JP2000055971A - Board inspection apparatus and method for adjusting relative position of board to inspection head in board inspection apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board inspection apparatus by which the operating burden of an operator is reduced and by which the inspection of a board can be executed with high accuracy by a method wherein the relative positional relationship between the board and an inspection jig is found automatically. SOLUTION: Until a board positioning mark 2A and a board positioning mark 2B on a board 2 are situated on the optical axis OA1 of a main camera 44 on the basis of the image of the main camera 44, a conveyance-table driving mechanism and an X-jig drive part are driven and controlled, and a conveyance table 5 and an inspection jig 41 are moved. In this state, the coordinate values of the board positioning marks 2A, 2B are measured on the basis of an amount by which the conveyance table 5 and the inspection jig 41 are moved from the design center 5C (which agrees with the origin O in a reference coordinate system). Then, on the basis of the coordinate values of the marks 2A, 2B, the displacement amount of the board 2 with reference to the design center of the board 2 is found. The position correction amount of the inspection jig 41 with reference to the board 2 is found on the basis of the displacement amount. Then, the inspection jig 41 is moved so as to correct its position, and the conveyance table 5 is moved simultaneously to the Y-direction by a prescribed distance. Thereby, the circuit pattern of the board 2 and the inspection jig 41 (the contact) can be positioned with high accuracy.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board inspection apparatus for inspecting a circuit pattern formed on a printed circuit board by bringing a contact into contact with the circuit pattern.

A printed circuit board is a mounting board on which an IC, a capacitor, and a resistor are already mounted, and the IC
And a bare substrate on which no capacitors, resistors, and the like have been mounted yet. In this specification, a printed circuit board will be simply referred to as a board.

[0003]

2. Description of the Related Art Japanese Patent Application Laid-Open No. 5-73149 and Japanese Patent Application Laid-Open No. 6-118115
Is described in Japanese Patent Application Publication No. The board inspection apparatus described in these publications is a dedicated inspection apparatus that places a substrate to be inspected on a transport table and places the transport table directly below an inspection head (hereinafter referred to as an inspection jig). After being moved to the position, the inspection jig is lowered to the transfer table side so that contacts such as checker pins and probe pins attached to the inspection jig contact the circuit pattern formed on the substrate, and the Inspection is underway.

As described in Japanese Patent Application Laid-Open No. 3-229167 and Japanese Utility Model Application Laid-Open No. 5-40893, a general-purpose board inspection apparatus is programmed in advance according to a circuit pattern of a board to be inspected. The inspection is carried out by moving the pair of contacts to a required inspection position in the same manner.

[0005] In any of the above types of inspection apparatus,
The board is always at the design position on the transfer table (design position)
When the transport table is moved to a predetermined target position immediately below the inspection jig, the inspection jig (contact) and the circuit pattern are positioned with respect to each other so that accurate inspection can be performed. Although it can be performed, it is practically difficult to prevent the displacement of the substrate on the transfer table.

Therefore, in these prior arts, a camera is installed in the board inspection apparatus, the camera picks up a board positioning mark formed in advance on the board, and based on the mark image, the board mounted on the transfer table. Is obtained. Then, the displacement of the inspection jig or the transfer table is controlled in accordance with the positional deviation thus obtained, and the positional deviation is corrected to match the relative relationship between the inspection jig (contact) and the substrate.

[0007]

In the above-mentioned prior art, the amount of displacement of the substrate is obtained by imaging the substrate positioning mark with a camera, and the position of the inspection jig or the transfer table is controlled by controlling the amount of movement of the transfer table. Since the shift amount is corrected, the relative positional relationship between the camera and the inspection jig needs to be determined in advance. Therefore, in a conventional board inspection apparatus, prior to the actual inspection, the board is placed on a transfer table, and the inspection jig (contact) is brought into contact with a circuit pattern formed on the board so as to make accurate contact. The camera position is adjusted so that the substrate positioning mark of the substrate is positioned on the optical axis of the camera.

[0008] Such work is performed by an operator, which increases the work load of the operator and is one of the factors that reduce the efficiency of the board inspection work.

Even if the camera position is adjusted, the dedicated inspection apparatus needs to adjust the camera each time the inspection jig is replaced for a different type of substrate inspection or the like. This is because the inspection jigs have individual variations. Furthermore, even before the inspection jig is replaced, the optical axis of the camera changes over time while the inspection is continuously or intermittently repeated, and the relative positional relationship between the camera and the inspection jig is changed. In some cases, the inspection accuracy may be reduced and the inspection accuracy may be reduced. Therefore, it is necessary for the operator to adjust the camera position at an appropriate timing, which results in imposing a large work load on the operator.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and reduces the operator's work load by automatically determining the relative positional relationship between a substrate and an inspection jig (contact). Further, it is an object of the present invention to provide a board inspection apparatus capable of accurately positioning a board and an inspection jig (contact) based on the relative positional relationship and performing board inspection with high accuracy.

[0011]

SUMMARY OF THE INVENTION The present invention conveys a substrate to be inspected in a substrate inspection apparatus for inspecting conductivity between specific points on a circuit pattern of a substrate having at least one pair of contacts. A table, an inspection head having the contact, a first measurement system for determining a relative position between the table and the inspection head in two-dimensional and angular directions, and a first measurement system for determining a relative position between the table and the substrate in two-dimensional and angular directions. And a first relative positional relationship between the table and the inspection head according to the relative position determined by the first and second measurement systems for inspecting the substrate. This is a substrate inspection apparatus provided with a drive system for setting the following (claim 1).

According to the present invention, the first measurement system can determine the relative position between the table and the inspection head in the two-dimensional and angular directions. Also, the second
A measurement system can determine the relative position between the table and the substrate in two dimensions and in angular direction. A first relative positional relationship between the table and the inspection head is determined according to the relative positions determined by the first and second measurement systems. Then, a first relative positional relationship between the table and the inspection head is set by the drive system.

A method for adjusting a relative position between a substrate to be inspected and an inspection head of a substrate inspection apparatus, wherein the substrate on which a circuit pattern is formed is inspected relative to an initial position placed on a table. The inspection head is electrically connected to a specific point of the circuit pattern, and includes a plurality of contacts for detecting conductivity between the points. Determining a relative positional relationship between the table and the inspection head with respect to dimensions and an angular direction, determining a relative positional relationship between the table and the substrate, moving the table relative to the inspection head, The relative position between the substrate and the inspection head in a substrate inspection apparatus that controls a relative movement amount according to a relative positional relationship between the inspection heads and the table and the substrate. A settling method (claim 15).

According to the present invention, the relative positional relationship between the table and the inspection head in two-dimensional and angular directions is determined. Further, a relative positional relationship between the table and the substrate in two-dimensional and angular directions is determined. Then, the table is relatively moved with respect to the inspection head, and a relative movement amount is controlled in accordance with a relative positional relationship between the table and the inspection head, and between the table and the substrate, and a relative position between the substrate and the inspection head is adjusted. Is to adjust.

[0015]

FIG. 1 is a side sectional view showing an embodiment of a substrate inspection apparatus according to the present invention, and FIG.
FIG. 2 is a plan view of the substrate inspection apparatus of FIG. In order to clarify the directional relationship with each drawing described later, XYZ rectangular coordinate axes are shown.

