DE19500925C2 - Method for producing a contactless chip card - Google Patents

Description

For some time now there have been parallel to those on a broad level introduced contact-based chip cards according to ISO 7816 on the Market smart cards where the data exchange with corresponding data exchange devices not via galvanic Contacts, but done inductively or capacitively.

The previously known contactless chip cards have one common carrier for the chips and the passive Transmission elements (coils for an inductive data and Energy transfer and / or electrically conductive layers for capacitive data and energy transmission). This Carrier with chip and transmission elements is between at least two layers (e.g. PVC layers) of Card body embedded and thus anchored in the map.

Problematic in making this type of contactless Chip types are the following points.

The flexible underlying the common carrier Circuit board is because it has the areas for application and Connect the semiconductor components (chips) and at the same time the carries large-area transmission elements in the manufacture expensive because the whole area is made in one quality which enables the semiconductor chips to be bonded. Besides, that is Application, connection and encapsulation of the chips due to the large area of the circuit board for the carrier in the Automatic bonding machines very cumbersome and subordinate Cost aspects represent an unjustifiable expense.  

Because the carrier in the area of the semiconductor chip is much thicker is as in the areas of passive transmission elements, must be the layers in which the carrier is used to make a standard-compliant card in a corresponding negative form be carried out, which is also expensive to manufacture.

Due to manufacturing tolerances, it happens despite careful shaping of the negative forms during the connection of the parts embedding the support for deforming the Surfaces and thus to deform a possibly the surface of the printed image. With such a deformed printed image, however, the card is a reject evaluate. For security and reliability reasons when connecting for the production of chip card materials and Procedures used to separate the card into the individual layers without massive damage very difficult or not to leave at all. This is also the carrier with the very expensive semiconductor chip only very difficult or not at all a card that has been evaluated as a committee for further use to remove.

When printing on the card body after inserting the Carrier and connecting the layers involved can be a deformation of the printed image by the introduction and Connection process can be excluded. However, kick however, errors also occur relatively frequently when printing, so that in this case too expensive reject cards with no more removing semiconductor chip are produced.

The problems when inserting the carrier into the card and when Printing intensify even more when the contactless card additionally have contact surfaces (e.g. according to ISO 7816/2) to either a contactless or a contact To enable data and energy transmission. In one Execution are the contact surfaces with the  contactless transmission elements and the semiconductor chip load-bearing circuit board or are at least solid and electrical conductively connected to this. Introducing such a thing designed carrier for contactless and contact-based Data transfer into a card body is even more Manufacturing risks associated as bringing in only one contactless wearer.

DE 43 11 493 A1 describes a chip card for contactless Data transmission described. When making this Chip card becomes an electrically fully functional one Transponder unit consisting of chip and coil in the Card body installed. For one, here is one Transponder unit described in a recess of the Card body can be used. This could happen after Printed on the card body, so that the above described problems could be solved. However the size of the transponder unit is only slightly larger than that Chip itself, so that only relatively small coil diameter are possible, increasing the range of the contactless chip card is severely restricted. Most contactless However, smart cards are a large-area coil, i.e. H. a coil whose cross-sectional area is only slightly smaller than the area of the card body is necessary. Such a big spool but could no longer be in a small transponder unit, which are introduced into a recess in the card body can integrate.

For this reason, in DE 43 11 493 A1 Use of coils with a large cross-sectional area proposed the transponder unit consisting of coil and chip between the layers of the card body in the Embed lamination process. About what occurs To minimize the problem of warpage of the map surfaces, it is proposed that the layers between which the Transponder unit is to be embedded, have profile surveys.  

However, the use of such profiled layers is complex and expensive. But even if this is used be, and a chip card so produced, however, in one visual quality control after the lamination process must be sorted out, is the more expensive chip than lost component in a reject card.

From the G 92 16 195.2 is a mobile, contactless Data storage known. The antenna is on a first circuit board and the chip on a second Printed circuit board, the printed circuit board with the chip in a Recess of the circuit board with the antenna is used. The arrangement of the first circuit board and the second circuit board is then coated with a layer, creating the card body is formed, which is then printable. Is also located here in the case of a card assessed as a committee for printing the expensive chip as a lost component in the reject card.

