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IT1193238B - MOSFET DEVICE EQUIPPED WITH A PLURALITY OF POLYGONAL CONFIGURATION SOURCES - Google Patents

MOSFET DEVICE EQUIPPED WITH A PLURALITY OF POLYGONAL CONFIGURATION SOURCES

Info

Publication number
IT1193238B
IT1193238B IT26435/79A IT2643579A IT1193238B IT 1193238 B IT1193238 B IT 1193238B IT 26435/79 A IT26435/79 A IT 26435/79A IT 2643579 A IT2643579 A IT 2643579A IT 1193238 B IT1193238 B IT 1193238B
Authority
IT
Italy
Prior art keywords
device equipped
mosfet device
polygonal configuration
configuration sources
sources
Prior art date
Application number
IT26435/79A
Other languages
Italian (it)
Other versions
IT7926435A0 (en
Inventor
Alexander Lidow
Thomas Herman
Vladimir Rumennik
Original Assignee
Int Rectifier Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26715426&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IT1193238(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Int Rectifier Corp filed Critical Int Rectifier Corp
Publication of IT7926435A0 publication Critical patent/IT7926435A0/en
Application granted granted Critical
Publication of IT1193238B publication Critical patent/IT1193238B/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/665Vertical DMOS [VDMOS] FETs having edge termination structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/662Vertical DMOS [VDMOS] FETs having a drift region having a doping concentration that is higher between adjacent body regions relative to other parts of the drift region
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/663Vertical DMOS [VDMOS] FETs having both source contacts and drain contacts on the same surface, i.e. up-drain VDMOS
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 
    • H10D62/156Drain regions of DMOS transistors
    • H10D62/157Impurity concentrations or distributions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/393Body regions of DMOS transistors or IGBTs 
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601Structure
    • H01L2224/0603Bonding areas having different sizes, e.g. different heights or widths
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 
IT26435/79A 1978-10-13 1979-10-11 MOSFET DEVICE EQUIPPED WITH A PLURALITY OF POLYGONAL CONFIGURATION SOURCES IT1193238B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US95131078A 1978-10-13 1978-10-13
US3866279A 1979-05-14 1979-05-14

Publications (2)

Publication Number Publication Date
IT7926435A0 IT7926435A0 (en) 1979-10-11
IT1193238B true IT1193238B (en) 1988-06-15

Family

ID=26715426

Family Applications (1)

Application Number Title Priority Date Filing Date
IT26435/79A IT1193238B (en) 1978-10-13 1979-10-11 MOSFET DEVICE EQUIPPED WITH A PLURALITY OF POLYGONAL CONFIGURATION SOURCES

Country Status (19)

Country Link
JP (2) JP2622378B2 (en)
AR (1) AR219006A1 (en)
BR (1) BR7906338A (en)
CA (2) CA1123119A (en)
CH (2) CH660649A5 (en)
CS (1) CS222676B2 (en)
DE (2) DE2954481C2 (en)
DK (3) DK157272C (en)
ES (1) ES484652A1 (en)
FR (1) FR2438917A1 (en)
GB (1) GB2033658B (en)
HU (1) HU182506B (en)
IL (1) IL58128A (en)
IT (1) IT1193238B (en)
MX (1) MX147137A (en)
NL (1) NL175358C (en)
PL (1) PL123961B1 (en)
SE (2) SE443682B (en)
SU (1) SU1621817A3 (en)