As shown in these figures, in this board inspection apparatus, an opening / closing door 11 is attached to the apparatus body 1 on the front side (−Y side) of the apparatus so as to be openable and closable.
1, a board 2 such as a printed board to be inspected can be carried into a carry-in / carry-out section 3 provided at a central portion on the front side of the apparatus. An inspection section 4 for inspecting the substrate 2 is provided on the rear side (+ Y side) of the carry-in / out section 3. The inspection section 4 is inspected by a scanner 74 which is electrically connected to the inspection section 4, and performs inspection of the substrate. After the pass / fail judgment is made, the inspected substrate 2 is returned to the carry-in / out section 3 again, and can be carried out by the operator via the opening / closing door 11. In this embodiment, the loading and unloading of the substrate 2 is performed manually by an operator.
Direction), a substrate loading mechanism for receiving the substrate 2 from the external device and loading and unloading the substrate 2 before inspection is provided in the loading / unloading unit 3, and receiving the inspected substrate 2 from the loading / unloading unit 3 on the other side. The substrate can be automatically transferred by additionally providing a substrate unloading mechanism for unloading the substrate.

In this board inspection apparatus, the transfer table 5 is used to transfer the board 2 between the carry-in / out section 3 and the inspection section 4.
Are provided so as to be movable in the Y direction, and are configured to be moved and positioned in the Y direction by the transport table drive mechanism 6. That is, the transport table driving mechanism 6
In this embodiment, two guide rails 61 extending in the Y direction are arranged at a predetermined interval in the X direction, and the transport table 5 is slidable along the guide rails 61. In addition, these guide rails 61,
A ball screw 62 is disposed in parallel with 61. One end (−Y side) of the ball screw 62 is supported by the apparatus main body 1, and the other end (+ Y side) of the motor 63 for driving the transport table is rotated. It is connected to the shaft 64. Further, a bracket 65 to which the transfer table 5 is fixed is screwed to the ball screw 62. For this reason, when the motor 63 is driven to rotate in accordance with a command from the control unit, which will be described later, the transport table 5 moves in the Y direction according to the amount of rotation, and reciprocates between the carry-in / out unit 3 and the inspection unit 4. I do. The details of the transport table 5 will be described later.

In the inspection section 4, an upper inspection unit 4U for inspecting a circuit pattern formed on the upper surface side of the substrate 2 on the upper side (+ Z side) with the moving path of the transport table 5 interposed therebetween.
On the other hand, a lower inspection unit 4D for inspecting a circuit pattern formed on the lower surface side of the substrate 2 is disposed below (−Z side). These inspection units 4
U and 4D have the same configuration, and are symmetrically arranged with the moving path of the transport table 5 interposed therebetween. Therefore, here, the configuration of the upper inspection unit 4U will be described, and the lower inspection unit 4D will be denoted by the same reference numerals and description thereof will be omitted.

In the upper inspection unit 4U, a plurality of contacts 42 are held by an inspection head 41 (hereinafter, referred to as an inspection jig 41). The tips of the contacts 42 project from the inspection jig 41 toward the transfer table 5 side, and are connected to the inspection jig 41 by an inspection head driving mechanism 43 (hereinafter, the inspection jig driving mechanism 43). Is controlled relative to the substrate 2 to be inspected, as described later, so as to come into contact with a circuit pattern on the substrate 2.

As shown in FIG. 3, the inspection jig driving mechanism 43 includes an X jig driving section 43X for moving the inspection jig 41 in the X direction with respect to the apparatus main body 1, and an X jig driving section 43X. A Y jig driving unit 43Y connected to move the inspection jig 41 in the Y direction, and a θ jig driving unit 43θ connected to the Y jig driving unit 43Y to rotate the inspection jig 41 around the Z axis.
And the inspection jig 41 connected to the θ jig driving section 43θ
The jig driving unit 43Z moves the inspection jig 41 relative to the transport table 5 or moves the inspection jig 41 up and down (Z direction). It is configured such that the contact 42 can be brought into contact with or separated from the circuit pattern formed on the substrate 2. It should be noted that among these driving units, X
The main camera 44 is mechanically connected to the jig driving unit 43X, and is configured to move in the X direction integrally with the inspection jig 41.

As shown in the drawing, a camera 45 for checking the alignment between the substrate 2 and the inspection jig 41 is provided inside the inspection jig 41. The substrate positioning mark of the substrate 2 placed on the transport table 5 can be imaged through a through-hole 46 for alignment confirmation formed in the inspection jig 41 so as to face. Reference numerals 47A and 47B in the figure denote jig positioning marks provided symmetrically in the X direction with respect to the design center of the inspection jig 41, and are provided on the inspection jig 41 so as to face the transport table 5. ing.

Next, the configuration of the transport table 5 will be described in detail with reference to FIGS. This transport table 5
As shown in FIG. 4, is composed of a substrate mounting portion 51 for mounting the substrate 2 and an auxiliary camera holding portion 52 projecting from the substrate mounting portion 51 in the (+ Y) direction. . In the substrate mounting portion 51, the mounted substrate 2 is engaged with the three engagement pins 53, and the substrate 2 is engaged by urging means (not shown) from a direction facing the engagement pins 53. The substrate 2 can be held on the substrate mounting portion 51 by being urged toward the mating pin 53 side. Further, in order to bring the contact 42 of the lower inspection unit 4D into contact with the circuit pattern formed on the lower surface of the substrate 2 (two-dot chain line in FIG. 4) held in this manner, a through-opening is formed in the substrate mounting portion 51. 54 are formed.

The auxiliary camera holder 52 picks up jig positioning marks 47A and 47B (only 47A is shown in FIG. 4) formed on the inspection jig 41 of the upper inspection unit 4U. An auxiliary camera 55 for performing
An auxiliary camera 56 for imaging the jig positioning marks 47A and 47B formed on the inspection jig 41 of the lower inspection unit 4D is arranged in the X direction. Auxiliary camera 5
5 and 56 have the same configuration, the configuration of the auxiliary camera 55 will be described here, and the configuration of the other auxiliary camera 56 will be omitted.

The auxiliary camera 55 has an upper surface 52a of the auxiliary camera holder 52 so as to face the upper inspection unit 4U.
A lighting unit 551 is attached to the camera so that the upper side can be illuminated. The lighting unit 551 includes an external metal tube 551a and an internal light diverging unit 551b. The external metal tube 551a of the lighting unit 551 reflects light. The internal light diverging portion 551b has a cylindrical shape and is made of a transparent material such as acrylic resin or glass. Light source 5 attached to auxiliary camera holder 52
Light generated from 51c passes through a light guide 551d made of a material such as glass fiber, and is guided to an internal light divergence 551b. Light is emitted from the internal light diverging section 551.
b, and is diffused at the upper end of the internal light diverging portion 551b to irradiate ring-shaped light toward the jig positioning marks 47A and 47B. The center of the lighting unit 551 coincides with the optical axis of the auxiliary camera 55.

