IT1193238B - MOSFET DEVICE EQUIPPED WITH A PLURALITY OF POLYGONAL CONFIGURATION SOURCES - Google Patents
MOSFET DEVICE EQUIPPED WITH A PLURALITY OF POLYGONAL CONFIGURATION SOURCESInfo
- Publication number
- IT1193238B IT1193238B IT26435/79A IT2643579A IT1193238B IT 1193238 B IT1193238 B IT 1193238B IT 26435/79 A IT26435/79 A IT 26435/79A IT 2643579 A IT2643579 A IT 2643579A IT 1193238 B IT1193238 B IT 1193238B
- Authority
- IT
- Italy
- Prior art keywords
- device equipped
- mosfet device
- polygonal configuration
- configuration sources
- sources
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/665—Vertical DMOS [VDMOS] FETs having edge termination structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/662—Vertical DMOS [VDMOS] FETs having a drift region having a doping concentration that is higher between adjacent body regions relative to other parts of the drift region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/663—Vertical DMOS [VDMOS] FETs having both source contacts and drain contacts on the same surface, i.e. up-drain VDMOS
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
- H10D62/156—Drain regions of DMOS transistors
- H10D62/157—Impurity concentrations or distributions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/393—Body regions of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US95131078A | 1978-10-13 | 1978-10-13 | |
US3866279A | 1979-05-14 | 1979-05-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7926435A0 IT7926435A0 (en) | 1979-10-11 |
IT1193238B true IT1193238B (en) | 1988-06-15 |
Family
ID=26715426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT26435/79A IT1193238B (en) | 1978-10-13 | 1979-10-11 | MOSFET DEVICE EQUIPPED WITH A PLURALITY OF POLYGONAL CONFIGURATION SOURCES |
Country Status (19)
Country | Link |
---|---|
JP (2) | JP2622378B2 (en) |
AR (1) | AR219006A1 (en) |
BR (1) | BR7906338A (en) |
CA (2) | CA1123119A (en) |
CH (2) | CH660649A5 (en) |
CS (1) | CS222676B2 (en) |
DE (2) | DE2954481C2 (en) |
DK (3) | DK157272C (en) |
ES (1) | ES484652A1 (en) |
FR (1) | FR2438917A1 (en) |
GB (1) | GB2033658B (en) |
HU (1) | HU182506B (en) |
IL (1) | IL58128A (en) |
IT (1) | IT1193238B (en) |
MX (1) | MX147137A (en) |
NL (1) | NL175358C (en) |
PL (1) | PL123961B1 (en) |
SE (2) | SE443682B (en) |
SU (1) | SU1621817A3 (en) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4593302B1 (en) * | 1980-08-18 | 1998-02-03 | Int Rectifier Corp | Process for manufacture of high power mosfet laterally distributed high carrier density beneath the gate oxide |
DE3040775C2 (en) * | 1980-10-29 | 1987-01-15 | Siemens AG, 1000 Berlin und 8000 München | Controllable MIS semiconductor device |
US4412242A (en) | 1980-11-17 | 1983-10-25 | International Rectifier Corporation | Planar structure for high voltage semiconductor devices with gaps in glassy layer over high field regions |
GB2111745B (en) * | 1981-12-07 | 1985-06-19 | Philips Electronic Associated | Insulated-gate field-effect transistors |
CA1188821A (en) * | 1982-09-03 | 1985-06-11 | Patrick W. Clarke | Power mosfet integrated circuit |
US4532534A (en) * | 1982-09-07 | 1985-07-30 | Rca Corporation | MOSFET with perimeter channel |
DE3346286A1 (en) * | 1982-12-21 | 1984-06-28 | International Rectifier Corp., Los Angeles, Calif. | High-power metal-oxide field-effect transistor semiconductor component |
JPS59167066A (en) * | 1983-03-14 | 1984-09-20 | Nissan Motor Co Ltd | Vertical type metal oxide semiconductor field effect transistor |
JPS6010677A (en) * | 1983-06-30 | 1985-01-19 | Nissan Motor Co Ltd | Vertical MOS transistor |
JPH0247874A (en) * | 1988-08-10 | 1990-02-16 | Fuji Electric Co Ltd | Manufacturing method of MOS type semiconductor device |
IT1247293B (en) * | 1990-05-09 | 1994-12-12 | Int Rectifier Corp | POWER TRANSISTOR DEVICE PRESENTING AN ULTRA-DEEP REGION, AT A GREATER CONCENTRATION |
