aging. The combination of the precipitation heat treatments provided fine crystal grains that had been sized, and had excellent press punching properties and good bending workability. On the other hand, no. 8 to 15
Cannot adjust the sample or is inferior in either property. For example, those that do not satisfy the condition of Fe amount (Nos. 8, 15) are inferior in strength and heat resistance.

Example 2 A copper alloy having a chemical composition shown in Table 3 was placed in an electric furnace in air at a thickness of 50 mm and a width of 80 m.
The ingot was melted into an ingot having a length of 200 mm and a length of 200 mm. Thereafter, the ingot was heated at 900 to 1000 ° C. for 1 hour, and then finished to a thickness of 12 mm by hot rolling. Next, the surface of the hot-rolled material was chamfered to remove an oxide film, and the subsequent cold working rate was set to 2.5 mm (8 mm) so as to meet the conditions shown in Table 4.
0%), 5 mm (90%), and 10 mm (95%). And cold rolling was performed to 0.5 mm.

[0035]

[Table 3]

As shown in Table 4, when heating was performed for a short time in a short time, the heating rate was 5 ° C./sec and the heating temperature was 760.
Heating was carried out rapidly for a short time at 30 ° C. for a holding time of 30 sec, quenched in water, subsequently heated to a heating temperature of 550 ° C. at a heating rate of 0.01 ° C./sec, and kept at 4 hours for aging precipitation heat treatment. In the case where heating was not performed for a short time, only the aging precipitation heat treatment accompanied by recrystallization was performed. After that, processing rate 5
A test piece having a thickness of 0.25 mm was prepared by performing 0% cold rolling, and the crystal grain size / distribution was measured and each characteristic was investigated.

[0037]

[Table 4]

As is evident from Table 4, each component contained No. 3 within the range specified in the present invention. Nos. 16 to 20 exhibit fine crystal grains whose cold rolling reduction rate until heat treatment is set to 90% or less or a combination of rapid short-time heating and aging precipitation heat treatment, and are excellent in press punching property. At the same time, bending workability and solder wettability indispensable for copper alloys for electric / electronic parts were also good. On the other hand, No. 21 is Ni, Co, C
Since the total amount of one or more of r and Mg is small,
Burr height is no. Not as small as 15-20. No. 2
In No. 2, since the total amount of one or more of Ni, Co, Cr, and Mg is large, the crystal structure becomes coarse, and the press punching property (unevenness of the sagging portion) and the bending workability are inferior. No. 2
No. 4 has a low conductivity and a poor solder wettability because the total amount of one or more of Al, Sn, Mn, Zr, In, and Ti is large. No. 23 is Al, Sn, Mn, Z
r, In, and Ti, the total amount of one or more of them is small. High heat resistance of about 16 to 20 is not obtained. No. No. 25 has a large O content, 16-20
Burr height is not so small. In addition, No. Sample No. 26 could not be adjusted because of ingot defects.

[Example 3] Chemical composition: Cu-2.1wt
% Fe-0.03 wt% P-0.2 wt% Zn copper alloy in air at 50 mm thickness and 80 m width
m, and ingot into a 150 mm long ingot, after which the ingot was heated at 900 ° C. for 1 hour and then hot rolled to a thickness of 12 mm.
mm. Next, the surface of the hot-rolled material was chamfered to remove an oxide film, and the subsequent cold-working rate was set to 2.5 mm (80%) so as to meet the conditions shown in Table 5.
mm (90%) and 10 mm (95%). And cold rolling was performed to 0.5 mm.
After that, heating in a short time is carried out under the conditions shown in Table 5 (heating temperature and holding time after the temperature is reached), followed by a heating rate of 0.01 ° C./sec and a heating temperature of 5 ° C.
The aging precipitation heat treatment was performed at 50 ° C. and a holding time of 4 hours.
In the case where heating was not performed for a short period of time, only the aging precipitation heat treatment accompanied by recrystallization was performed under the above conditions. After that, processing rate 50%
Was cold rolled to produce a test piece having a thickness of 0.25 mm, and the measurement of the crystal grain size and distribution and the investigation of each characteristic were carried out.