Further, below the illumination unit 551, a prism holder 552 is provided inside the auxiliary camera holding portion 52.
The prism 553 is fixedly arranged, and the light L incident on the inside of the auxiliary camera holding unit 52 via the illumination unit 551 is guided to the CCD 556 via the lens 555 arranged in the lens barrel 554, and the image is formed on the CCD 556. Is formed. Therefore, when the jig positioning marks 47A and 47B provided on the inspection jig 41 of the upper inspection unit 4U are located immediately above the illumination unit 551, the jig positioning marks 47 are formed by the CCD 556.
A, 47B and the outer periphery of the illumination unit 551 are imaged, and the respective centers are obtained.

The upper surface 52a of the auxiliary camera holder 52
Is provided with a table positioning mark 57 at a position away from the illumination unit 551 of the auxiliary camera 55 by a certain distance.

The auxiliary camera 55 has a jig positioning mark 4
It has a field of view approximately twice or more the diameter of 7A, 47B. The transport table 5 and the inspection jig 41 are provided with jig positioning marks 47.
A and 47B relatively move based on the positioning data held in the control unit 71 so that they are within the field of view of the auxiliary camera 55. Thus, the auxiliary camera 55 captures and activates the images of the jig positioning marks 47A and 47B until the center of the jig positioning marks 47A and 47B coincides with the center of the illumination unit 551 or the optical axis of the auxiliary camera 55.

The main camera 44 comprises an objective lens for picking up an image and a CCD. The field of view of the main camera 44 is rectangular and approximately twice the diameter of the table positioning mark 57. As a result, the table positioning mark 57 is similarly imaged. More specifically, the transport table 5 drives the table 5 in the Y-axis direction and the YY jig driving unit 43Y in the Y-axis direction based on information held in the control unit 71 so that the table positioning mark 57 enters the field of view of the main camera 44. I do. In this state, the table positioning mark 5
7 until the center of 7 coincides with the optical axis of the main camera 44.

Next, returning to FIG. 3, the electrical configuration of the substrate inspection apparatus configured as described above will be described. The board inspection apparatus includes a control unit 71 including a CPU, a ROM, a RAM, a motor driver, and the like, and controlling the entire apparatus according to a program stored in the ROM in advance, cameras 44, 45, An image processing unit 7 that performs predetermined image processing based on the image signals from 55 and 56 and provides a signal related to the image processing result to the control unit 71.
2 is provided. Then, based on a signal from the image processing unit 72, the control unit 71 controls the drive of the transport table driving mechanism 6 and the inspection jig driving mechanism 43 to apply the contact 42 to the circuit pattern formed on the substrate 2 on the transport table 5. Make contact. Further, the control unit 71 is electrically connected to the tester controller 73. When the contact of the contact 42 with the circuit pattern is completed as described above, an inspection start command is given from the control unit 71 to the tester controller 73.
An inspection signal is sent from a scanner 74 electrically connected to the contact 42, and the inspection is performed. In this way,
All the circuit patterns are inspected one by one, and as a result of all the inspections, it is determined whether or not the board is acceptable.

Then, the inspection result is given to the control unit 71 via the tester controller 73. Further, an operation panel 75 is electrically connected to the control unit 71, and commands and parameters from an operator are transmitted to the control unit 7.
Given to one.

The main camera 44, auxiliary cameras 55 and 5
6. The control unit 71 and the image processing unit 72 constitute a first measurement system. The auxiliary cameras 55 and 56, the control unit 71, and the image processing unit 72 constitute a second measurement system. Control unit 7
1. The image processing unit 72, the transport table drive mechanism 6, and the inspection jig drive mechanism 43 constitute a drive system.

Next, the operation of the board inspection apparatus will be described in detail.

FIG. 6 is a flowchart showing the basic operation of the substrate inspection apparatus of FIG. In this board inspection apparatus, when the operator carries in the board 2 before the inspection into the carry-in / out section 3 and gives an inspection command through the operation panel 75, the control section 71 gives various commands to each section of the apparatus and the control section 71 gives various commands as shown in FIG. The board inspection is automatically performed according to the flowchart. Since the upper inspection unit 4U and the lower inspection unit 4D both perform inspections by the same operation, the operation of the upper inspection unit 4U will be described here, and the description of the operation of the lower inspection unit 4D will be omitted.

When receiving the inspection command, it is first determined whether or not the inspection jig 41 is newly set (step S1). If it is determined "NO" in step S1, the position of the inspection jig is adjusted (step S1).
The process proceeds to step S3 without executing 2), and the main camera 44 and the inspection jig 41 already stored in the control unit 71 are executed.
A board inspection is performed based on the information on the relative positional relationship with the substrate.

On the other hand, if "YES" is determined in step S1, the position of the inspection jig is adjusted (step S2). FIG. 7 is a flowchart showing the position adjustment processing of the inspection jig. In the position adjusting process of the inspection jig, as shown in FIG. 4, the transport table driving mechanism based on the image captured by the main camera 4 so that the table positioning mark 57 is located on the optical axis OA1 of the main camera 44. 6, the transport table 5 is moved to the original position (the position indicated by the broken line in the figure).
Is moved by MY1 in the Y direction, and the X jig driving unit 43X is controlled to move the main camera 44 by MX1 in the X direction integrally with the inspection jig 41 (step S20).
Then, a reference coordinate system having the origin O as the design center 5C of the transport table 5 in the position thus positioned is virtually set (step S21).

Next, as shown in FIG. 8, the transport table driving mechanism 6 is controlled so that the jig positioning mark (left) 47A is positioned on the optical axis OA2 of the auxiliary camera 55, and the transport table 5 is moved to the Y position. The inspection jig 41 is moved in the X direction by controlling the X jig driving unit 43X (step S22). Then, an image of the jig positioning mark 47A is captured by the auxiliary camera 55, and the jig positioning mark 4
The coordinates (XA0, YA0) of 7A are obtained (step S2).
3).

Subsequently, in the same manner as in steps S22 and S23, the jig positioning mark 4 in the reference coordinate system is set.
The coordinates of 7B are obtained. Specifically, the transport table driving mechanism 6 is controlled so that the jig positioning mark 47B is positioned on the optical axis OA2 of the auxiliary camera 55, and the transport table 5 is controlled.
Is moved in the Y direction as needed, and the X jig driving section 43X is controlled to move the inspection jig 41 in the (+ X) direction (step S24). In other words, the transport table 5 is moved in the Y direction and the inspection jig 41 is moved in the X direction until the jig positioning mark 47B is positioned on the optical axis OA2 of the auxiliary camera 55. In this state, the coordinates (XB0, YB0) of the jig positioning mark 47B in the reference coordinate system.
Is obtained from the movement amount of the transport table 5 and the inspection jig 41 (step S25).

Next, two jig positioning marks 47A,
The coordinate system formed by the inspection jig driving mechanism 43 by moving the inspection jig 41 by controlling the driving of the Y jig driving unit 43Y and the θ jig driving unit 43θ so that 47B becomes the same for the Y coordinate. Match with the reference coordinate system (step S2
6). Subsequently, the coordinates of the jig positioning marks 47A and 47B in the reference coordinate system, that is, the coordinates (XA1, YA1) of the jig positioning marks 47A, and the coordinates (XB1, YB1) of the jig positioning marks 47B are obtained (step S27). .

