JP2000000927A - Infrared cutoff film - Google Patents

Abstract

(57) Abstract: Provided is an infrared cutoff film having an infrared cutoff layer in which the adhesion of a layer formed on the surface is sufficiently ensured and the layer does not peel off. SOLUTION: An ITO powder + is formed on a surface of a base film.
An infrared cutoff layer is formed by applying a UV curable resin coating material for infrared cutoff, a protective layer is formed on the surface of the infrared cutoff layer, and an adhesive layer is formed on the back surface of the base film. "JIS K6" on the surface of the infrared cutoff layer
768 "(surface tension: dyn / cm is 5
Controlling the value to 0 or less enhances the adhesion to the protective layer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an infrared ray cut-off film which is mainly applied to a window glass of a building or an automobile for the purpose of shielding (cutting off) infrared rays of sunlight.

[0002]

2. Description of the Related Art A functional film having an infrared cutoff function which is transparent to light in the visible region and reflects or absorbs light in the infrared region is mainly radiated. It has been conventionally used to suppress the thermal effect of sunlight. For example, by sticking to a window glass of a building, a car, or the like, the heat can be suppressed even when directly receiving solar radiation through the window glass. In summer, the rise in room temperature is suppressed, and cooling efficiency is improved. In winter, indoor heat retention efficiency is improved. Further, there is an additional effect that scattering is prevented when the window glass is broken. Such an infrared cutoff film generally has a layer configuration in which an infrared cutoff layer is laminated on a base film, a protective layer is formed on the front surface, and an adhesive layer is laminated on the back surface.
The adhesive layer is attached to glass or the like.

[0003] Conventionally, the infrared cut-off layer has been formed by various infrared cut-off agents (for example, immonium, aminium,
ZnO, SnO ₂ , ITO (tin-containing indium oxide powder), Au, etc.) on the base film by a vacuum deposition method, a sputtering method, or a method of dispersing in a resin to apply a coating material for an infrared cutoff layer. Was formed.

However, in order to form the infrared cut-off agent on a base film by a vacuum evaporation method or a sputtering method, a device capable of controlling a high vacuum and a high-precision atmosphere must be used. However, there have been problems such as an increase in the mass and poor mass productivity. Therefore, as a method of forming a thin film free of such a drawback, the above-mentioned coating method is more suitable. The resin used for forming the infrared cutoff layer by the coating method has high transparency, and is an ultraviolet curable resin such as an acrylic resin, a urethane resin, an epoxy resin, or a melamine resin or a polyurethane. Resin, silicone resin, thermosetting resin such as silicone denatured resin, furthermore, acrylic,
A general resin for forming a coating film, such as a urethane-based or polyester-based thermoplastic resin, is appropriately selected and used.

[0005]

The infrared cutoff layer in which the powder of the cutoff agent is dispersed in the resin as described above is coated on a base film, and the infrared cutoff layer is laminated on the surface side. In the case of the above, a protective layer is applied and laminated on the infrared cutoff layer. For the protective layer, for example, a resin having a relatively high hardness such as an ultraviolet curable resin is used.Here, if the adhesion of the resin of the protective layer to the infrared cutoff layer is not sufficient, the resin is difficult to be applied,
Even if it is applied, the adhesive strength is weak and it is easy to peel off. Therefore, it is important that the surface of the infrared cutoff layer is rich in adhesion. Also, when the infrared cutoff layer is laminated on the back surface of the base film, the adhesive layer will be laminated on the infrared cutoff layer, and also in this case, if the adhesion of the adhesive layer is not sufficient, the infrared cutoff layer It is easy to peel off from the adhesive layer. In particular, since it is easily deteriorated by the influence of ultraviolet rays or infrared rays such as sunlight, more sufficient adhesion is required. However, a clear evaluation of the adhesiveness of the surface of the infrared cutoff layer has not been made at present, in other words, what kind of characteristics the adhesive layer has, if it has excellent adhesiveness, a layer coated on the surface. There has been a demand for an index as to whether the adhesion strength of (for example, a protective layer) is secured.

Accordingly, an object of the present invention is to provide an infrared cutoff film having an infrared cutoff layer in which the adhesion of the layers to be laminated is sufficiently ensured and the layers do not peel off.