The object of the invention is to provide a contactless chip card which built a large area antenna into the card body will produce so that before installing the expensive chips in the card body the same with its in the card body Manufacturing process trained surface and possibly with a pressure applied to this surface Committee criteria is assessable.

This object is achieved by the characterizing Features of claim 1 solved. The ones at it subsequent sub-claims contain advantageous and beneficial embodiments of the invention.

According to the invention, a separate one is placed in the card body Transmission module, which has an antenna in the form at least a coil and / or in the form of electrically conductive layers has, built in, the card body already printed  can be. The transmission module has pads electrical coupling to the chip module. This Intermediate product (card body with embedded Transfer module without an expensive chip module) can now be printed if necessary and will then be optical assessed according to committee criteria.

The chip module with the expensive semiconductor module is only in Complaint-free printed card body with flawless Surfaces used.

In this way, the reject costs are significantly reduced, whereby the manufacture of contactless smart cards under Cost aspects are made attractive.

Exemplary embodiments are shown in the drawings, which are explained in more detail below.

It shows:

Fig. 1 + FIG. 2 is a section through a card body with a schematically indicated chip module,

Fig. 3 is a plan view of a transmission module with a coil and electrically conductive capacitive layers,

Fig. 4 shows a section through a chip module,

Fig. 5 is a sectional view of a chip module having electrically conductive support legs,

Fig. 6 is a bottom view of the chip module of FIG. 5,

Fig. 7 is a section through chip module (see. Fig. 4) and the card body prior to assembly,

Fig. 8 as shown in Fig. 7, but in the assembled state,

Fig. 9 is a section through chip module (see. Fig. 5) and the card body prior to assembly,

Fig. 10 as in FIG. 9, but in the assembled state,

Fig. 11 is a view of a chip module with a lead frame and flip-chip Bonded semiconductor device,

Fig. 12 is a section through a chip module with ceramic block,

Fig. 13 is a view of a two-side antenna,

Fig. 14 + Fig. 15, the connection between the terminal areas of the chip module and the transmission element by means of conductive particles embedded in a thermoplastic material (before the contacting and after the contacting),

Fig. 16, the connection between the terminal areas of the chip module and the transmission element by soldering or by conductive gluing,

Fig. 17 as in FIG. 16, but with additionally applied on the pads solder bumps,

Fig. 18 is a resilient contact between the connection points,

Fig. 19 shows the connection between the pads of the chip module and transmission element by means of a conductive coated, flexible ball.

The chip card (Fig. 1 and Fig. 2) for contactless data transmission, has a separately built in the card body (2) transmission module (3) having an antenna (4, 5) in the form of at least one coil (4) for inductive data - And energy transmission and / or in the form of electrically conductive layers ( 5 ) for capacitive data and energy transmission. The transmission module ( 3 ) has connection surfaces ( 6 ) for electrical coupling to the chip module ( 7 ).

Separated from the transfer module (3) a chip module (7) with at least one IC module (8) and connecting surfaces (21) is mounted for electrical connection to the transfer module (3) in the card body (2).

The transmission module ( 3 ) can have a closed carrier layer ( 9 ) on which the antenna ( 4 , 5 ) with the corresponding connection surfaces ( 6 ) is arranged, the chip module ( 7 ) with its connection surfaces ( 21 ) on the carrier layer ( 9 ) of the transmission module ( 3 ) is arranged (cf. FIG. 1).

In the support layer (9) a recess (10) may be provided for at least partially receiving the chip module (7) (see. Fig. 2 and Fig. 7). In the area of the cutout ( 10 ) of the carrier layer ( 9 ) there is also a cavity ( 11 ) for partially receiving the chip module ( 7 ).

The carrier layer ( 9 ) of the transmission module ( 3 ) can have a one-sided or two-sided circuit.

FIG. 13 shows a carrier element on which an electrically conductive connection to a piece of conductor track on the side of the carrier element facing away from the coil is made via through contacts ( 14 ). This enables the coil end to be connected to the corresponding connection surface ( 6 ) without bridging or bridging.

The area of the carrier layer ( 9 ) advantageously corresponds to the base area of the card body ( 2 ) in order to avoid deformations of the card body ( 2 ) and warpage of the card surface.

In an alternative embodiment (not shown), the transmission module ( 3 ) with antenna ( 4 , 5 ) and connection surfaces ( 6 ) is designed as a stamped or etched part without a carrier layer. Such a transmission module ( 3 ) can be easily molded into an injection-molded card body.

