IT1251928B - THICK LAYER CERMET ELEMENT AND PROCEDURE FOR ITS MANUFACTURE. - Google Patents
THICK LAYER CERMET ELEMENT AND PROCEDURE FOR ITS MANUFACTURE.Info
- Publication number
- IT1251928B IT1251928B ITMI912722A ITMI912722A IT1251928B IT 1251928 B IT1251928 B IT 1251928B IT MI912722 A ITMI912722 A IT MI912722A IT MI912722 A ITMI912722 A IT MI912722A IT 1251928 B IT1251928 B IT 1251928B
- Authority
- IT
- Italy
- Prior art keywords
- manufacture
- thick layer
- procedure
- substrate
- cermet element
- Prior art date
Links
- 239000011195 cermet Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 3
- 239000000919 ceramic Substances 0.000 abstract 2
- 238000003825 pressing Methods 0.000 abstract 2
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
- G01L1/2293—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges of the semi-conductor type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Vengono proposti un elemento di resistenza di superficie particolarmente liscia nonché un procedimento per la sua fabbricazione. L'elemento di resistenza è una disposizione a strato spesso, costituita di almeno uno strato (13) a pista conduttrice e di uno strato di resistenza (12) di Cermet su un substrato ceramico (14). La disposizione (12-14) degli strati viene applicata su un supporto di pressione (1) e successivamente pressato in un attrezzo di pressatura (20-22) con un substrato (14). Al termine dell'operazione di pressatura il supporto di pressione (1) viene tolto. Come substrato si impiega preferibilmente una foglia ceramica flessibile non sottoposta a cottura.(Figura 3).A particularly smooth surface resistance element as well as a process for its manufacture are proposed. The resistance element is a thick layer arrangement, consisting of at least one conductive track layer (13) and a Cermet resistance layer (12) on a ceramic substrate (14). The arrangement (12-14) of the layers is applied on a pressure support (1) and subsequently pressed in a pressing tool (20-22) with a substrate (14). At the end of the pressing operation, the pressure support (1) is removed. As substrate, a flexible ceramic sheet which has not been fired is preferably used (Figure 3).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4033707A DE4033707A1 (en) | 1990-10-24 | 1990-10-24 | Cermet thick-film resistor - has flush conductive track pressed together with resistive track(s) into ceramic green sheet over polished surface |
Publications (3)
Publication Number | Publication Date |
---|---|
ITMI912722A0 ITMI912722A0 (en) | 1991-10-15 |
ITMI912722A1 ITMI912722A1 (en) | 1993-04-15 |
IT1251928B true IT1251928B (en) | 1995-05-27 |
Family
ID=6416893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI912722A IT1251928B (en) | 1990-10-24 | 1991-10-15 | THICK LAYER CERMET ELEMENT AND PROCEDURE FOR ITS MANUFACTURE. |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH689501A5 (en) |
DE (1) | DE4033707A1 (en) |
IT (1) | IT1251928B (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4234022C2 (en) * | 1992-10-09 | 1995-05-24 | Telefunken Microelectron | Layer circuit with at least one power resistor |
JP3099640B2 (en) * | 1994-06-14 | 2000-10-16 | 株式会社村田製作所 | Method for manufacturing resistor with built-in sintered body and method for manufacturing multilayer ceramic electronic component |
DE19509554A1 (en) * | 1995-03-16 | 1996-09-19 | Bosch Gmbh Robert | Multilayer circuit manufacturing method for ceramic capacitor |
DE10012244A1 (en) * | 2000-03-14 | 2001-10-04 | Bosch Gmbh Robert | Manufacturing printing plate involves applying structurable coating to plate, structuring coating to form a structured coating with recesses, filling recesses and removing structured coating |
US7093495B2 (en) * | 2003-07-28 | 2006-08-22 | Cts Corporation | Pressure sensor |
US6997059B2 (en) | 2003-10-07 | 2006-02-14 | Cts Corporation | Pressure sensor |
US7240558B2 (en) | 2003-11-19 | 2007-07-10 | Cts Corporation | Pressure sensor |
EP1785706A1 (en) * | 2005-11-15 | 2007-05-16 | IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A. | Method for producing an electric circuit on a flexible substrate |
CN109124035A (en) * | 2018-07-25 | 2019-01-04 | 芜湖中淇节能科技有限公司 | A kind of computer user data acquisition device |
-
1990
- 1990-10-24 DE DE4033707A patent/DE4033707A1/en not_active Withdrawn
-
1991
- 1991-07-01 CH CH01938/91A patent/CH689501A5/en not_active IP Right Cessation
- 1991-10-15 IT ITMI912722A patent/IT1251928B/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
ITMI912722A0 (en) | 1991-10-15 |
DE4033707A1 (en) | 1992-04-30 |
ITMI912722A1 (en) | 1993-04-15 |
CH689501A5 (en) | 1999-05-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted | ||
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19971029 |