[0007]

Means for Solving the Problems The present inventor pays attention to the wettability of the surface of the infrared cutoff layer as an index for analyzing the adhesiveness of other layers laminated on the infrared cutoff layer, and conducts intensive studies. Stacked. As a result, the wetting index of the surface of the infrared cutoff layer according to “JIS K6768” (surface tension:
dyn / cm) is 50 or less, more preferably 36 to 46.
In this case, it was found that the adhesion of the layer formed on the infrared cutoff layer was sufficiently ensured. Therefore, the present invention
At least, a base film, an infrared cutoff layer laminated on the base film, and an infrared cutoff film having at least one layer formed on the surface of the infrared cutoff layer, wherein the infrared cutoff layer comprises: It contains a powder and a resin that reflect or absorb infrared rays, and has “JIS K676” on its surface.
8 "is 50 or less.

In the present invention, the wetting index is 36 as described above.
If it is less than 46, it is more preferable. If it is less than 36, the wettability becomes too good, and the water in the air tends to be easily collected on the surface. For example, when coating or storing, the humidity is 65% R.
In a high humidity environment of h or more, a thin film of water is formed on the surface of the infrared cutoff layer, which may hinder adhesion. For this reason, when the wetting index is lower than 36, it is necessary to pay sufficient attention to the environmental humidity. The wetting index, that is, the wettability can be controlled as follows. That is, it can be improved by increasing the content of a hydroxyl group or a polar group or by adding a conductive compound. Further, it can be reduced by adding a silicone resin.

In the infrared cutoff film of the present invention, the powder of the infrared cutoff agent is mixed with a suitable resin.
The infrared cut-off layer is formed by dispersing and using this as a paint for an infrared cut-off layer, and applying this paint on a base film. Examples of a method for applying the coating material for the infrared cutoff layer on the base film include a wire bar coating method, a doctor blade coating method, a gravure coating method, and a dip coating method.

According to the present invention, since the wettability of the infrared cutoff layer has the above characteristics, the adhesion of the layer laminated to the infrared cutoff layer is sufficiently ensured, and the layer may be peeled off. It is possible to provide a high-quality infrared cut-off film without any problem. In addition, regarding the adhesion of the layer laminated on the infrared cutoff layer,
It is also desirable to consider the surface roughness of the infrared cutoff layer, and it is desirable that the surface roughness (Ra) according to “JIS B0601” is 0.014 or more.

The infrared cut-off film of the present invention has a structure in which an infrared cut-off layer composed of a powder of an infrared cut-off agent and a resin is laminated on the surface of a base film. As an embodiment, for example, as shown in FIG. 1, an infrared cutoff layer 2 and a protective layer 3 are laminated in this order on the surface of a base film 1, while an adhesive layer 4 and a separate material 5 Are stacked in this order. Alternatively, as shown in FIG. 2, a protective layer 3 is laminated on the surface of the base film 1, and an infrared cutoff layer 2, an adhesive layer 4 and a separate material 5 are laminated on the rear surface of the base film 1 in this order. In any case, the separation material 5 is peeled off from the adhesive layer 4, and the adhesive layer 4 is attached to glass or the like for use.

Next, the materials constituting each layer of the infrared cutoff film of the present invention having the above-mentioned structure will be described in detail. A. Base Film As the base film, a known transparent film can be used. Specific examples include PET, TA
Various resin films such as C (triacetyl cellulose), polyarylate, polyether, polycarbonate, polysulfone, polyethersulfone, cellophane, polyethylene, polypropylene, and polyvinyl alcohol can be suitably used.

B. Infrared cut-off agent The powder of the infrared cut-off agent mixed and dispersed in the infrared cut-off layer of the present invention is preferably one having an average particle diameter of 100 nm or less from the viewpoint of transparency and dispersibility. 50 nm or less, most preferably 25 to 35 n
m is optimal. As the infrared cutoff agent, ITO powder is more preferable from the viewpoints of transparency, color, infrared cutoff function and the like.

