IN2014DN10401A - - Google Patents
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- Publication number
- IN2014DN10401A IN2014DN10401A IN10401DEN2014A IN2014DN10401A IN 2014DN10401 A IN2014DN10401 A IN 2014DN10401A IN 10401DEN2014 A IN10401DEN2014 A IN 10401DEN2014A IN 2014DN10401 A IN2014DN10401 A IN 2014DN10401A
- Authority
- IN
- India
- Prior art keywords
- electrical component
- component part
- metal
- metal alloy
- pasty
- Prior art date
Links
- 239000002184 metal Substances 0.000 abstract 2
- 229910001092 metal group alloy Inorganic materials 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 235000011837 pasties Nutrition 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention relates to a chip card comprising a first electrical component part (102; 104) and a second electrical component part (106) wherein the first electrical component part and the second electrical component part are contacted with one another via an electrically conductive material (112) wherein the material (112) consists of a metal or a metal alloy wherein the metal or the metal alloy is pasty or liquid at room temperature.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012211546.3A DE102012211546B4 (en) | 2012-07-03 | 2012-07-03 | Chip card with paste-like or liquid contacting at room temperature |
PCT/EP2013/063899 WO2014006024A1 (en) | 2012-07-03 | 2013-07-02 | Chip card with contacting that is pasty or liquid at room temperature |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014DN10401A true IN2014DN10401A (en) | 2015-08-14 |
Family
ID=48985721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN10401DEN2014 IN2014DN10401A (en) | 2012-07-03 | 2013-07-02 |
Country Status (9)
Country | Link |
---|---|
US (1) | US20150161501A1 (en) |
JP (1) | JP2015521777A (en) |
KR (1) | KR20150034695A (en) |
CN (1) | CN104412281A (en) |
BR (1) | BR112014032514A2 (en) |
CA (1) | CA2875765A1 (en) |
DE (1) | DE102012211546B4 (en) |
IN (1) | IN2014DN10401A (en) |
WO (1) | WO2014006024A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3026530B1 (en) * | 2014-09-30 | 2017-12-22 | Oberthur Technologies | ELECTRONIC DOCUMENT WITH INCLINED ANTENNA EXTREMITES, ANTENNA CARRIER FOR SUCH AN ELECTRONIC DOCUMENT AND METHOD FOR MANUFACTURING SUCH A DOCUMENT |
EP3032468A1 (en) * | 2014-12-11 | 2016-06-15 | Gemalto Sa | Method for manufacturing a device including a wire interconnection pad |
MY186313A (en) * | 2015-06-23 | 2021-07-08 | Linxens Holding | Smart card blank with at least one interface for contactless transmission of information |
FR3038425B1 (en) * | 2015-06-30 | 2017-08-25 | Oberthur Technologies | ELECTRONIC DOCUMENT SUCH AS A REDUCED METALLIZATION CHIP CARD |
EP3159832B1 (en) | 2015-10-23 | 2020-08-05 | Nxp B.V. | Authentication token |
JP6442003B1 (en) * | 2017-07-05 | 2018-12-19 | 日本エンジニアリング株式会社 | IC card and IC card manufacturing method |
CN111279361B (en) | 2017-09-29 | 2023-08-04 | 艾利丹尼森零售信息服务公司 | System and method for transferring flexible conductors to a moving web |
CN111295672B (en) * | 2017-09-29 | 2023-08-29 | 艾利丹尼森零售信息服务公司 | Strip mounting technology for wired format antenna |
FR3073307B1 (en) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | SECURITY DEVICE SUCH AS A CHIP CARD |
FR3079645B1 (en) * | 2018-04-03 | 2021-09-24 | Idemia France | ELECTRONIC DOCUMENT IN WHICH AN ELECTRICAL LINK BETWEEN A CHIP PORT AND AN EXTERNAL ELECTRICAL CONTACT RANGE IS ESTABLISHED VIA AN INLAY |
