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IT1105425B - CIRCUIT PANEL OF TRACKED WIRES AND METHOD FOR ITS MANUFACTURE - Google Patents

CIRCUIT PANEL OF TRACKED WIRES AND METHOD FOR ITS MANUFACTURE

Info

Publication number
IT1105425B
IT1105425B IT49944/78A IT4994478A IT1105425B IT 1105425 B IT1105425 B IT 1105425B IT 49944/78 A IT49944/78 A IT 49944/78A IT 4994478 A IT4994478 A IT 4994478A IT 1105425 B IT1105425 B IT 1105425B
Authority
IT
Italy
Prior art keywords
tracked
wires
manufacture
circuit panel
panel
Prior art date
Application number
IT49944/78A
Other languages
Italian (it)
Other versions
IT7849944A0 (en
Original Assignee
Kollmorgen Tech Corp
Burr James B
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp, Burr James B filed Critical Kollmorgen Tech Corp
Publication of IT7849944A0 publication Critical patent/IT7849944A0/en
Application granted granted Critical
Publication of IT1105425B publication Critical patent/IT1105425B/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06Wiring by machine
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/06Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936Marks, inscriptions, etc. for information
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10287Metal wires as connectors or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Enzymes And Modification Thereof (AREA)
  • Measuring Or Testing Involving Enzymes Or Micro-Organisms (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
IT49944/78A 1977-06-20 1978-06-20 CIRCUIT PANEL OF TRACKED WIRES AND METHOD FOR ITS MANUFACTURE IT1105425B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80836377A 1977-06-20 1977-06-20

Publications (2)

Publication Number Publication Date
IT7849944A0 IT7849944A0 (en) 1978-06-20
IT1105425B true IT1105425B (en) 1985-11-04

Family

ID=25198567

Family Applications (1)

Application Number Title Priority Date Filing Date
IT49944/78A IT1105425B (en) 1977-06-20 1978-06-20 CIRCUIT PANEL OF TRACKED WIRES AND METHOD FOR ITS MANUFACTURE

Country Status (13)

Country Link
JP (1) JPS548874A (en)
AT (1) AT374330B (en)
AU (1) AU523939B2 (en)
CA (1) CA1111569A (en)
CH (1) CH635715A5 (en)
DE (1) DE2827312C2 (en)
FR (1) FR2395673A1 (en)
GB (1) GB2004703B (en)
IL (1) IL54900A (en)
IT (1) IT1105425B (en)
NL (1) NL189107C (en)
SE (1) SE447191B (en)
ZA (1) ZA781637B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
US4450623A (en) * 1981-12-18 1984-05-29 Kollmorgen Technologies Corporation Process for the manufacture of circuit boards
FR2585210B1 (en) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp METHOD FOR MANUFACTURING WAFERS WITH INTERCONNECTION CIRCUITS
US5008619A (en) * 1988-11-18 1991-04-16 Amp-Akzo Corporation Multilevel circuit board precision positioning
DE19618917C1 (en) * 1996-05-12 1997-10-02 Markus Woelfel Resin-sealed wired circuit board manufacturing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
JPS5550399B1 (en) * 1970-03-05 1980-12-17

Also Published As

Publication number Publication date
DE2827312A1 (en) 1978-12-21
DE2827312C2 (en) 1982-05-27
JPS548874A (en) 1979-01-23
AT374330B (en) 1984-04-10
NL7806608A (en) 1978-12-22
GB2004703B (en) 1982-01-13
SE7806960L (en) 1978-12-21
ATA413478A (en) 1983-08-15
GB2004703A (en) 1979-04-04
FR2395673A1 (en) 1979-01-19
IT7849944A0 (en) 1978-06-20
ZA781637B (en) 1979-02-28
AU3615478A (en) 1979-11-22
CA1111569A (en) 1981-10-27
IL54900A (en) 1980-07-31
AU523939B2 (en) 1982-08-26
FR2395673B1 (en) 1980-10-24
CH635715A5 (en) 1983-04-15
NL189107B (en) 1992-08-03
NL189107C (en) 1993-01-04
IL54900A0 (en) 1978-08-31
SE447191B (en) 1986-10-27

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19940831