The ITO powder is produced by a generally known production method, that is, an aqueous solution containing a small amount of a water-soluble salt of In and Sn is reacted with an alkali to co-precipitate a hydroxide of In and Sn, and this co-precipitate is used as a raw material. After that, this raw material is converted into CO, N
A material which is heated and baked in a reducing atmosphere such as H ₃ or H ₂ and converted into an oxide is used. In this case, the ITO powder is obtained by sintering the raw material under heating in a reducing atmosphere, and the component molar ratio of In / Sn / O ₂ is 100/5 to 1
0 / 0.5-10, preferably 100 / 5-10 / 0.
5 to 2. A film formed using the ITO powder subjected to the reduction treatment as described above is a spectrophotometer (manufactured by Shimadzu Corporation: U
V3100) and "JIS K870"
1 ”is x = 0.31 ± 0.1, y = 0.
32 ± 0.1 and z = 0.37 ± 0.1, exhibiting blue. Such an ITO powder has an extremely short infrared cutoff wavelength of 800 nm, and is extremely excellent in an infrared cutoff function. The color of the infrared cutoff film of the present invention in which such ITO powder is dispersed is IT
The color of the O powder is reflected, that is, the color coordinates are as described above, and a transparent blue color is exhibited. For users, blue films are generally preferred,
If there is a request, a film that can meet the requirement can be provided.

C. Infrared cut-off layer resin As a resin in which the powder of the infrared cut-off agent is mixed and dispersed, a monomer containing at least one of an acrylic compound or an epoxy compound, a photo-radical polymerization initiator and / or An ultraviolet curable resin containing a cationic polymerization initiator is preferably used. The inclusion of an acrylic compound is preferred in controlling the properties of paints and coatings, such as the viscosity, crosslinking density, heat resistance, and chemical resistance of the ultraviolet curable resin.

Examples of the epoxy compound include glycidyl ethers such as tetramethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, bisphenol A-diglycidyl ether, and 2-hydroxy-3.
-Phenoxypropyl acrylate, bisphenol A
And monomers and oligomers such as epoxy esters such as -diepoxy-acrylic acid adducts and alicyclic epoxies having the following chemical formula.

[0017]

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The acrylic compound includes lauryl acrylate, ethoxydiethylene glycol acrylate, methoxytriethylene glycol acrylate, phenoxyethyl acrylate, tetrahydrofurfuryl acrylate, isobornyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl acrylate, Monofunctional acrylates such as hydroxy-3-phenoxy acrylate, neopentyl glycol diacrylate, 1,6-hexanediol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol diacrylate, dipentaerythritol hexaacrylate, etc. Multifunctional acrylate, trimethylolpropane acrylate Acrylic acid derivatives such as acid esters and trimethylpropane benzoate; monofunctional methacrylates such as 2-ethylhexyl methacrylate, n-stearyl methacrylate, cyclohexyl methacrylate, tetrahydrofurfuryl methacrylate, 2-hydroxyethyl methacrylate and 2-hydroxybutyl methacrylate Methacrylic acid derivatives such as polyfunctional methacrylates such as 1,6-hexanediol dimethacrylate, trimethylolpropane trimethacrylate, and glycerin dimethacrylate; urethane acrylates such as glycerin dimethacrylate hexamethylene diisocyanate and pentaerythritol triacrylate hexamethylene diisocyanate. In addition to monomers and oligomers, the following chemical formula That the composed compound containing at least one type is used.

[0019]

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As the photo-radical polymerization initiator, for example,
An acetophenone compound represented by the following chemical formula,

Embedded image For example, a benzoin-based compound represented by the following chemical formula can be used.

Embedded image

Examples of the cationic photopolymerization initiator include compounds having the following chemical formula. These compounds may be used alone or in a mixture of two or more.

[0022]

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The amount of the photo-radical polymerization initiator and / or the cationic photo-polymerization initiator is 0.1 to 1 with respect to the main ingredient.
A range of 0% by weight is desirable. The basis for this amount is 0.
If the amount is less than 1% by weight or more than 10% by weight, ultraviolet curing is insufficient. Also, the higher the transparency of the resin forming the infrared cutoff layer, the better,
The light transmittance according to "JISC6714" is 80% or more,
Preferably, 90% or more is secured.