In the next step S28, it is determined whether or not the correction of the inspection jig 41 in the Y and θ directions has been completed. If it is determined that the correction has not been completed, the process returns to step S22, and a series of operations is performed. Steps S22 to S27 are executed. On the other hand, if it is determined in step S28 that the correction has been completed, the center coordinates (X41C, Y41C) of the inspection jig 41 are obtained (step S29). The center coordinates 41C (X41C, Y41C) of the inspection jig 41 thus obtained are as shown in FIG. 9, and the respective coordinate values are as follows: X41C = (XA1 + XB1) / 2 Y41C = YA1 = YB1 Next, the inspection jig 41 is stored in a memory (not shown) of the control unit 71 until the inspection jig 41 is replaced.

When the position adjustment of the inspection jig 41 (Step S2) is completed, the substrate 2 to be inspected is set on the substrate mounting portion 51 of the transfer table 5 (Step S3 in FIG. 6). In this embodiment, the operator directly sets the substrate on the substrate mounting portion 51. However, as described above, the substrate is automatically set by additionally providing the substrate loading mechanism and the substrate unloading mechanism. Is also good.

Next, the coordinate positions of the substrate positioning marks 2A and 2B formed on the substrate 2 in advance in the reference coordinate system are obtained (FIG. 6: step S4). That is, as shown in FIG. 10, the transport table driving mechanism 6 and the X jig driving section 43X until the substrate positioning mark 2A of the substrate 2 is positioned on the optical axis OA1 of the main camera 44 based on the image of the main camera 44.
Is controlled to move the transport table 5 and the inspection jig 41. In other words, the transport table 5 is moved in the Y direction until the substrate positioning mark 2A coincides with the optical axis OA1, and the main camera 44 is moved in the X direction integrally with the inspection jig 41. In this state, the coordinates (X2A, Y2A) of the substrate positioning mark 2A are stored in the transfer table 5 and the inspection jig 41.
Is measured based on the amount of movement from the design center 5C (which coincides with the origin O of the reference coordinate system).

Similarly, the board positioning mark 2B of the board 2 is set on the optical axis OA of the main camera 44 based on the image of the main camera 44.
The transport table driving mechanism 6 and the X jig driving section 43X are driven and controlled to move the transport table 5 and the inspection jig 41 until they are located at the upper position. In other words, the transport table 5 is moved in the Y direction until the substrate positioning mark 2B coincides with the optical axis OA1, and the main camera 44 is moved in the X direction integrally with the inspection jig 41. In this state, the coordinates (X2B, Y2B) of the substrate positioning mark 2B are measured based on the amount of movement of the transport table 5 and the inspection jig 41 from the origin.

Thus, the substrate positioning marks 2A, 2B
When the coordinates are obtained, the coordinates are actually used to position the design center 51C (0, -Y51C), which is the center position of the substrate when the substrate is mounted on the substrate mounting portion 51 in designing. The degree of displacement of the placed substrate 2 is determined as the amount of displacement of the substrate 2 by X, Y, θ in the same manner as in the related art.
Determine by dividing into components. That is, the displacement amount ΔX2, Δ
When Y2 and Δθ2 are respectively obtained, they are as shown below.

ΔX2 = {(X2A−X2A0) + (X2B−X2B0)} / 2 ΔY2 = {(Y2A−Y2A0) + (Y2B−Y2B0)} / 2 Δθ2 = tan ⁻¹ (Y2A−Y2B) / ( X2A-Y2B)｝-ta
n ^-1 {(Y2A0-Y2B0) / (X2A0-X2B0)} where X2A0 and Y2A0 are the coordinate values of the board positioning mark 2A, and X2B0 and Y2B0 are the coordinate values of the board positioning mark 2B. The coordinate values are stored in the control unit 71 in advance.

Then, based on these positional deviation amounts, the substrate 2
Then, the position correction amounts .DELTA.X, .DELTA.Y, .DELTA..theta. Of the inspection jig 41 for .DELTA.X = .DELTA.X41C-.DELTA.X2.DELTA.Y =-. DELTA.Y2.DELTA..theta. =-. DELTA..theta.2 are obtained (step S5).

Then, the inspection jig 41 is moved by the inspection jig driving mechanism 43 by the position correction amounts ΔX, ΔY, and Δθ obtained in step S5 to correct the position. The table 5 is moved in the Y direction by a distance (Y41C + Y51C) (step S
6). As a result, the transport table 5 is positioned in a state where it is accurately positioned directly below the inspection jig 41, and the circuit pattern formed on the substrate 2 and the inspection jig 4
The contact 42 held at 1 is positioned with high precision.

Subsequently, by controlling the Z jig driving section 43Z, the inspection jig 41 is pressed toward the substrate 2 to bring the contact 42 into contact with the circuit pattern of the substrate 2 (step S7).
Thereafter, inspection is performed by the scanner 74 (step S).
8).

Incidentally, when the inspection jig 41 is pressed toward the substrate 2 as described above (step S7), the substrate 2 may be moved by the pressing. If such a displacement of the substrate 2 occurs, the contact contacts a position shifted from the circuit pattern, and it becomes impossible to perform an accurate inspection. Therefore, in this embodiment, the alignment state in the inspection is checked, and if a positional deviation has occurred, the position is corrected and the inspection is performed again (step S).
9).

More specifically, as shown in FIG.
An image of the substrate positioning mark 2A of the substrate 2 placed on the transport table 5 is taken via the. Then, a positional deviation between the alignment confirmation through hole 46 and the substrate positioning mark 2A is obtained from this image (step S91). Then, it is determined in step S whether or not the thus obtained positional deviation is within the allowable range.
The determination is made at 92. If the obtained positional deviation is within the allowable range (YES in step S92), the process proceeds to the next step S10 (FIG. 6) without performing the inspection again. On the other hand, if it exceeds the allowable range (NO in step S92), the position is corrected so that the positional deviation between the alignment confirmation through hole 46 and the substrate positioning mark 2A falls within the allowable range (step S92).
93). When performing position correction, raise the inspection jig.
Then, after performing the position correction, the Z jig driving unit 4
By controlling the 3Z, the inspection jig 41 is pressed against the substrate 2 side so that the contactor 42 comes into contact with the circuit pattern of the substrate 2 and the inspection is performed by the scanner 74 (step S94).

As described above, in this embodiment, even if a positional shift occurs due to the pressing, the inspection is performed again after correcting the positional shift and returning the substrate 2 and the inspection jig 41 to the aligned state. , Inspection accuracy can be further improved.

When the board inspection is completed, the inspection result is displayed, and the inspected board 2 is returned to the loading / unloading section 3 again, and then it is determined whether or not the next board is inspected (step S10). When it is determined that the next substrate is to be inspected, the process returns to step S1, and a series of operations is repeated. On the other hand, if "NO" is determined in the step S10, the process is terminated.

In the above embodiment, the inspection jig 41 is a dedicated inspection jig prepared exclusively for each substrate, and a plurality of contacts 42 are fixed to the inspection jig 41 in accordance with a circuit pattern. The dedicated inspection jig requires time and cost for manufacturing, but is suitable for inspection of a large number of small-type boards 2.