The connection surfaces ( 21 ) of the chip module ( 7 ) and the connection surfaces ( 6 ) of the transmission module ( 3 ) can be connected to one another in a soldering process with resistance heating, infrared or laser heating.

Alternatives to this are:

• - The connection via a conductive adhesive ( 15 ) - cf. Fig. 16,
• - The connection via conductive bumps ( 32 ) applied to the connection surfaces ( 6 , 21 ) by means of soldering or gluing - cf. Fig. 17,
• - ultrasonic welding,
• - Conductive particles ( 17 ) embedded in a thermoplastic material ( 16 ) - cf. Fig. 14 + 15,
• - a resiliently supported, mechanical contact - e.g. B. by means of a contact spring - cf. Fig. 18,
• - An elastically deformable body ( 18 ), the surface of which has a conductive coating ( 19 ) - cf. Fig. 19.

Additional contact areas ( 20 ) are optionally provided on the chip module ( 7 ) for contact-based data transmission.

In one embodiment, the chip module ( 7 ) has a non-conductive substrate film ( 22 ) on which the chip ( 8 ) and the metallic connection surfaces ( 21 ) are arranged, the chip ( 8 ) being connected to the connection surfaces ( 23 ) via bonding wires ( 23 ). 21 ) and the chip ( 8 ) and the bonding wires ( 23 ) are surrounded by a protective casting compound ( 24 ).

The chip ( 8 ) and the metallic connection surfaces ( 21 ) are arranged on one side of the substrate film ( 22 ) and the contact surfaces ( 20 ) for contact-based data exchange of the chip card ( 1 ) are arranged on the other side. Access openings ( 25 ) to the contact surfaces ( 20 ) are cut out in the substrate film ( 22 ) (cf. FIG. 5).

In an embodiment not shown, the chip ( 8 ) is arranged in a recess in the substrate film ( 22 ) on the contact surfaces ( 20 ).

In an advantageous embodiment, the connection surfaces ( 21 ) of the chip module ( 7 ) have electrically conductive support feet ( 27 ) which are supported on the connection surfaces ( 6 ) of the transmission module ( 3 ) (cf. FIGS. 5, 9, 10).

In a further embodiment (cf. FIG. 12), the chip module ( 7 ) is made of a ceramic and / or plastic block ( 29 ) with a U-shaped cross section with a three-dimensional metallization having the connection surfaces ( 21 ) and the contact surfaces ( 20 ) educated.

In an alternative embodiment (cf. FIG. 11), the chip module ( 7 ) has a stamped or etched part ( 28 ) (a so-called leadframe) forming the contact and connection surfaces ( 20 , 21 ), on which the chip ( 8 ) is arranged.

On such a leadframe, the chip ( 8 ) is advantageously electrically conductively fixed with its connection points by means of flip-chip contacting on the corresponding contact surfaces ( 20 ) and the connection surfaces ( 21 ).

The card body ( 2 ) can be formed by a plurality of layers ( 2 A) connected to one another by lamination.

The connection between the connecting surfaces (21) of the chip module (7) and the pads (6) of the transmission module (3) causes, in addition to making electrical contact with a mechanically stabilizing connection of the two modules (3, 7).

In an embodiment not shown, the transmission module ( 3 ) has a plurality of differently dimensioned coils ( 4 ) with corresponding connection surfaces ( 6 ), which allow the selection of the different coils ( 4 ) by corresponding connection of the connection surfaces ( 6 ) associated with the coils ( 4 ) enables.

Claims (27)

1. Method for producing a contactless chip card, which consists of

• 1. in a card body ( 2 ) built-in transmission module ( 3 ), which has a large-area antenna in the form of a coil ( 4 ) for inductive data and energy transmission and / or in the form of electrically conductive layers ( 5 ) for capacitive data and energy transmission and Has pads ( 6 ) for electrical coupling to the chip module ( 7 ), wherein
  • 1, the transfer module (3) between the card body (2) forming the laminated layers (2 A) is embedded,
  • 2. or the transfer module (3) is embedded in a package with the same integrally molded card body (2),
• 2. a chip module ( 7 ) built into the card body ( 2 ) with at least one IC component, the chip module ( 7 ) having connection areas ( 21 ) via which the chip module ( 7 ) with the connection areas ( 6 ) of the transmission module ( 3 ) is electrically connected,