The mixing ratio of the powder of the infrared cut-off agent and the resin constituting the coating material for the infrared cut-off layer is such that the weight ratio of the powder to the resin is 90/10 to 60/40, preferably 85.
/ 15 to 65/35, more preferably 80/20 to 7
In the case of 0/30, a good infrared cutoff performance can be obtained even with a thin layer of about 1 μm, and a film having high transparency and less haze can be obtained. 9 powder mixing ratio
When the content is more than 0% by weight, the powder is colored or the degree of haze increases, and the metallic luster increases.
It causes peeling and cohesive failure of the infrared cut-off layer, and further, poor adhesion to the base film. If the mixing ratio of the powder is less than 60% by weight, the intended infrared cutoff cannot be achieved.

D. In the present invention, the infrared cutoff layer contains ZnO, SnO
2. Pigments such as TiO2 can be mixed. That is, these pigments are mixed with the resin together with the powder of the infrared cutoff agent to form an infrared cutoff layer. The pigment performs an infrared cutoff function together with the powder, and its infrared cutoff wavelength region is 1200 to 2500 nm. Therefore, when combined with the powder of an infrared cutoff agent, 800 to 2500 called the near infrared region is obtained.
The mixing ratio of the powder to the resin can be set lower within the above range without deteriorating the cutoff performance of the infrared wavelength of nm. Infrared cutoff agent powder is I
In the case of the TO powder, since the ITO powder is expensive, the cost can be reduced by reducing the amount of the ITO powder. Further, it is necessary that these pigments have an average particle size of 100 nm or less in order to suppress metallic luster and achieve good electromagnetic wave transmittance.

E. Protective Layer As the protective agent for forming the protective layer, generally, a resin which is cured by any one of ionizing radiation and heat or a combination thereof can be used. As the radiation-curable resin, a composition obtained by appropriately mixing monomers, oligomers, and prepolymers having a polymerizable unsaturated bond such as an acryloyl group, a methacryloyl group, an acryloyloxy group, and a methacryloyloxy group is used. Examples of the monomer include styrene, methyl acrylate, methyl methacrylate, methoxy polyethylene methacrylate, cyclohexyl methacrylate, phenoxyethyl methacrylate, ethylene glycol dimethacrylate, dipentaerythritol hexaacrylate, trimethylolpropane trimethacrylate, and the like. Examples of oligomers and prepolymers include acrylates such as polyester acrylate, polyurethane acrylate, epoxy acrylate, polyether acrylate, alkite acrylate, melamine acrylate, and silicone acrylate, unsaturated polyesters, epoxy compounds, and the like. These may be used alone or in combination of two or more. Monomers are preferred if the flexibility of the cured film is required. In order to further reduce the crosslinking density, it is preferable to use monofunctional or bifunctional acrylate monomers. Properties, wear resistance,
When severe durability such as solvent resistance is required, it is preferable to increase the amount of the monomer and use a trifunctional or higher functional acrylate monomer.

In order to cure the ionizing radiation-curable resin as described above, radiation such as, for example, ultraviolet rays, electron beams, or X-rays may be applied. If necessary, a polymerization initiator can be appropriately added. . In the case of curing by ultraviolet rays, it is necessary to add a photopolymerization initiator. Examples of the photopolymerization initiator include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethylketal, 1-hydroxycyclohexyl-phenylketone, 2-methyl-2-morpholino (4
Acetophenones such as -thiomethylphenyl) propan-1-one; benzoin ethers such as benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether;
Benzophenone, methyl o-benzoylbenzoate, 4-
Phenylbenzophenone, 4-benzoyl-4'-methyl-diphenylsulfide, 4-benzoyl-N, N
-Dimethyl-N- [2- (1-oxo-2-propenyloxy) ethyl] benzenemethanaminium bromide,
Benzophenones such as (4-benzoylbenzyl) trimethylammonium chloride; thioxanthones such as 2,4 diethylthioxanthone and 1-chloro-4-dichlorothioxanthone; and 2,4,6-trimethylbenzoyldiphenylbenzoyl oxide. . These can be used alone or in combination of two or more. Further, as an accelerator (sensitizer), an amine compound such as N, N-dimethylparatoluidine and 4,4'-diethylaminobenzenephenone can be mixed and used.