On the other hand, when inspecting a large variety and a small number of substrates 2, a movable contact called a flying probe is used to move the contact to a required inspection location of a circuit pattern, thereby conducting, insulating, etc. Performing the necessary inspections is more effective and versatile. By the way, since the contact moves and comes into contact with a plurality of inspection points of the circuit pattern, if the inspection speed is, for example, 0.1 second per one time, it is 36000 per hour.
The number of contacts increases, and the contact elements become more worn, and replacement is frequent. Further, recently, since the circuit pattern of the substrate 2 has been miniaturized, it is necessary to accurately adjust the position of the tip every time the contactor and the inspection jig are exchanged. Was.

Hereinafter, a substrate inspection by the inspection jig 141 using such a moving contact will be described in detail as a second embodiment.

In the second embodiment, since the inspection section is different from the first embodiment, the inspection section will be described in detail. In the inspection unit 4, an upper inspection unit 104 </ b> U for inspecting a circuit pattern formed on the upper surface side of the substrate 2 is disposed on the upper side (+ Z side) with the moving path of the transport table 5 interposed therebetween, while on the lower side ( -Z side), a lower inspection unit 10 for inspecting a circuit pattern formed on the lower surface side of the substrate 2
4D is arranged. These inspection units 104
U and 104D have the same configuration, and are symmetrically arranged with the moving path of the transfer table 5 interposed therebetween. Here, the configuration of the inspection unit inspection unit 104U will be described, and the same reference numerals will be given to the inspection unit 104D, and description thereof will be omitted.

In the upper inspection unit 104U, the inspection jig 141 holds two contacts 142A and 142B. The distal ends of these contacts 142A and 142B face the transfer table 5 side and the contact drive mechanism 14
5A and 145B.
By controlling the driving of the contact drive mechanisms 145A and 145B connected to the substrate 2, the contact drive mechanisms 145A and 145B are relatively positioned with respect to the substrate 2 to be inspected and then contact with the circuit pattern on the substrate 2 as described later.

As shown in FIG. 12, the inspection jig driving mechanism 143 moves the inspection jig 14
1 is moved to the X jig driving section 143X, the Y jig driving section 143Y connected to the X jig driving section 143X to move the inspection jig 141 in the Y direction, and the Y jig driving section 143Y is connected to the Y jig driving section 143Y. A θ jig driving section 143θ that rotates the inspection jig 141 about the Z axis, and a Z jig driving section 143Z that is connected to the θ jig driving section 143θ and moves the inspection jig 141 in the Z direction. The inspection jig 141 is positioned relatively to the transport table 5. In addition, the main camera 44 is mechanically connected to the X jig driving unit 143X among these driving units, and is configured to move in the X direction integrally with the inspection jig 141. Next, the contact drive mechanisms 145A and 145B will be described in detail.
As is clear from FIG. 13, the contact drive mechanism 145A is held on the left side of the inspection jig drive mechanism 143, and the contact drive mechanism 145B is similarly held on the right side of the inspection jig drive mechanism 143. . Contact drive mechanism 145
Since A and 145B are substantially the same, only one 145A will be described. The contact drive mechanism 145A is shown in FIG.
As shown in FIG. 13, the contact 142A is moved in the XYZ directions with respect to the inspection jig driving mechanism 143.

As shown in FIG. 12, a camera 45 for checking the alignment between the substrate 2 and the inspection jig 141 is provided inside the inspection jig 141. Table positioning mark 47 to face
A, 47B and the substrate positioning marks 2A, 2B of the substrate 2 placed on the transfer table 5 can be imaged.

The structure of the transport table 5 is the same as that of the first embodiment, and the description is omitted.

In the first embodiment, the jig positioning marks 47A, 47B formed on the inspection jig 41 of the upper inspection unit 4U are provided on the auxiliary camera holding section 52.
Camera 55 for capturing an image of the jig, and jig positioning mark 4 formed on inspection jig 41 of lower inspection unit 4D.
The auxiliary cameras 56 for imaging the 7A and 47B are arranged side by side in the X direction, but in the second embodiment, the auxiliary cameras 55 and 56 are configured to image the contacts 142A and 142B. The actual configuration of the auxiliary camera itself is the same as in the first embodiment, and a description thereof will be omitted.

Next, returning to FIG. 12, the electrical configuration of the substrate inspection apparatus configured as described above will be described. The board inspection apparatus includes a control unit 171 including a CPU, a ROM, a RAM, a motor driver, and the like, and controlling the entire apparatus according to a program stored in the ROM in advance.
An image processing unit 72 that performs predetermined image processing based on image signals from the cameras 44, 45, 55, and 56 disposed in each unit of the apparatus, and provides a signal related to the image processing result to the control unit 171. . Then, based on a signal from the image processing unit 72, the control unit 171 operates the transport table driving mechanism 6
The contact members 142A and 142B are brought into contact with a circuit pattern formed on the substrate 2 on the transfer table 5 by driving and controlling the contact member moving mechanisms 145A and 145B. The control unit 171 is electrically connected to the tester controller 73,
As described above, the contacts 142A, 1
When the contact of the contact 42B is completed, an inspection start command is given from the control unit 171 to the tester controller 73, and the contact 1
An inspection signal is sent to 42A and 142B to execute the inspection. Then, the inspection result is transmitted to the tester controller 73.
Is provided to the control unit 171 via Further, the control unit 1
An operation panel 75 is electrically connected to 71.
Commands and parameters from the operator are transmitted to the control unit 171.
Given to.

Next, the operation of the substrate inspection apparatus according to the second embodiment will be described in detail.

FIG. 14 is a flowchart showing the basic operation of the board inspection apparatus according to the second embodiment. In this board inspection apparatus, when an operator loads the board 2 before inspection into the loading / unloading section 3 and gives an inspection command via the operation panel 75, the control section 171 gives various commands to each section of the apparatus and a flow chart shown in FIG. The board inspection is automatically performed according to the following.
The upper inspection unit 104U and the lower inspection unit 1
Since the inspection is performed by the same operation for both 04D, the operation of the upper inspection unit 104U will be described here, and the description of the operation of the lower inspection unit 104D will be omitted.

When an inspection command is received, first, the inspection jig 141
Alternatively, it is determined whether or not the contacts 142A and 142B are newly set (step S101). If “NO” is determined in step S101, the process proceeds to step S103 without performing the position adjustment of the inspection jig (step S102), and the control unit 1
71 and the contact 142A,
A board inspection is performed based on the information on the relative positional relationship with the 142B.

On the other hand, if "YES" is determined in step S101, the position of the inspection jig is adjusted (step S10).
Perform 2). FIG. 15 is a flowchart showing the position adjustment processing of the inspection jig. In the position adjustment processing of the inspection jig, as shown in FIG. 13, the table positioning mark 57 is positioned on the optical axis OA1 of the main camera 44.
The transport table driving mechanism 6 is controlled based on the image captured by the main camera 44 to move the transport table 5 from the original position (broken line position in the figure) in the Y direction by MY11, and to move the X jig drive unit 143X. By controlling, the main camera 44 is moved by MX11 in the X direction integrally with the inspection jig 141 (step S120). Then, a reference coordinate system having the origin O as the design center 5C of the transport table 5 in the state thus positioned is virtually set (step S1).
21).

