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IT1290156B1 - Chip di memoria contenente un registro di memoria non volatile per la memorizzazione permanente di informazioni relative alla qualita' del - Google Patents

Chip di memoria contenente un registro di memoria non volatile per la memorizzazione permanente di informazioni relative alla qualita' del

Info

Publication number
IT1290156B1
IT1290156B1 IT96RM000880A ITRM960880A IT1290156B1 IT 1290156 B1 IT1290156 B1 IT 1290156B1 IT 96RM000880 A IT96RM000880 A IT 96RM000880A IT RM960880 A ITRM960880 A IT RM960880A IT 1290156 B1 IT1290156 B1 IT 1290156B1
Authority
IT
Italy
Prior art keywords
quality
information relating
permanent storage
chip containing
volatile memory
Prior art date
Application number
IT96RM000880A
Other languages
English (en)
Inventor
Zenzo Maurizio Di
Giuseppe Savarese
Original Assignee
Texas Instruments Italia Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Italia Spa filed Critical Texas Instruments Italia Spa
Priority to IT96RM000880A priority Critical patent/IT1290156B1/it
Publication of ITRM960880A0 publication Critical patent/ITRM960880A0/it
Priority to DE69719301T priority patent/DE69719301T2/de
Priority to EP97830673A priority patent/EP0849675B1/en
Priority to US08/992,607 priority patent/US6130442A/en
Priority to JP9349712A priority patent/JPH10284692A/ja
Priority to SG1997004556A priority patent/SG67460A1/en
Priority to TW087102511A priority patent/TW397983B/zh
Publication of ITRM960880A1 publication Critical patent/ITRM960880A1/it
Application granted granted Critical
Publication of IT1290156B1 publication Critical patent/IT1290156B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/006—Identification
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/44—Indication or identification of errors, e.g. for repair
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Quality & Reliability (AREA)
  • Power Engineering (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Non-Volatile Memory (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
  • Semiconductor Integrated Circuits (AREA)
IT96RM000880A 1996-12-18 1996-12-18 Chip di memoria contenente un registro di memoria non volatile per la memorizzazione permanente di informazioni relative alla qualita' del IT1290156B1 (it)

Priority Applications (7)

Application Number Priority Date Filing Date Title
IT96RM000880A IT1290156B1 (it) 1996-12-18 1996-12-18 Chip di memoria contenente un registro di memoria non volatile per la memorizzazione permanente di informazioni relative alla qualita' del
DE69719301T DE69719301T2 (de) 1996-12-18 1997-12-15 Flüchtiger Speicherchip mit nicht-flüchtigen Speicherplätzen zur Speicherung von Qualitätsinformation
EP97830673A EP0849675B1 (en) 1996-12-18 1997-12-15 Volatile memory chip with non-volatile memory locations for storing quality information
US08/992,607 US6130442A (en) 1996-12-18 1997-12-17 Memory chip containing a non-volatile memory register for permanently storing information about the quality of the device and test method therefor
JP9349712A JPH10284692A (ja) 1996-12-18 1997-12-18 デバイスの品質に関する情報を永久的に記憶する不揮発性メモリ・レジスタを含むメモリ・チップ及びその試験方法
SG1997004556A SG67460A1 (en) 1996-12-18 1997-12-18 A memory chip containing a non-volatile memory register for permanently storing information about the quality of the device and test method therefor
TW087102511A TW397983B (en) 1996-12-18 1998-02-23 A memory chip containing a non=volatile memory register for permanently storing information about the quality of the device and test method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT96RM000880A IT1290156B1 (it) 1996-12-18 1996-12-18 Chip di memoria contenente un registro di memoria non volatile per la memorizzazione permanente di informazioni relative alla qualita' del

Publications (3)

Publication Number Publication Date
ITRM960880A0 ITRM960880A0 (it) 1996-12-18
ITRM960880A1 ITRM960880A1 (it) 1998-06-18
IT1290156B1 true IT1290156B1 (it) 1998-10-19

Family

ID=11404601

Family Applications (1)

Application Number Title Priority Date Filing Date
IT96RM000880A IT1290156B1 (it) 1996-12-18 1996-12-18 Chip di memoria contenente un registro di memoria non volatile per la memorizzazione permanente di informazioni relative alla qualita' del

Country Status (7)

Country Link
US (1) US6130442A (it)
EP (1) EP0849675B1 (it)
JP (1) JPH10284692A (it)
DE (1) DE69719301T2 (it)
IT (1) IT1290156B1 (it)
SG (1) SG67460A1 (it)
TW (1) TW397983B (it)