Further, as a resin used as a protective agent, it is particularly preferable to use an ultraviolet-curable epoxy-based compound in terms of excellent hardness and transparent adhesion. Specific epoxy compounds include glycidyl ethers such as tetramethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, bisphenol A-diglycidyl ether, 2-hydroxy-3-phenoxypropyl acrylate, Examples include epoxy esters such as bisphenol A-diepoxy-acrylic acid adducts.
As the polymerization initiator, a photoradical polymerization initiator and / or a cationic photopolymerization initiator can be used, and examples thereof include the same ones as those used for the infrared cutoff layer. The compounding amount is 0.1 to 10 with respect to the main agent.
A range of weight percent is desirable. This amount is 0.1% by weight
If less, or more than 10% by weight, UV curing is insufficient.

F. The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is, for example, an acrylic pressure-sensitive adhesive, and as a curing agent, for example, a metal chelate-based, isocyanate-based, or epoxy-based cross-linking agent may be used alone or in combination of two or more. Used as a mixture. Such an adhesive has an adhesive strength (JIS Z0) as an adhesive layer.
237) is preferably in a range of 100 to 2000 g / 25 mm in practical use. Further, the thickness of the adhesive layer after drying is preferably about 15 to 25 μm. Further, by appropriately adding an ultraviolet absorber to the adhesive layer, an ultraviolet cutoff effect can also be obtained. Examples of the ultraviolet absorber include pt-butylphenyl salicylate, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-octoxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, and 2 '-( 2'-hydroxy-5-methylphenyl) benzotriazole, 2- (2'-hydroxy-
3'-t-butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-
3 ', 5'-Di-t-butylphenyl) benzotriazole and the like are preferably used.

G. Other materials・ Solvent added to paint for infrared cut-off layer Paint for infrared cut-off layer is composed of powder and resin of infrared cut-off agent, and benzene, toluene, acetone, methyl ethyl ketone, isophorone, One or more organic solvents such as cyclohexanone can be appropriately added. -Surfactant added to infrared cut-off layer paint A small amount of surfactant (for example, nonionic) is added to the infrared cut-off layer paint for the purpose of improving the dispersibility of the powder of the infrared cut-off agent. Can be.

In the infrared cut-off film of the present invention, the infrared cut-off layer is formed on the base film or on the surface of the infrared cut-off layer so that one layer is easily applied and has high adhesion. The higher the wettability of the infrared cut-off layer, the better. Specifically, it is sufficient that the wetting index according to “JIS K6768” is 50 or less, more preferably 36 to 46. Such a wetting index can be adjusted by appropriately selecting the material and composition of each layer. Further, regarding the adhesion of the layer laminated on the infrared cutoff layer, it is desirable to consider the surface roughness of the infrared cutoff layer, and the surface roughness is such that the surface roughness (Ra) according to “JIS B0601” is 0. It is preferably at least 0.014.

Although the present invention is directed to a film whose main purpose is to cut off infrared rays, it is possible to appropriately add the above-mentioned ultraviolet absorber to at least one of the other layers as in the case of the above-mentioned adhesive layer. Accordingly, an ultraviolet cutoff effect can be obtained together.

[0033]

Next, the present invention will be described in more detail by way of examples. Note that “parts” means “parts by weight”.

-Formulation of paint for infrared cutoff layer-[Example 1]-Infrared cutoff agent: 52 parts of ITO powder Primary particle diameter: about 50 nm Component molar ratio: In / Sn / O2 = 100/5/0. 9 ・ Resin: 24 parts of ultraviolet curing resin (trade name: Z-7503, manufactured by JSR Corporation) ・ Solvent: 24 parts of methyl isobutyl ketone

Example 2 Infrared cutoff agent: 52 parts of the same ITO powder as in Example 1 Resin: UV curable resin 8 parts of dipentaerythritol polyacrylate 8 parts of tripentaerythritol polyacrylate 8 parts Trade name: Celloxide 2021, 7 parts manufactured by Daicel Chemical Co., Ltd. Product name: Cyracure UVI 6990, 1 part manufactured by Union Carbide Co., Ltd. Solvent: 24 parts of methyl isobutyl ketone