Next, as shown in FIG.
The transport table driving mechanism 6 is controlled to move the transport table 5 in the Y direction so that the contact 142A held at the first design reference position is located on the optical axis OA2 of the auxiliary camera 55, and the X correction is performed. The tool jig 141 is moved in the X direction by controlling the tool driving unit 143X (step S12).
2). Then, the contact 142A is provided by the auxiliary camera 55.
An image of the tip is taken, and the coordinates (XA10, YA10) of the contact 142A in the reference coordinate system are obtained based on the mark image (step S123).

Subsequently, steps S122, S12
3, the contact 142B in the reference coordinate system.
The coordinates (held at the design reference position of the inspection jig 141) are obtained. Specifically, the transport table drive mechanism 6 is controlled to move the transport table 5 in the Y direction as necessary so that the contact 142B is positioned on the optical axis of the auxiliary camera 55, and the X jig is driven. After moving the inspection jig 141 in the (+ X) direction by controlling the section 143X (step S124), the contact 142B is moved by the auxiliary camera 55.
Of the jig positioning mark 47B in the reference coordinate system (XB10, YB1) based on the mark image.
0) is obtained (step S125).

Next, the Y jig driving unit 143 is set so that the two contacts 142A and 142B are the same in the Y coordinate.
The Y and θ jig driving units 143θ are driven and controlled to control the inspection jig 14
1 to move the coordinate system constituted by the inspection jig driving mechanism 143 to the reference coordinate system (step S12).
6). Subsequently, the contact 142 in the reference coordinate system is used.
The coordinates of A and 142B, that is, the coordinates (XA11, YA11) of the contact 142A, and the coordinates (XB11, YB11) of the contact 142B are obtained (step S127).

In the next step S128, the inspection jig 141
It is determined whether the correction in the Y and θ directions has been completed, and while it is determined that the correction has not been completed, step S122 is performed.
Then, a series of steps S122 to S127 are executed. On the other hand, if it is determined in step S128 that the correction has been completed, the center coordinates (X141C, Y141C) of the inspection jig 141 are obtained (step S129). The center coordinates 141C (X141C, Y141C) of the inspection jig 141 obtained in this way.
Is as shown in the figure, and the respective coordinate values are as follows: X141C = (XA11 + XB11) / 2 Y141C = YA11 = YB11 This value is then determined by the inspection jig 141 or the contact 142
Until A and 142B are exchanged, they are stored in a memory (not shown) of the control unit 171.

When the position adjustment of the contacts 142A and 142B (Step S102) is completed, the substrate 2 to be inspected is set on the substrate mounting portion 51 of the transfer table 5 (Step S103 in FIG. 14).

Next, the coordinate positions of the substrate positioning marks 2A and 2B formed on the substrate 2 in advance in the reference coordinate system are obtained (FIG. 14: step S104). That is, FIG.
As shown in FIG. 8, the transport table drive mechanism 6 is controlled to move the transport table 5 in the Y direction so that the substrate positioning mark 2A of the substrate 2 is positioned on the optical axis OA1 of the main camera 44. By controlling the tool driving unit 43X, the main camera 44 is moved in the X direction integrally with the inspection jig 41. Then, the image of the board positioning mark 2A is captured by the main camera 44, and the coordinates (X2A, Y2) of the board positioning mark 2A in the reference coordinate system are based on the mark image.
A) Subsequently, the transport table driving mechanism 6 is controlled so that the substrate positioning mark 2B of the substrate 2 is positioned on the optical axis OA1 of the main camera 44.
Is moved in the Y direction, the X camera driving unit 43X is controlled to move the main camera 44 in the X direction integrally with the inspection jig 141, and then the image of the substrate positioning mark 2B is captured by the main camera 44. Then, based on the mark image, the coordinates of the substrate positioning mark 2B in the reference coordinate system (X
2B, Y2B).

Thus, the substrate positioning marks 2A, 2B
Are determined from these coordinate values, as shown in FIG. 16, the design center 51C (0,-) which is the center position of the substrate 2 when the substrate is placed on the substrate placement portion 51 in design.
Y51C), the degree of displacement of the substrate 2 actually placed is determined as the amount of positional deviation of the substrate 2 by dividing it into X, Y, and θ components in the same manner as in the related art. That is, the displacement amounts ΔX2, ΔY2, and Δθ2 are obtained. Then, from these positional deviation amounts, the position correction amounts ΔX, ΔY, Δθ of the inspection jig 141 with respect to the substrate 2 and ΔX = ΔX141C−ΔX2 ΔY = −ΔY2 Δθ = −Δθ2 are obtained (step S105).

Then, the inspection jig driving mechanism 143 by the position correction amounts ΔX, ΔY, Δθ obtained in step S105.
At the same time, the inspection jig 141 is moved to correct the position, and at the same time, the transport table driving mechanism 6 is controlled to move the transport table 5 by the distance (Y141C + Y51C) in the Y direction (step S106). Thereby, the inspection jig 141
The transport table 5 is positioned in a state where the transport table 5 is accurately positioned immediately below the contact table 142, and the circuit pattern formed on the substrate 2 and the contact 142 held by the inspection jig 141.
A and 142B are positioned with high precision.

Subsequently, the contact drive mechanism 145A,
145B to control the contacts 142A and 142A of the inspection jig 141.
After the 142B is moved to the substrate 2 side and brought into contact with a predetermined position of the circuit pattern on the substrate 2 (Step S107), an inspection is performed (Step S108).

By the way, as described above, the contacts 142A, 142A,
When 142B is moved to the substrate 2 side (Step S107)
In some cases, the substrate 2 may move. When such displacement of the substrate 2 occurs, the contacts 142A, 142B
Touches a position shifted from the circuit pattern, making it impossible to perform an accurate inspection. Therefore, in this embodiment, the alignment state in the inspection is confirmed, and if a positional deviation has occurred, the position is corrected and the inspection is performed again (step S109).

A more specific method is the same as in the first embodiment, and a description thereof will be omitted.

As described above, in the second embodiment,
The auxiliary cameras 55 and 56 are attached to the transfer table 5, and the main camera 44 uses the table positioning marks 5 of the transfer table 5.
7 is imaged, and the inspection jig 14 is
The contact 142A, 142B of the first contact is imaged, and the contact 1
The relative positional relationship between the main camera 44 and the inspection jig 141 is obtained in advance based on the images of 42A and 142B and the table positioning mark 57, and the relationship between the transport table 5 and the main camera 44 (reference coordinate system) is determined. , Inspection jig drive mechanism 14
Since the coordinate system is matched with the coordinate system constituted by 3, it is not necessary to perform trial adjustment by the operator as in the related art, the board inspection can be performed automatically, and the operator's work load can be reduced.

Further, since the substrate 2 and the contact 142 are positioned based on the relative positional relationship, the contact 142 accurately contacts the corresponding circuit pattern of the substrate 2 and the board inspection can be performed with high accuracy. It can be carried out.

In the above-described second embodiment, an example in which the same inspection jig 141 is attached to both the upper inspection unit 104U and the lower inspection unit 104D has been described. 41 may be attached.