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US4593302B1 (en) * 1980-08-18 1998-02-03 Int Rectifier Corp Process for manufacture of high power mosfet laterally distributed high carrier density beneath the gate oxide
DE3040775C2 (en) * 1980-10-29 1987-01-15 Siemens AG, 1000 Berlin und 8000 München Controllable MIS semiconductor device
US4412242A (en) 1980-11-17 1983-10-25 International Rectifier Corporation Planar structure for high voltage semiconductor devices with gaps in glassy layer over high field regions
GB2111745B (en) * 1981-12-07 1985-06-19 Philips Electronic Associated Insulated-gate field-effect transistors
CA1188821A (en) * 1982-09-03 1985-06-11 Patrick W. Clarke Power mosfet integrated circuit
US4532534A (en) * 1982-09-07 1985-07-30 Rca Corporation MOSFET with perimeter channel
DE3346286A1 (en) * 1982-12-21 1984-06-28 International Rectifier Corp., Los Angeles, Calif. High-power metal-oxide field-effect transistor semiconductor component
JPS59167066A (en) * 1983-03-14 1984-09-20 Nissan Motor Co Ltd Vertical type metal oxide semiconductor field effect transistor
JPS6010677A (en) * 1983-06-30 1985-01-19 Nissan Motor Co Ltd Vertical MOS transistor
JPH0247874A (en) * 1988-08-10 1990-02-16 Fuji Electric Co Ltd Manufacturing method of MOS type semiconductor device
IT1247293B (en) * 1990-05-09 1994-12-12 Int Rectifier Corp POWER TRANSISTOR DEVICE PRESENTING AN ULTRA-DEEP REGION, AT A GREATER CONCENTRATION
US5766966A (en) * 1996-02-09 1998-06-16 International Rectifier Corporation Power transistor device having ultra deep increased concentration region
US5304831A (en) * 1990-12-21 1994-04-19 Siliconix Incorporated Low on-resistance power MOS technology
US5404040A (en) * 1990-12-21 1995-04-04 Siliconix Incorporated Structure and fabrication of power MOSFETs, including termination structures
IT1250233B (en) * 1991-11-29 1995-04-03 St Microelectronics Srl PROCEDURE FOR THE MANUFACTURE OF INTEGRATED CIRCUITS IN MOS TECHNOLOGY.
DE59208987D1 (en) * 1992-08-10 1997-11-27 Siemens Ag Power MOSFET with improved avalanche strength
JPH06268227A (en) * 1993-03-10 1994-09-22 Hitachi Ltd Insulated gate bipolar transistor
EP0660396B1 (en) * 1993-12-24 1998-11-04 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno Power MOS device chip and package assembly
US5798287A (en) * 1993-12-24 1998-08-25 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Method for forming a power MOS device chip
DE69321966T2 (en) * 1993-12-24 1999-06-02 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania Power semiconductor device
EP0665597A1 (en) * 1994-01-27 1995-08-02 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno - CoRiMMe IGBT and manufacturing process therefore
EP0689238B1 (en) * 1994-06-23 2002-02-20 STMicroelectronics S.r.l. MOS-technology power device manufacturing process
US5817546A (en) * 1994-06-23 1998-10-06 Stmicroelectronics S.R.L. Process of making a MOS-technology power device
DE69418037T2 (en) * 1994-08-02 1999-08-26 Consorzio Per La Ricerca Sulla Microelettronica Ne Power semiconductor device made of MOS technology chips and housing structure
US5798554A (en) * 1995-02-24 1998-08-25 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno MOS-technology power device integrated structure and manufacturing process thereof
DE69533134T2 (en) 1995-10-30 2005-07-07 Stmicroelectronics S.R.L., Agrate Brianza Power component of high density in MOS technology
EP0772242B1 (en) 1995-10-30 2006-04-05 STMicroelectronics S.r.l. Single feature size MOS technology power device
US6228719B1 (en) 1995-11-06 2001-05-08 Stmicroelectronics S.R.L. MOS technology power device with low output resistance and low capacitance, and related manufacturing process
DE69518653T2 (en) * 1995-12-28 2001-04-19 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania MOS technology power arrangement in an integrated structure
DE69839439D1 (en) 1998-05-26 2008-06-19 St Microelectronics Srl MOS technology power arrangement with high integration density
EP1126527A4 (en) * 1999-04-09 2007-06-13 Shindengen Electric Mfg HOCHSPANNUNGSHALBLERTERANURDNUNG
JP4122113B2 (en) * 1999-06-24 2008-07-23 新電元工業株式会社 High breakdown strength field effect transistor
US6344379B1 (en) 1999-10-22 2002-02-05 Semiconductor Components Industries Llc Semiconductor device with an undulating base region and method therefor
JP4845293B2 (en) * 2000-08-30 2011-12-28 新電元工業株式会社 Field effect transistor
JP2006295134A (en) 2005-03-17 2006-10-26 Sanyo Electric Co Ltd Semiconductor device and manufacturing method thereof
US9484451B2 (en) 2007-10-05 2016-11-01 Vishay-Siliconix MOSFET active area and edge termination area charge balance
US9431249B2 (en) 2011-12-01 2016-08-30 Vishay-Siliconix Edge termination for super junction MOSFET devices
US9614043B2 (en) 2012-02-09 2017-04-04 Vishay-Siliconix MOSFET termination trench
US9842911B2 (en) 2012-05-30 2017-12-12 Vishay-Siliconix Adaptive charge balanced edge termination
US9530844B2 (en) 2012-12-28 2016-12-27 Cree, Inc. Transistor structures having reduced electrical field at the gate oxide and methods for making same
US10115815B2 (en) 2012-12-28 2018-10-30 Cree, Inc. Transistor structures having a deep recessed P+ junction and methods for making same
JP5907097B2 (en) * 2013-03-18 2016-04-20 三菱電機株式会社 Semiconductor device
US9508596B2 (en) 2014-06-20 2016-11-29 Vishay-Siliconix Processes used in fabricating a metal-insulator-semiconductor field effect transistor
US9887259B2 (en) 2014-06-23 2018-02-06 Vishay-Siliconix Modulated super junction power MOSFET devices
KR102098996B1 (en) 2014-08-19 2020-04-08 비쉐이-실리코닉스 Super-junction metal oxide semiconductor field effect transistor
US10615274B2 (en) 2017-12-21 2020-04-07 Cree, Inc. Vertical semiconductor device with improved ruggedness
US11489069B2 (en) 2017-12-21 2022-11-01 Wolfspeed, Inc. Vertical semiconductor device with improved ruggedness

