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GB2004703A - Wire scribed circuit board and method for the manufacture of same - Google Patents

Wire scribed circuit board and method for the manufacture of same

Info

Publication number
GB2004703A
GB2004703A GB7828643A GB7828643A GB2004703A GB 2004703 A GB2004703 A GB 2004703A GB 7828643 A GB7828643 A GB 7828643A GB 7828643 A GB7828643 A GB 7828643A GB 2004703 A GB2004703 A GB 2004703A
Authority
GB
United Kingdom
Prior art keywords
board
base
axes
movement
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7828643A
Other versions
GB2004703B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of GB2004703A publication Critical patent/GB2004703A/en
Application granted granted Critical
Publication of GB2004703B publication Critical patent/GB2004703B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Enzymes And Modification Thereof (AREA)
  • Measuring Or Testing Involving Enzymes Or Micro-Organisms (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

The present invention relates to a method for making a circuit board having conductors scribed thereon in a grid pattern, including the steps of attaching a planar board having a non- conductive adhesively activatable surface to a base mounted for movement along fixed axes spaced at equal intervals longitudinally and transversely of the board, aligning the board with the fixed longitudinal and transverse axes of movement of the base so that the axes of movement and the grid pattern to be scribed on the board coincide, scribing and adhesively affixing a conductor to the board, off-setting the board attached to the base a fixed distance in a first direction relative to at least one of said axes of movement of the base and, while moving the base along the off-set axis, scribing and adhesively affixing a conductor to the board. Alternatively, the pattern may comprise a plurality of conductors, all offset from said fixed axes. The conductors may be electrical, optical or fluidic.
GB7828643A 1977-06-20 1978-06-09 Wire scribed circuit board and method for the manufacture of same Expired GB2004703B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80836377A 1977-06-20 1977-06-20

Publications (2)

Publication Number Publication Date
GB2004703A true GB2004703A (en) 1979-04-04
GB2004703B GB2004703B (en) 1982-01-13

Family

ID=25198567

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7828643A Expired GB2004703B (en) 1977-06-20 1978-06-09 Wire scribed circuit board and method for the manufacture of same

Country Status (13)

Country Link
JP (1) JPS548874A (en)
AT (1) AT374330B (en)
AU (1) AU523939B2 (en)
CA (1) CA1111569A (en)
CH (1) CH635715A5 (en)
DE (1) DE2827312C2 (en)
FR (1) FR2395673A1 (en)
GB (1) GB2004703B (en)
IL (1) IL54900A (en)
IT (1) IT1105425B (en)
NL (1) NL189107C (en)
SE (1) SE447191B (en)
ZA (1) ZA781637B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT385624B (en) * 1981-04-14 1988-04-25 Kollmorgen Tech Corp METHOD FOR PRODUCING A COMPONENT PROVIDED WITH A CONNECTING NETWORK

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4450623A (en) * 1981-12-18 1984-05-29 Kollmorgen Technologies Corporation Process for the manufacture of circuit boards
FR2585210B1 (en) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp METHOD FOR MANUFACTURING WAFERS WITH INTERCONNECTION CIRCUITS
US5008619A (en) * 1988-11-18 1991-04-16 Amp-Akzo Corporation Multilevel circuit board precision positioning
DE19618917C1 (en) * 1996-05-12 1997-10-02 Markus Woelfel Resin-sealed wired circuit board manufacturing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
JPS5550399B1 (en) * 1970-03-05 1980-12-17

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT385624B (en) * 1981-04-14 1988-04-25 Kollmorgen Tech Corp METHOD FOR PRODUCING A COMPONENT PROVIDED WITH A CONNECTING NETWORK

Also Published As

Publication number Publication date
DE2827312A1 (en) 1978-12-21
DE2827312C2 (en) 1982-05-27
JPS548874A (en) 1979-01-23
AT374330B (en) 1984-04-10
NL7806608A (en) 1978-12-22
GB2004703B (en) 1982-01-13
SE7806960L (en) 1978-12-21
ATA413478A (en) 1983-08-15
FR2395673A1 (en) 1979-01-19
IT1105425B (en) 1985-11-04
IT7849944A0 (en) 1978-06-20
ZA781637B (en) 1979-02-28
AU3615478A (en) 1979-11-22
CA1111569A (en) 1981-10-27
IL54900A (en) 1980-07-31
AU523939B2 (en) 1982-08-26
FR2395673B1 (en) 1980-10-24
CH635715A5 (en) 1983-04-15
NL189107B (en) 1992-08-03
NL189107C (en) 1993-01-04
IL54900A0 (en) 1978-08-31
SE447191B (en) 1986-10-27

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19960609