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US6100486A (en) 1998-08-13 2000-08-08 Micron Technology, Inc. Method for sorting integrated circuit devices
US5927512A (en) 1997-01-17 1999-07-27 Micron Technology, Inc. Method for sorting integrated circuit devices
US5844803A (en) 1997-02-17 1998-12-01 Micron Technology, Inc. Method of sorting a group of integrated circuit devices for those devices requiring special testing
US5915231A (en) 1997-02-26 1999-06-22 Micron Technology, Inc. Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture
US5856923A (en) 1997-03-24 1999-01-05 Micron Technology, Inc. Method for continuous, non lot-based integrated circuit manufacturing
US7120513B1 (en) 1997-06-06 2006-10-10 Micron Technology, Inc. Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs
US5907492A (en) * 1997-06-06 1999-05-25 Micron Technology, Inc. Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
US6049624A (en) 1998-02-20 2000-04-11 Micron Technology, Inc. Non-lot based method for assembling integrated circuit devices
DE19951048C2 (de) * 1999-10-22 2002-11-21 Infineon Technologies Ag Verfahren zur Identifizierung einer integrierten Schaltung
DE19963689A1 (de) * 1999-12-29 2001-07-12 Infineon Technologies Ag Schaltungsanordnung eines integrierten Halbleiterspeichers zum Speichern von Adressen fehlerhafter Speicherzellen
US7802155B2 (en) * 2000-01-06 2010-09-21 Super Talent Electronics, Inc. Non-volatile memory device manufacturing process testing systems and methods thereof
US6553521B1 (en) * 2000-02-24 2003-04-22 Infineon Technologies, Richmond L.P. Method for efficient analysis semiconductor failures
US7269765B1 (en) * 2000-04-13 2007-09-11 Micron Technology, Inc. Method and apparatus for storing failing part locations in a module
DE10034878C2 (de) * 2000-07-18 2003-12-04 Infineon Technologies Ag Verfahren zum Überprüfen eines Bauelementes und Bauelement mit Testspeicher
JP4413406B2 (ja) * 2000-10-03 2010-02-10 株式会社東芝 不揮発性半導体メモリ及びそのテスト方法
DE10102349C1 (de) 2001-01-19 2002-08-08 Infineon Technologies Ag Verfahren und Schaltungsanordnung zur Kennzeichnung einer Betriebseigenschaft einer integrierten Schaltung
DE10103991C1 (de) * 2001-01-30 2002-06-06 Infineon Technologies Ag Verfahren zur Ermittlung der Temperatur eines Halbleiterbauelements insbesondere beim Fehlertest
DE10115280C2 (de) * 2001-03-28 2003-12-24 Infineon Technologies Ag Verfahren zum Klassifizieren von Bauelementen
US6605478B2 (en) * 2001-03-30 2003-08-12 Appleid Materials, Inc, Kill index analysis for automatic defect classification in semiconductor wafers
DE10139608B4 (de) * 2001-08-11 2007-05-16 Nucellsys Gmbh Brennstoffzellenanlage mit einem Gaserzeugungssystem und einem Brennstoffzellensystem und deren Verwendung
US6639418B2 (en) 2001-11-21 2003-10-28 Taiwan Semiconductor Manufacturing Co., Ltd. Microelectronic fabrication die electrical probe apparatus electrical test method providing enhanced microelectronic fabrication die electrical test accuracy and efficiency
US7493534B2 (en) * 2003-08-29 2009-02-17 Hewlett-Packard Development Company, L.P. Memory error ranking
US7484065B2 (en) 2004-04-20 2009-01-27 Hewlett-Packard Development Company, L.P. Selective memory allocation
US7814377B2 (en) * 2004-07-09 2010-10-12 Sandisk Corporation Non-volatile memory system with self test capability
JP2008108326A (ja) * 2006-10-24 2008-05-08 Toshiba Corp 記憶装置およびその自己テスト方法
US20090288057A1 (en) * 2008-05-15 2009-11-19 Texas Instruments Incorporated System and Method for Ordering the Selection of Integrated Circuit Chips
US7925939B2 (en) * 2008-09-26 2011-04-12 Macronix International Co., Ltd Pre-code device, and pre-code system and pre-coding method thererof
TWI394168B (zh) * 2008-10-31 2013-04-21 Moai Electronics Corp Memory test method
US8621324B2 (en) * 2010-12-10 2013-12-31 Qualcomm Incorporated Embedded DRAM having low power self-correction capability
US9583219B2 (en) 2014-09-27 2017-02-28 Qualcomm Incorporated Method and apparatus for in-system repair of memory in burst refresh
US10290354B1 (en) * 2017-10-31 2019-05-14 Sandisk Technologies Llc Partial memory die
TWI714169B (zh) * 2019-07-17 2020-12-21 美商第一檢測有限公司 記憶體測試方法
TWI837552B (zh) * 2021-12-01 2024-04-01 慧榮科技股份有限公司 資料儲存裝置的自我燒機測試系統及其方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3828988A1 (de) * 1988-08-26 1990-03-01 Bosch Gmbh Robert Herstellungsverfahren fuer ein elektronisches geraet
JP2765771B2 (ja) * 1991-08-07 1998-06-18 ローム株式会社 半導体記憶装置の試験方法
US5256578A (en) * 1991-12-23 1993-10-26 Motorola, Inc. Integral semiconductor wafer map recording
JP3659981B2 (ja) * 1992-07-09 2005-06-15 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド ダイ特定情報に特徴付けられるダイ上の集積回路を含む装置
EP0721645B1 (en) * 1993-09-30 2001-05-09 Macronix International Co., Ltd. Automatic test circuitry with non-volatile status write
GB9411950D0 (en) * 1994-06-15 1994-08-03 Deas Alexander R Memory test system
US5895962A (en) * 1996-06-13 1999-04-20 Micron Technology, Inc. Structure and a method for storing information in a semiconductor device
US5907492A (en) * 1997-06-06 1999-05-25 Micron Technology, Inc. Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

Also Published As

Publication number Publication date
DE69719301D1 (de) 2003-04-03
US6130442A (en) 2000-10-10
ITRM960880A0 (it) 1996-12-18
TW397983B (en) 2000-07-11
ITRM960880A1 (it) 1998-06-18
EP0849675B1 (en) 2003-02-26
JPH10284692A (ja) 1998-10-23
DE69719301T2 (de) 2003-12-11
SG67460A1 (en) 1999-09-21
EP0849675A3 (en) 1998-09-09
EP0849675A2 (en) 1998-06-24

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