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US4015278A (en) * 1974-11-26 1977-03-29 Fujitsu Ltd. Field effect semiconductor device
JPS52106688A (en) * 1976-03-05 1977-09-07 Nec Corp Field-effect transistor
JPS52132684A (en) * 1976-04-29 1977-11-07 Sony Corp Insulating gate type field effect transistor
US4055884A (en) * 1976-12-13 1977-11-01 International Business Machines Corporation Fabrication of power field effect transistors and the resulting structures
JPS5374385A (en) * 1976-12-15 1978-07-01 Hitachi Ltd Manufacture of field effect semiconductor device
US4148047A (en) * 1978-01-16 1979-04-03 Honeywell Inc. Semiconductor apparatus
JPH05185381A (en) * 1992-01-10 1993-07-27 Yuum Kogyo:Kk Handle for edge-replaceable saw

Also Published As

Publication number Publication date
CH660649A5 (en) 1987-05-15
JP2622378B2 (en) 1997-06-18
DK512488D0 (en) 1988-09-15
DE2940699C2 (en) 1986-04-03
AR219006A1 (en) 1980-07-15
JPS6323365A (en) 1988-01-30
HU182506B (en) 1984-01-30
PL123961B1 (en) 1982-12-31
DK512388D0 (en) 1988-09-15
IT7926435A0 (en) 1979-10-11
FR2438917B1 (en) 1984-09-07
JPH07169950A (en) 1995-07-04
DK512488A (en) 1988-09-15
ES484652A1 (en) 1980-09-01
CA1123119A (en) 1982-05-04
GB2033658A (en) 1980-05-21
SE465444B (en) 1991-09-09
DK512388A (en) 1988-09-15
DE2940699A1 (en) 1980-04-24
BR7906338A (en) 1980-06-24
IL58128A (en) 1981-12-31
CH642485A5 (en) 1984-04-13
GB2033658B (en) 1983-03-02
NL175358C (en) 1984-10-16
SE443682B (en) 1986-03-03
MX147137A (en) 1982-10-13
JP2643095B2 (en) 1997-08-20
SE7908479L (en) 1980-04-14
CA1136291A (en) 1982-11-23
NL175358B (en) 1984-05-16
CS222676B2 (en) 1983-07-29
DK157272B (en) 1989-11-27
DE2954481C2 (en) 1990-12-06
DK157272C (en) 1990-04-30
SU1621817A3 (en) 1991-01-15
FR2438917A1 (en) 1980-05-09
SE8503615L (en) 1985-07-26
NL7907472A (en) 1980-04-15
PL218878A1 (en) 1980-08-11
DK350679A (en) 1980-04-14
SE8503615D0 (en) 1985-07-26

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19971029