US5766966A (en) * | 1996-02-09 | 1998-06-16 | International Rectifier Corporation | Power transistor device having ultra deep increased concentration region |
US5304831A (en) * | 1990-12-21 | 1994-04-19 | Siliconix Incorporated | Low on-resistance power MOS technology |
US5404040A (en) * | 1990-12-21 | 1995-04-04 | Siliconix Incorporated | Structure and fabrication of power MOSFETs, including termination structures |
IT1250233B (en) * | 1991-11-29 | 1995-04-03 | St Microelectronics Srl | PROCEDURE FOR THE MANUFACTURE OF INTEGRATED CIRCUITS IN MOS TECHNOLOGY. |
DE59208987D1 (en) * | 1992-08-10 | 1997-11-27 | Siemens Ag | Power MOSFET with improved avalanche strength |
JPH06268227A (en) * | 1993-03-10 | 1994-09-22 | Hitachi Ltd | Insulated gate bipolar transistor |
EP0660396B1 (en) * | 1993-12-24 | 1998-11-04 | Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno | Power MOS device chip and package assembly |
US5798287A (en) * | 1993-12-24 | 1998-08-25 | Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno | Method for forming a power MOS device chip |
DE69321966T2 (en) * | 1993-12-24 | 1999-06-02 | Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania | Power semiconductor device |
EP0665597A1 (en) * | 1994-01-27 | 1995-08-02 | Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno - CoRiMMe | IGBT and manufacturing process therefore |
EP0689238B1 (en) * | 1994-06-23 | 2002-02-20 | STMicroelectronics S.r.l. | MOS-technology power device manufacturing process |
US5817546A (en) * | 1994-06-23 | 1998-10-06 | Stmicroelectronics S.R.L. | Process of making a MOS-technology power device |
DE69418037T2 (en) * | 1994-08-02 | 1999-08-26 | Consorzio Per La Ricerca Sulla Microelettronica Ne | Power semiconductor device made of MOS technology chips and housing structure |
US5798554A (en) * | 1995-02-24 | 1998-08-25 | Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno | MOS-technology power device integrated structure and manufacturing process thereof |
DE69533134T2 (en) | 1995-10-30 | 2005-07-07 | Stmicroelectronics S.R.L., Agrate Brianza | Power component of high density in MOS technology |
EP0772242B1 (en) | 1995-10-30 | 2006-04-05 | STMicroelectronics S.r.l. | Single feature size MOS technology power device |
US6228719B1 (en) | 1995-11-06 | 2001-05-08 | Stmicroelectronics S.R.L. | MOS technology power device with low output resistance and low capacitance, and related manufacturing process |
DE69518653T2 (en) * | 1995-12-28 | 2001-04-19 | Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania | MOS technology power arrangement in an integrated structure |
DE69839439D1 (en) | 1998-05-26 | 2008-06-19 | St Microelectronics Srl | MOS technology power arrangement with high integration density |
EP1126527A4 (en) * | 1999-04-09 | 2007-06-13 | Shindengen Electric Mfg | HOCHSPANNUNGSHALBLERTERANURDNUNG |
JP4122113B2 (en) * | 1999-06-24 | 2008-07-23 | 新電元工業株式会社 | High breakdown strength field effect transistor |
US6344379B1 (en) | 1999-10-22 | 2002-02-05 | Semiconductor Components Industries Llc | Semiconductor device with an undulating base region and method therefor |
JP4845293B2 (en) * | 2000-08-30 | 2011-12-28 | 新電元工業株式会社 | Field effect transistor |
JP2006295134A (en) | 2005-03-17 | 2006-10-26 | Sanyo Electric Co Ltd | Semiconductor device and manufacturing method thereof |
US9484451B2 (en) | 2007-10-05 | 2016-11-01 | Vishay-Siliconix | MOSFET active area and edge termination area charge balance |
US9431249B2 (en) | 2011-12-01 | 2016-08-30 | Vishay-Siliconix | Edge termination for super junction MOSFET devices |
US9614043B2 (en) | 2012-02-09 | 2017-04-04 | Vishay-Siliconix | MOSFET termination trench |
US9842911B2 (en) | 2012-05-30 | 2017-12-12 | Vishay-Siliconix | Adaptive charge balanced edge termination |