Example 3 Infrared cut-off agent: 52 parts of the same ITO powder as in Example 1 Resin: 24 parts of ultraviolet curable resin (trade name: UCHC1101, manufactured by Toshiba Silicon Corporation) Solvent: methyl isobutyl ketone 24 Department

Example 4 Infrared cutoff agent: 52 parts of the same ITO powder as in Example 1 Resin: 24 parts of ultraviolet curable resin (trade name: 17-806, manufactured by Dainippon Ink and Chemicals, Inc.) Solvent ... 24 parts of methyl isobutyl ketone

Example 5 Infrared cut-off agent: 52 parts of the same ITO powder as in Example 1 Resin: 36 parts of acrylic resin (trade name: LR-360, manufactured by Mitsubishi Rayon Co.) Solvent: 12 parts of toluene

Example 6 Infrared cutoff agent: 52 parts of the same ITO powder as in Example 1 Resin: acrylic resin 4.9 parts Styrene 9.5 parts Methyl methacrylate 9.5 parts Ethyl acrylate 9.5 parts Acrylic acid 0.5 part 1 part ・ Solvent: 24 parts toluene

Example 7 Infrared cut-off agent: 52 parts of the same ITO powder as in Example 1 Resin: acrylic resin styrene 5.8 parts Ethyl methacrylate 3.6 parts n-butyl methacrylate 10.8 parts Methacrylate 2 .4 parts Butyl acrylate 1.2 parts Acrylic acid 0.2 parts Solvent: Toluene 24 parts

Example 8 ・ Infrared cutoff agent 5 parts (trade name: P-26, manufactured by Sanyo Dyeing Co., Ltd.) ・ Resin: UV-curable resin 16 parts dipentaerythritol polyacrylate 16 parts tripentaerythritol polyacrylate 16 parts Name: Celloxide 2021, 16 parts manufactured by Daicel Chemical Co., Ltd.

Example 9 Infrared cutoff agent: 38 parts of the same ITO powder as in Example 1 Resin: 31 parts of ultraviolet curable resin (trade name: 17-806, manufactured by Dainippon Ink and Chemicals, Inc.) Solvent ... Methyl isobutyl ketone 31 parts

Example 10 Infrared cut-off agent: 38 parts of the same ITO powder as in Example 1 Resin: 31 parts of ultraviolet curable resin (trade name: Z-7501, manufactured by JSR Corporation) Solvent: methyl isobutyl ketone 31 copies

Example 11 Infrared cutoff agent: 52 parts of the same ITO powder as in Example 1 Resin: ultraviolet curable resin 24 parts (trade name: Z-7501, manufactured by JSR Corporation) Solvent: methyl isobutyl ketone 24 copies

Comparative Example 1 Infrared cut-off agent: 38 parts of the same ITO powder as in Example 1 Resin: 31 parts of ultraviolet curable resin (trade name: Z-7503, manufactured by JSR Corporation) Solvent: methyl isobutyl ketone 31 copies

Comparative Example 2 Infrared cut-off agent: 52 parts of the same ITO powder as in Example 1 Resin: UV-curable resin 24 parts (trade name: Z-7503, manufactured by JSR Corporation) Solvent: methyl isobutyl ketone 24 copies

[Comparative Example 3] 10 parts of infrared cut-off agent (trade name: P-26, manufactured by Sanyo Color Co., Ltd.) Resin: 45 parts of acrylic resin (trade name: PC0035, manufactured by Nissetsu Co.) Solvent: methyl Isobutyl ketone 45 parts

The coating materials for the infrared cut-off layer were prepared by mixing and dispersing the materials of the examples and comparative examples for an appropriate period of time. Next, a 50 μm thick base film
m high transparency PET film (trade name: Merimex #
707 (manufactured by ICI Co.), and the infrared cutoff paints of the respective Examples and Comparative Examples were applied to the surface of the PET film with an applicator. Thereafter, the resin using an ultraviolet-curable resin was cured with ultraviolet light of 120 W, and the resin using an acrylic resin was dried at 105 ° C. for 1 minute. The thickness of the base film was about 1 to 3 μm. Was formed.