characterized in that

• 1. an intermediate product is prepared consisting of the embedded in the card body (2) transmission module (3), wherein in the intermediate product an open towards Kartenvorderseite- or card rear cavity (10, 11) is provided for receiving the chip module (7) in such a way that the connection surfaces of the transmission module ( 3 ) are at least partially in the region of the cavity ( 10 , 11 ),
• 2. and only then, in a further, separate process step, the chip module ( 7 ) is installed in the cavity ( 11 , 10 ) of the intermediate product to form a functional, contactless chip card, in this process step the connection surfaces ( 21 ) of the chip module ( 7 ) with the pads ( 6 ) of the transmission module ( 3 ) are electrically connected.

2. The method according to claim 1, characterized in that a transmission module ( 3 ) is used which has a closed carrier layer ( 9 ) on which the antenna ( 4 , 5 ) with the corresponding connection surfaces ( 6 ) is arranged, the chip module ( 7 ) with its pads ( 21 ) on the pads ( 6 ) of the transmission module ( 3 ) is arranged. 3. The method according to claim 1, characterized in that a transmission module ( 3 ) is used which has a carrier layer ( 9 ) on which the antenna ( 4 , 5 ) with the corresponding connection surfaces ( 6 ) is arranged, and in the carrier layer ( 9 ) there is a recess ( 10 ) for at least partially receiving the chip module ( 7 ), the chip module ( 7 ) with its connection surfaces ( 21 ) being arranged on the connection surfaces ( 6 ) of the transmission module ( 3 ). 4. The method according to claim 3, characterized in that in the card body ( 2 ) in addition to the recess ( 10 ) in the carrier layer ( 9 ), a cavity ( 11 ) for partially receiving the chip module ( 7 ) is provided. 5. The method according to any one of the preceding claims 2 to 4, characterized in that the carrier layer ( 9 ) of the transmission module ( 3 ) has a one-sided circuit. 6. The method according to any one of the preceding claims 2 to 4, characterized in that the carrier layer ( 9 ) has a two-sided circuit. 7. The method according to claim 6, characterized in that the carrier layer ( 9 ) has at least one plated-through hole ( 14 ) for connecting a coil end to the corresponding connection surface ( 6 ). 8. The method according to any one of the preceding claims 2 to 7, characterized in that the surface of the carrier layer ( 9 ) used corresponds to the base of the card body ( 2 ). 9. The method according to claim 1, characterized in that a transmission module ( 3 ) is used, which is designed to form the antenna ( 4 , 5 ) and the connection surfaces ( 6 ) as a stamped or etched part without a carrier layer. 10. The method according to any one of the preceding claims, characterized in that the connection surfaces ( 21 ) of the chip module ( 7 ) and the connection surfaces ( 6 ) of the transmission module ( 3 ) in a soldering process, for. B. by means of resistance heating, infrared or laser heating. 11. The method according to any one of claims 1 to 9, characterized in that the connection surfaces ( 21 ) of the chip module ( 7 ) and the connection surfaces ( 6 ) of the transmission module ( 3 ) are connected to one another via a conductive adhesive ( 15 ). 12. The method according to any one of claims 1 to 9, characterized in that the connection surfaces ( 21 ) of the chip module ( 7 ) and the connection surfaces ( 6 ) of the transmission module ( 3 ) are connected to one another by ultrasonic welding. 13. The method according to any one of claims 1 to 9, characterized in that the connection surfaces ( 21 ) of the chip module ( 7 ) and the connection surfaces ( 6 ) of the transmission module ( 3 ) by conductive particles ( 17 ) embedded in a thermoplastic material ( 16 ) ) are connected to one another, when the chip module ( 7 ) is inserted into the card body ( 2 ) equipped with a transmission module ( 3 ), the conductive particles ( 17 ) as a result of softening and compression of the thermoplastic material ( 16 ) making contact with the corresponding connection surfaces ( 6 , 21 ) effect. 14. The method according to any one of claims 1 to 9, characterized in that the connection surfaces ( 21 ) of the chip module ( 7 ) and the connection surfaces ( 6 ) of the transmission module ( 3 ) are electrically conductively connected to one another only by a resiliently supported mechanical contact. 