US9530844B2 (en) | 2012-12-28 | 2016-12-27 | Cree, Inc. | Transistor structures having reduced electrical field at the gate oxide and methods for making same |
US10115815B2 (en) | 2012-12-28 | 2018-10-30 | Cree, Inc. | Transistor structures having a deep recessed P+ junction and methods for making same |
JP5907097B2 (en) * | 2013-03-18 | 2016-04-20 | 三菱電機株式会社 | Semiconductor device |
US9508596B2 (en) | 2014-06-20 | 2016-11-29 | Vishay-Siliconix | Processes used in fabricating a metal-insulator-semiconductor field effect transistor |
US9887259B2 (en) | 2014-06-23 | 2018-02-06 | Vishay-Siliconix | Modulated super junction power MOSFET devices |
KR102098996B1 (en) | 2014-08-19 | 2020-04-08 | 비쉐이-실리코닉스 | Super-junction metal oxide semiconductor field effect transistor |
US10615274B2 (en) | 2017-12-21 | 2020-04-07 | Cree, Inc. | Vertical semiconductor device with improved ruggedness |
US11489069B2 (en) | 2017-12-21 | 2022-11-01 | Wolfspeed, Inc. | Vertical semiconductor device with improved ruggedness |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4015278A (en) * | 1974-11-26 | 1977-03-29 | Fujitsu Ltd. | Field effect semiconductor device |
JPS52106688A (en) * | 1976-03-05 | 1977-09-07 | Nec Corp | Field-effect transistor |
JPS52132684A (en) * | 1976-04-29 | 1977-11-07 | Sony Corp | Insulating gate type field effect transistor |
US4055884A (en) * | 1976-12-13 | 1977-11-01 | International Business Machines Corporation | Fabrication of power field effect transistors and the resulting structures |
JPS5374385A (en) * | 1976-12-15 | 1978-07-01 | Hitachi Ltd | Manufacture of field effect semiconductor device |
US4148047A (en) * | 1978-01-16 | 1979-04-03 | Honeywell Inc. | Semiconductor apparatus |
JPH05185381A (en) * | 1992-01-10 | 1993-07-27 | Yuum Kogyo:Kk | Handle for edge-replaceable saw |
-
1979
- 1979-08-22 DK DK350679A patent/DK157272C/en not_active IP Right Cessation
- 1979-08-28 IL IL58128A patent/IL58128A/en unknown
- 1979-09-25 AR AR278193A patent/AR219006A1/en active
- 1979-09-28 CS CS796589A patent/CS222676B2/en unknown
- 1979-09-28 MX MX179453A patent/MX147137A/en unknown
- 1979-10-02 BR BR7906338A patent/BR7906338A/en not_active IP Right Cessation
- 1979-10-02 ES ES484652A patent/ES484652A1/en not_active Expired
- 1979-10-08 DE DE19792954481 patent/DE2954481C2/en not_active Expired - Lifetime
- 1979-10-08 DE DE2940699A patent/DE2940699C2/en not_active Expired
- 1979-10-09 CA CA337,182A patent/CA1123119A/en not_active Expired
- 1979-10-09 NL NLAANVRAGE7907472,A patent/NL175358C/en not_active IP Right Cessation
- 1979-10-09 GB GB7935059A patent/GB2033658B/en not_active Expired
- 1979-10-09 FR FR7925070A patent/FR2438917A1/en active Granted
- 1979-10-11 PL PL1979218878A patent/PL123961B1/en unknown
- 1979-10-11 HU HU79IE891A patent/HU182506B/en not_active IP Right Cessation
- 1979-10-11 SU SU792835965A patent/SU1621817A3/en active
- 1979-10-11 IT IT26435/79A patent/IT1193238B/en active
- 1979-10-12 SE SE7908479A patent/SE443682B/en not_active IP Right Cessation
- 1979-10-12 CH CH7696/81A patent/CH660649A5/en not_active IP Right Cessation
- 1979-10-12 CH CH923279A patent/CH642485A5/en not_active IP Right Cessation
-
1981
- 1981-11-12 CA CA000389973A patent/CA1136291A/en not_active Expired
-
1985
- 1985-07-26 SE SE8503615A patent/SE465444B/en not_active IP Right Cessation
-
1987
- 1987-04-28 JP JP62106158A patent/JP2622378B2/en not_active Expired - Lifetime
-
1988
- 1988-09-15 DK DK512488A patent/DK512488A/en not_active Application Discontinuation
- 1988-09-15 DK DK512388A patent/DK512388A/en not_active Application Discontinuation
-
1994
- 1994-10-12 JP JP6246144A patent/JP2643095B2/en not_active Expired - Lifetime
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19971029 |