[0040]

[Table 5]

As is evident from Table 5, No. 1 included in the present invention. Nos. 27 to 34 exhibit fine crystal grains sized by a combination of an appropriate processing rate, rapid short-time heating, and aging precipitation heat treatment. It was good. In addition, it is shown that the degree of crystal grain refinement and sizing is increased as the heating rate of rapid short-time heating is increased. On the other hand, no. In No. 35, since the cold working ratio from hot rolling exceeded 90%, the degree of sizing was reduced and the mixture was in a mixed state, so that the unevenness of the sagged portion due to press punching was severe, and even in bending. The skin became rough. No. No. 36 shows a case where the heating rate of the rapid short-time heating is small, and sufficient grain refinement and sizing cannot be obtained, so that the unevenness of the sagged portion due to press punching is also severe and the skin becomes rough even in bending. Occurred. No.
In No. 37, the heating temperature of the rapid short-time heating was 350 ° C. and the recrystallization did not occur, resulting in a mixed-grained state. No. In No. 38, the heating temperature for rapid short-time heating was as high as 1000 ° C., and the crystal was coarsened, so that the unevenness of the sagged portion due to press punching was severe, and the surface was roughened by bending. No. Reference numeral 39 denotes an example in which the heating time of rapid short-time heating was long and the crystal was coarsened. Similarly, the unevenness of the sagged portion due to press punching was severe, and the surface was roughened by bending.

[0042]

According to the present invention, it is possible to obtain a high-strength, highly-conductive copper alloy excellent in press punching properties and bending workability. Further, according to the present invention, a material having an appropriate crystal grain size and a high degree of sizing can be obtained, so that manufacturing defects (rolling / slitter defects) can be reduced. Therefore, the present invention has tremendous effects such as improvement in product yield and productivity and quality during processing.

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Claims (7)

[Claims] 1. Fe: 0.2 to 3.0 wt%, P: 0.
001 to 0.2 wt%, Zn: 0.05 to 1.0 wt%
And the balance of Fe is satisfied, and the balance is substantially composed of Cu and a copper alloy that is an unavoidable impurity.
And / or an Fe-based intermetallic compound is precipitated, the average crystal grain size in the sheet width direction of the rolled surface is 3 to 60 μm, and the number of crystal grains having a size of 80 to 120% of the value is the total crystal grain size. 70
% Or higher, a high-strength and high-conductivity copper alloy plate. [Fe] −3.6 × ([P] −0.18 × [Ni] −0.26 ×
[Co] −0.20 × [Cr] −0.85 × [Mg]) ≧ 0.5 where [Fe], [P], [Ni], [Co], [C
[r] and [Mg] represent wt% of each element in the copper alloy. 2. High strength and high conductivity according to claim 1, wherein one or more of Ni, Co, Cr and Mg are contained in a total amount of 0.01 to 0.5 wt%. Copper alloy plate. 3. The method according to claim 1, further comprising Al, Sn, Mn, Zr, and I.
one or more of n and Ti in total of 0.005 to
3. The composition according to claim 1, wherein the content is 0.5 wt%.
High-strength, high-conductivity copper alloy plate described in. 4. O: 100 ppm or less, H: 10 ppm
The high-strength and high-conductivity copper alloy plate according to any one of claims 1 to 3, wherein: 5. Si is contained in place of part or all of P or in addition to P, Si: 0.3% or less, and P and S
The high-strength and high-conductivity copper alloy sheet according to any one of claims 1 to 4, wherein the total amount of i is 0.001 wt% or more. 6. The method according to claim 1, wherein a cold working rate from a time point when the hot rolling is completed to a heat treatment for generating recrystallization for the first time is 90% or less. Manufacturing method of high strength and high conductivity copper alloy sheet. 7. Prior to aging treatment for precipitating Fe or / and an Fe-based intermetallic compound, the temperature is raised to a temperature range of 450 to 950 ° C. at a rate of 0.1 ° C./sec or more, and the temperature is increased for 5 seconds. After recrystallization by holding for 10 minutes, Fe or /
A method for producing a high-strength and high-conductivity copper alloy sheet according to any one of claims 1 to 5, wherein an aging treatment for precipitating an Fe-based intermetallic compound is performed.