Regarding the surface of the infrared cut-off layer of each of Examples and Comparative Examples, the wetting index according to “JIS K6768” and the surface roughness (R) according to “JIS B0601”
a) was measured. Further, with respect to the infrared cut-off layer of each of the examples and the comparative examples, a HAZE value according to “JIS K7105” and a color coordinate according to “JIS K8701” were measured. Further, an epoxy-acrylic mixed type UV-curable resin is applied to the surface of the infrared cutoff layer to form a protective layer, and an acrylic adhesive (trade name: AS-6000; Co., Ltd.) was applied to form an adhesive layer, and the adhesion of the protective layer and the adhesive layer to the infrared cutoff layer was examined.

The adhesion test of the protective layer to the infrared cut-off layer was performed by a grid test according to “JIS K5400” at 25 ° C./humidity 50% Rh and 30 ° C./humidity 65% Rh.
Under two conditions. As the evaluation, when the number of peeled grids / the total number of grids (100) is 100/100, ◎ (excellent adhesion), and when 90 to 99/100, ○ (has sufficient adhesion) , 80-89 / 100
(There is a problem in practical use), 79 or less / 100 was evaluated as x (there is a problem in practical use).

The adhesion test of the pressure-sensitive adhesive layer to the infrared cut-off layer employs a method of rapidly peeling off the infrared cut-off layer together with the base film from a state in which the pressure-sensitive adhesive layer is adhered to a glass plate. The test was carried out under two conditions of 50% Rh / humidity and 65% Rh at 30 ° C./humidity. The evaluation was ◎ when the infrared cutoff layer was not peeled off from the adhesive layer at all (excellent in adhesiveness), 場合 when 5% or less of the entire area was peeled off, ○ (having sufficient adhesiveness), and 10 in the total area. % Was peeled off (slightly problematic in practical use), and 11% or less of the entire area was peeled off (poor in practical use). Table 1 shows the test results.

[0052]

[Table 1]

According to Table 1, it was confirmed that the infrared cutoff layer of each of the examples having a wetting index satisfying the specified value of the present invention had high adhesion. On the other hand, in each of Comparative Examples in which the wetting index was not less than the specified value of the present invention, the adhesion was insufficient and there was a problem in practical use, and the effect of the present invention became clear.

[0054]

As described above, according to the present invention,
By controlling the wetting index (surface tension: dyn / cm) of the surface of the infrared cutoff layer composed of the powder of the infrared cutoff agent and the resin according to “JIS K6768” to 50 or less, the infrared cutoff layer is laminated on the infrared cutoff layer. It is possible to provide a high-quality infrared cutoff film in which the adhesion of the layer is sufficiently ensured and the layer does not peel off.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram illustrating an example of a layer configuration of an infrared cutoff film according to an embodiment of the present invention.

FIG. 2 is a conceptual diagram showing another example of the layer configuration of the infrared cutoff film according to one embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Base film, 2 ... Infrared cutoff layer, 3 ... Protective layer, 4 ... Adhesive layer, 5 ... Separate material.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F100 AA33B AA33H AK01B AK12 AK25 AL06 AT00A AT00B AT00C BA03 BA07 BA26 CA07B DE01B EJ34 GB07 GB32 JA20 JA20B JD09 JD10B JD14B JK06 JK14 JL11 JN06B YY00

Claims (5)

[Claims] 1. An infrared cutoff film having at least a base film, an infrared cutoff layer laminated on the base film, and at least one layer formed on the surface of the infrared cutoff layer, The cut-off layer contains a powder and a resin that reflect or absorb infrared rays, and has “J” on its surface.
IS K6768 "(Surface tension: dyn
/ Cm) is 50 or less. 2. The JIS B of the infrared cutoff layer
The infrared cutoff film according to claim 1, wherein the surface roughness (Ra) according to "0601" is 0.014 or more. 3. Haze according to “JIS K7105”
The infrared cut-off film according to claim 1, wherein the value is 0.5 to 5.0. 4. The color coordinates according to “JIS K8701” are x = 0.31 ± 0.1, y = 0.32 ± 0.1, z
= 0.37 ± 0.1.
3. The infrared cutoff film according to any one of 3. 5. The powder of the infrared cut-off layer,
2. A tin-containing indium oxide.
5. The infrared cutoff film according to any one of items 1 to 4.