KR102176235B1 (en) * | 2019-03-28 | 2020-11-09 | 코나엠 주식회사 | A metal card and a method for producing the metal card for bidirectional communications |
DE102019123093A1 (en) * | 2019-08-28 | 2021-03-04 | Infineon Technologies Ag | Process for processing a layer structure and chip card inlay |
EP4334841A1 (en) * | 2021-05-04 | 2024-03-13 | Giesecke+Devrient ePayments GmbH | Data-bearing card and semi-finished product and wiring layout for same, and method for producing same |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2624284B1 (en) * | 1987-12-03 | 1991-08-16 | Sgs Thomson Microelectronics | CARD COMPRISING AN ELECTRONIC COMPONENT |
DE19500925C2 (en) * | 1995-01-16 | 1999-04-08 | Orga Kartensysteme Gmbh | Method for producing a contactless chip card |
FR2761497B1 (en) * | 1997-03-27 | 1999-06-18 | Gemplus Card Int | METHOD FOR MANUFACTURING A CHIP CARD OR THE LIKE |
FR2769390B1 (en) * | 1997-10-08 | 2003-02-14 | Gemplus Card Int | METHOD FOR MANUFACTURING CHIP CARDS SUITABLE FOR PROVIDING CONTACT AND NON-CONTACT OPERATION, AND CONTACTLESS CHIP CARDS |
US20020086566A1 (en) * | 2000-12-06 | 2002-07-04 | Simons Everett F. | Robust, low-resistance elastomeric conductive polymer interconnect |
JP2007265114A (en) * | 2006-03-29 | 2007-10-11 | Oki Electric Ind Co Ltd | Access control method of non-contact communication electronic device, and non-contact communication electronic device |
US8390184B2 (en) * | 2008-02-14 | 2013-03-05 | Koninklijke Philips Electronics N.V. | Lighting system, light source and electrode device |
US8329493B2 (en) * | 2009-03-20 | 2012-12-11 | University Of Utah Research Foundation | Stretchable circuit configuration |
JP5697856B2 (en) * | 2009-06-24 | 2015-04-08 | コニカミノルタ株式会社 | ORGANIC ELECTROLUMINESCENT ELEMENT, WHITE ORGANIC ELECTROLUMINESCENT ELEMENT, DISPLAY DEVICE AND LIGHTING DEVICE |
DE102009058435A1 (en) | 2009-12-16 | 2011-06-22 | Giesecke & Devrient GmbH, 81677 | Attaching and electrically connecting a chip module to a chip card |
EP2463809A1 (en) * | 2010-12-07 | 2012-06-13 | NagraID S.A. | Electronic card with electric contact including an electronic unit and/or an antenna |
EP2814610B1 (en) * | 2012-02-17 | 2020-08-19 | Stratec Consumables GmbH | Microstructured polymer devices |
US9523713B2 (en) * | 2013-05-28 | 2016-12-20 | Intel Corporation | Interconnects including liquid metal |
-
2012
- 2012-07-03 DE DE102012211546.3A patent/DE102012211546B4/en not_active Expired - Fee Related
-
2013
- 2013-07-02 US US14/412,155 patent/US20150161501A1/en not_active Abandoned
- 2013-07-02 JP JP2015519188A patent/JP2015521777A/en active Pending
- 2013-07-02 CA CA2875765A patent/CA2875765A1/en not_active Abandoned
- 2013-07-02 CN CN201380034992.3A patent/CN104412281A/en active Pending
- 2013-07-02 KR KR20147036440A patent/KR20150034695A/en not_active Ceased
- 2013-07-02 WO PCT/EP2013/063899 patent/WO2014006024A1/en active Application Filing
- 2013-07-02 IN IN10401DEN2014 patent/IN2014DN10401A/en unknown
- 2013-07-02 BR BR112014032514A patent/BR112014032514A2/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
BR112014032514A2 (en) | 2017-06-27 |
WO2014006024A1 (en) | 2014-01-09 |
JP2015521777A (en) | 2015-07-30 |
US20150161501A1 (en) | 2015-06-11 |
DE102012211546A1 (en) | 2014-01-09 |
DE102012211546B4 (en) | 2017-02-16 |
CN104412281A (en) | 2015-03-11 |
CA2875765A1 (en) | 2014-01-09 |
KR20150034695A (en) | 2015-04-03 |
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