15. The method according to any one of claims 1 to 9, characterized in that the connection surfaces ( 21 ) of the chip module ( 7 ) and the connection surfaces ( 6 ) of the transmission module ( 3 ) via an elastically deformable body ( 18 ), the surface of which is a conductive coating ( 19 ) has to be connected to one another. 16. The method according to any one of the preceding claims, characterized in that a chip module ( 7 ) is used on the contact surfaces ( 20 ) are provided for contact-based data transmission. 17. The method according to any one of the preceding claims, characterized in that a chip module ( 7 ) is used which has a non-conductive substrate film ( 22 ) on which the chip ( 8 ) and the metallic connection surfaces ( 21 ) are arranged, the Chip ( 8 ) via bond wires ( 23 ) is connected to the connection areas ( 21 ), and the chip ( 8 ) and the bond wires ( 23 ) are encapsulated. 18. The method according to any one of claims 1 to 16, characterized in that a chip module ( 7 ) is used which has a non-conductive substrate film ( 22 ), wherein on one side of the substrate film ( 22 ) the chip ( 7 ) and the metallic Terminal areas ( 21 ) are arranged and on the other side the contact areas ( 20 ) for contact-based data exchange of the chip card ( 1 ) are arranged, and in the substrate film ( 22 ) access openings ( 25 ) to the contact areas ( 20 ) are left out, and the chip ( 8 ) is connected to the contact areas ( 20 ) and the connection areas ( 21 ) via bond wires ( 23 ), and the chip ( 8 ) and the bond wires ( 23 ) are encapsulated. 19. The method according to any one of the preceding claims 1 to 16, characterized in that a chip module ( 7 ) is used, which has a substrate film ( 22 ) with a double-sided circuit, and the chip ( 8 ) by means of flip-chip contacting on the Circuit is fixed electrically conductive. 20. The method according to any one of the preceding claims, characterized in that a chip module ( 7 ) is used, the connection surfaces ( 21 ) have electrically conductive support feet ( 27 ), which are supported on the connection surfaces ( 6 ) of the transmission module ( 3 ), and the chip ( 8 ) and the bonding wires ( 23 ) are encapsulated to form the connection areas ( 21 ). 21. The method according to claim 20, characterized in that a chip module ( 7 ) is used, the support feet ( 27 ) protrude beyond the encapsulation ( 24 ). 22. The method according to any one of the preceding claims 1 to 16, characterized in that a chip module ( 7 ) is used which of a ceramic and / or plastic block ( 29 ) with a U-shaped cross section with a three-dimensional, the connection surfaces ( 21 ) and the metallization having contact areas ( 20 ) is formed, the chip ( 8 ) being arranged in the interior of the block ( 29 ) and being connected to the corresponding connection areas ( 21 ) and contact areas ( 20 ) via bond wires ( 23 ), and the chip ( 8 ) and the bond wires ( 23 ) are encapsulated. 23. The method according to any one of claims 1 to 16, characterized in that a chip module ( 7 ) is used which has a stamped or etched part ( 28 ) (a so-called leadframe) forming the contact and connection surfaces ( 20 , 21 ), on which the chip ( 8 ) is arranged. 24. The method according to claim 23, characterized in that a chip module ( 7 ) is used in which the chip ( 8 ) with its connection points by means of flip-chip contacting directly on the corresponding contact surfaces ( 20 ) and the connection surfaces ( 21 ) is fixed. 25. The method according to claim 9, characterized in that the stamped or etched antenna ( 4 , 5 ) with the connection surfaces ( 6 ) is molded into an injection-molded card body, the connection surfaces ( 6 ) on the bottom of a cavity in the card body for receiving the Chip module ( 7 ) are. 26. The method according to claim 9, characterized in that the stamped or etched antenna ( 4 , 5 ) with the connection surfaces ( 6 ) is molded into an injection-molded card body, the connection surfaces ( 6 ) on the shoulders of a two-stage cavity for receiving the chip module ( 7 ), and the chip module ( 7 ) is at least partially embedded between the shoulders carrying the connection surfaces ( 6 ). 27. Chip card according to one of the preceding claims, characterized in that a transmission module ( 3 ) is used that several, differently dimensioned coils ( 4 ) with corresponding connection surfaces ( 6 ), which can be used optionally.