As described above, in the above embodiment, the auxiliary cameras 55 and 56 are attached to the transport table 5 and the main camera 4
4 captures an image of the table positioning mark 57 of the transport table 5, and the auxiliary cameras 55 and 56 use the inspection jig 41.
Since the jig positioning marks 47A and 47B of (141) are imaged, and the relative positional relationship between the substrate 2 and the inspection jig 41 (141) is obtained based on the images of the marks 47A, 47B and 57, The board inspection can be performed automatically without the need for trial adjustment by the operator as in the prior art,
The work load on the operator can be reduced.

Further, since the substrate 2 and the contact 42 are positioned based on the above-described relative positional relationship, the contact 42 (142) accurately contacts the corresponding circuit pattern of the substrate 2, and the board inspection is performed. It can be performed with high precision.

In the above embodiment, the X jig driving section 4
Although the main camera 44 is configured to be movable in the X direction by mechanically connecting the main camera 44 to the 3X, the inspection jig 41 is provided by providing a dedicated driving mechanism for driving the main camera 44 in the X direction. However, in order to simplify the configuration of the apparatus, it is desirable to use the driving mechanism with the inspection jig 41 and the main camera 44 in the X direction as in the above embodiment. . Further, instead of configuring the main camera 44 to be movable in the X direction, the transport table 5 may be configured to be movable also in the X direction.

In the above embodiment, the transfer table 5
Moves in the Y direction, and the inspection jig 41 moves in the X, Y, and Z directions.
And the main camera 4
4, the transfer table 5 and the inspection jig 41 are relatively positioned.
The drive mechanism for moving the inspection jig 41 is arbitrary as long as the relative positioning can be performed. For example, the main camera 44 and the inspection jig 41 are fixed, and The table 5 may be configured to be movable in the X, Y, Z, and θ directions.

In the above embodiment, the main camera 44 images the table positioning mark 57 of the transport table 5, virtually sets a reference coordinate system from the mark image, and further sets the auxiliary camera attached to the transport table 5. 5
The jig positioning marks 47A, 47B provided on the inspection jig 41 are imaged by the 5, 56, and the jig positioning marks 47A, 47 in the reference coordinate system are obtained from those mark images.
After obtaining the relative positional relationship between the main camera 44 and the inspection jig 41 by obtaining the coordinates of 7B, 2D is obtained in step S26.
The inspection jig 41 is moved so that the two jig positioning marks 47A and 47B are the same with respect to the Y coordinate, and the coordinate system formed by the inspection jig driving mechanism 43 is aligned with the reference coordinate system. When the position of the inspection jig 41 is corrected based on the position correction amount of the inspection jig 41 with respect to the substrate 2 without moving the inspection jig 41 (step S6), the inspection jig 41 is moved to the substrate 2 It may be made to match.

Further, the relative positional relationship between the main camera 44 and the inspection jig 41 may be determined by using an absolute coordinate system determined from the apparatus configuration without providing a virtual reference coordinate system. In this case, the table positioning mark 57 of the transport table 5 is imaged by the main camera 44, the coordinates of the main camera 44 in the absolute coordinate system are specified from the mark image, and the auxiliary cameras 55 and 56 attached to the transport table 5. The jig positioning marks 47A and 47B provided on the inspection jig 41 are imaged, and the jig positioning marks 47 in the absolute coordinate system are obtained from those mark images.
What is necessary is just to obtain the coordinates of A and 47B.

In the above embodiment, the position adjustment processing of the inspection jig (step S2) is configured to be executed only when the inspection jig 41 is newly set. If there is a possibility that the inspection accuracy may decrease due to a temporal change such as the movement of the optical axis of the main camera 44 during the board inspection by the board 41, depending on the number of boards inspected or each board Before performing the inspection, the position adjustment processing of the inspection jig (Step S2) may be appropriately performed, and the accuracy of the substrate inspection can be further improved.

In the above embodiment, the case where the present invention is applied to the board inspection apparatus for simultaneously inspecting the circuit patterns formed on both sides of the board has been described. However, the object to which the present invention is applied is not limited to this. Instead, the present invention is also applicable to a board inspection apparatus that inspects a circuit pattern formed on a board only from one side.

In the above embodiment, the relative position between the table 5 and the inspection jig 41 (141) is
4. Auxiliary cameras 55 and 56 and inspection jig positioning mark 4
1A, 41B (141A, 141B) and the substrate positioning marks 2A, 2B, but may be achieved by, for example, a combination of a thin light beam and a two-dimensional sensor.

In the above embodiment, the relative positioning between the table 5 and the inspection jig 41 (141) is performed at the alignment position, but may be performed at the inspection position.

Further, in the above embodiment, the contact is brought into contact with the circuit pattern of one board by using the dedicated inspection jig. In the general-purpose inspection jig, a pair of contacts is attached to the circuit pattern of one board. Although an example in which a pattern is brought into contact with a required position is illustrated, a substrate having a multi-sided circuit pattern formed on one sheet can be used as an inspection target.

[0091]

As described above, according to the board inspection apparatus of the present invention, the relative position between the table and the inspection jig is determined by measuring with the first measurement system. In addition, the relative position between the table and the substrate is determined by measuring with the second measurement system. The first relative positional relationship between the substrate and the inspection jig is set by the drive system based on the obtained relative positions, and the relative position between the substrate and the inspection jig placed on the table for inspection is determined. The relative positional relationship between the substrate and the inspection jig can be automatically set by the drive system, and the burden on the operator can be reduced. Since the substrate and the contact are relatively positioned on the basis of the relative positional relationship, the contact accurately contacts the circuit pattern of the corresponding substrate, and high-precision board inspection can be performed.

According to the method for adjusting the relative position between the substrate and the inspection head in the substrate inspection apparatus of the present invention, the relative positional relationship between the table and the inspection head in two-dimensional and angular directions is determined. Determining a relative positional relationship with the substrate, moving the table relative to the inspection head, and controlling a relative movement amount according to a relative positional relationship between the table and the inspection head and between the table and the substrate; In addition, since the method is capable of automatically setting the relative positional relationship between the substrate and the inspection jig, the burden on the operator can be reduced.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing a first embodiment of a substrate inspection apparatus according to the present invention.

FIG. 2 is a plan view of the substrate inspection apparatus of FIG.

FIG. 3 is a schematic diagram illustrating a schematic configuration of the substrate inspection apparatus of FIG. 1;

FIG. 4 is a perspective view showing an operation of the board inspection apparatus of FIG. 1;

FIG. 5 is a cross-sectional view illustrating a configuration of an auxiliary camera.

FIG. 6 is a flowchart showing a basic operation of the board inspection apparatus of FIG. 1;

FIG. 7 is a flowchart illustrating a position adjustment process of the inspection jig.

FIG. 8 is a perspective view showing an operation of the substrate inspection apparatus of FIG. 1;

9 is a diagram showing a positional relationship between an inspection jig and a transport table in the substrate inspection apparatus of FIG.

FIG. 10 is a perspective view showing an operation of the substrate inspection apparatus of FIG. 1;

FIG. 11 is a flowchart showing a process of checking and correcting a matching state in an inspection.

FIG. 12 is a side sectional view showing a second embodiment of the board inspection apparatus according to the present invention.

FIG. 13 is a perspective view showing the operation of the board inspection apparatus of FIG.

FIG. 14 is a flowchart showing a basic operation of the substrate inspection apparatus of FIG.

FIG. 15 is a flowchart illustrating a position adjustment process of the inspection jig.

FIG. 16 is a perspective view showing the operation of the board inspection apparatus of FIG.

17 is a diagram showing a positional relationship between an inspection jig and a transfer table in the board inspection apparatus of FIG.

FIG. 18 is a perspective view showing the operation of the board inspection apparatus of FIG.

[Explanation of symbols]

2 ... substrate 2A, 2B ... substrate positioning mark 4 ... inspection unit 4D ... lower inspection unit 4U ... upper inspection unit 5 ... transport table 6 ... transport table drive mechanism 41, 141 ... inspection jig (inspection head) 42, 142 ... contact Element 43, 143: inspection jig driving mechanism (inspection head driving mechanism) 43X, 143X: X jig driving section 43Y, 143Y: Y jig driving section 43Z, 143Z: Z jig driving section 43θ, 143θ: θ jig Driving unit 44: Main camera (first camera) 45: Camera for confirming alignment (means for confirming relative position between substrate and inspection head) 47A, 47B: Jig positioning mark (inspection head positioning mark) 51: Substrate mounting unit 52: auxiliary camera holder 55, 56: auxiliary camera (second camera) 57: table positioning mark (third mark) 71, 171: controller 145A, 145B ... contact drive mechanism

Claims (18)

[Claims] 1. A board inspection apparatus for inspecting conductivity between specific points on a circuit pattern of a board having at least one pair of contacts, comprising: a table for transporting the board to be inspected; and the contacts. A first measurement system that determines a relative position between the table and the inspection head in two-dimensional and angular directions; and a second measurement system that determines a relative position between the table and the substrate in two-dimensional and angular directions. A measurement system, and a drive system for setting a first relative positional relationship between the table and the inspection head according to the relative position determined by the first and second measurement systems to inspect the substrate. A board inspection apparatus characterized by the above-mentioned. 2. The apparatus according to claim 1, wherein said first measuring system includes a position control system for setting said table and said inspection head in a second relative positional relationship, wherein said inspection head is fixedly installed.
A measuring mechanism having a plurality of inspection head positioning marks, and measuring a position of the two inspection head positioning marks with respect to a specific position of the table in a state where the table and the inspection head are in the second relative positional relationship. The substrate inspection apparatus according to claim 1, further comprising: 3. The driving system according to claim 1, wherein the table is a first table.
A table transport mechanism for transporting in a direction, wherein the first measuring system sets a coordinate system having a first axis extending in the first direction and a second axis extending in a second direction orthogonal to the first direction. 3. The substrate inspection apparatus according to claim 2, further comprising a setting unit, wherein the positions of the two inspection head positioning marks are identified in the coordinate system. 4. The driving system according to claim 1, wherein
A table transport system for transporting the test head in a first direction, a test head driving mechanism for driving the test head in a first direction, a second direction and an angular direction, and a relative position determined by the first and second measurement systems. 2. The substrate inspection apparatus according to claim 1, further comprising a drive control means for controlling a drive amount of the table and the inspection head. 5. The first measuring system according to claim 1, wherein the table and the inspection head are arranged in a third relative positional relationship in which a specific point on the table matches one of the two inspection head positioning marks of the inspection head. And a second drive control mechanism for setting the specific point of the table to a fourth relative positional relationship that matches the other of the two inspection head positioning marks of the inspection head, wherein the two inspection heads are positioned. 5. The substrate inspection apparatus according to claim 4, wherein the position of the mark is set as a function of relatively moving the table and the inspection head from the second relative positional relationship to a third and a fourth relative positional relationship. 6. The system according to claim 1, wherein the first measuring system has a third mark provided on the table, and drives the inspection head in the second direction to image the third mark.
The substrate inspection apparatus according to claim 5, further comprising a first camera connected to the inspection head driving mechanism. 7. The first measuring system further comprises a second camera provided so as to move integrally with the table and image two inspection head positioning marks provided on the inspection head. The board inspection apparatus according to the above. 8. The substrate according to claim 4, further comprising an adjusting mechanism for controlling said inspection head driving mechanism so that said inspection head and said table are parallel to each other and adjusting a relative positional relationship between said inspection head and said table. Inspection equipment. 9. The inspection system according to claim 1, wherein the adjustment mechanism is configured to perform the inspection in the first, second, and angular directions such that coordinate values in the first direction of the two inspection head positioning marks provided on the inspection head are equal to each other. 9. The substrate inspection apparatus according to claim 8, further comprising: means for adjusting a relative position between the head and the table. 10. The substrate inspection apparatus according to claim 4, wherein said drive control means includes means for adjusting a drive amount according to a relative position determined by said second measurement system. 11. The substrate inspection apparatus according to claim 4, further comprising a second inspection head driving mechanism that drives the inspection head at an operation position where the contact is electrically connected to a circuit pattern. 12. The substrate inspection apparatus according to claim 11, further comprising a confirmation unit configured to confirm a relative position between the substrate set at the inspection position and the inspection head set at the operation position. 13. The test head includes two or more contacts fixedly installed on the test head so as to correspond to the circuit pattern on the circuit board, wherein the contacts are arranged in the operating position of the test head. The substrate inspection device according to claim 11, wherein the substrate inspection device is in contact with the pattern. 14. The inspection head according to claim 1, further comprising a pair of contacts and a contact driving mechanism for driving the contacts so as to contact a required position on the circuit pattern of the circuit board to be inspected. 12. The substrate inspection apparatus according to item 11. 15. A method for adjusting a relative position between a substrate to be inspected and an inspection head of a substrate inspecting apparatus, wherein the substrate on which a circuit pattern is formed is inspected with an initial position placed on a table. The inspection head is provided with a plurality of contacts that are electrically connected to specific points of the circuit pattern and detect conductivity between the points, Determining the relative positional relationship between the table and the inspection head with respect to the angular direction, determining the relative positional relationship between the table and the substrate, moving the table relative to the inspection head, A substrate and an inspection head in a substrate inspection apparatus, wherein a relative movement amount is controlled according to a relative positional relationship between the heads, the table and the substrate. Relative position adjustment method. 16. The step of determining a relative position between the table and the inspection head sets an origin determination position with respect to the inspection head in the table, and determines a two-point position of the inspection head with respect to the table at the origin determination position. 16. The method for adjusting a relative position between a substrate and an inspection head in the substrate inspection apparatus according to claim 15, comprising a step. 17. The substrate inspection apparatus according to claim 16, wherein the step of determining the positions of the two points includes the step of determining the positions of the two points in a two-dimensional coordinate system associated with the table at the origin determination position. Of adjusting the relative position between the test head and the test head. 18. The method according to claim 18, wherein the step of determining the positions of the two points comprises: moving the table from the origin determination relative position to the inspection head so that one of the two points on the inspection head becomes a specific point on the table. The first identification position that matches and the other of the two points on the inspection head are relatively moved to a second identification position that matches a specific point on the table, and the origin determination position and the second identification position with respect to the inspection head are compared. 18. The method for adjusting a relative position between a substrate and an inspection head in a substrate inspection apparatus according to claim 17, further comprising the step of determining the positions of the two points according to a relative movement amount of the table between the first and second identification positions.