IL139418A0 - Method for electro copperplating substrates - Google Patents
Method for electro copperplating substratesInfo
- Publication number
- IL139418A0 IL139418A0 IL13941899A IL13941899A IL139418A0 IL 139418 A0 IL139418 A0 IL 139418A0 IL 13941899 A IL13941899 A IL 13941899A IL 13941899 A IL13941899 A IL 13941899A IL 139418 A0 IL139418 A0 IL 139418A0
- Authority
- IL
- Israel
- Prior art keywords
- copper
- substrates
- copperplating
- electro
- separate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Optical Integrated Circuits (AREA)
- ing And Chemical Polishing (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19822076 | 1998-05-16 | ||
| PCT/EP1999/003321 WO1999060188A2 (de) | 1998-05-16 | 1999-05-14 | Verfahren zur galvanischen verkupferung von substraten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IL139418A0 true IL139418A0 (en) | 2001-11-25 |
Family
ID=7868038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL13941899A IL139418A0 (en) | 1998-05-16 | 1999-05-14 | Method for electro copperplating substrates |
Country Status (22)
| Country | Link |
|---|---|
| US (1) | US6576111B1 (ro) |
| EP (1) | EP1080252B1 (ro) |
| JP (1) | JP2002515549A (ro) |
| KR (1) | KR100545664B1 (ro) |
| CN (1) | CN1170965C (ro) |
| AT (1) | ATE221930T1 (ro) |
| AU (1) | AU4261799A (ro) |
| CA (1) | CA2331750A1 (ro) |
| DE (1) | DE59902276D1 (ro) |
| DK (1) | DK1080252T3 (ro) |
| HU (1) | HUP0102016A3 (ro) |
| IL (1) | IL139418A0 (ro) |
| IS (1) | IS5703A (ro) |
| NO (1) | NO20005777D0 (ro) |
| PL (1) | PL344529A1 (ro) |
| RO (1) | RO119838B1 (ro) |
| RU (1) | RU2222643C2 (ro) |
| SK (1) | SK16912000A3 (ro) |
| TR (1) | TR200003368T2 (ro) |
| WO (1) | WO1999060188A2 (ro) |
| YU (1) | YU70900A (ro) |
| ZA (1) | ZA200006624B (ro) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3725083B2 (ja) * | 2002-02-21 | 2005-12-07 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | メッキ設備における金属イオン供給源の有効保存を可能とする方法 |
| US7776741B2 (en) | 2008-08-18 | 2010-08-17 | Novellus Systems, Inc. | Process for through silicon via filing |
| US9109295B2 (en) * | 2009-10-12 | 2015-08-18 | Novellus Systems, Inc. | Electrolyte concentration control system for high rate electroplating |
| US10472730B2 (en) | 2009-10-12 | 2019-11-12 | Novellus Systems, Inc. | Electrolyte concentration control system for high rate electroplating |
| JP6949409B2 (ja) * | 2015-06-26 | 2021-10-13 | 住友金属鉱山株式会社 | 導電性基板 |
| US10692735B2 (en) | 2017-07-28 | 2020-06-23 | Lam Research Corporation | Electro-oxidative metal removal in through mask interconnect fabrication |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0137397B1 (de) * | 1983-09-28 | 1990-08-29 | Blasberg-Oberflächentechnik GmbH | Saures galvanisches Kupferbad und Verfahren zu seiner Herstellung |
| JPS62112996A (ja) * | 1985-11-11 | 1987-05-23 | Mitsubishi Metal Corp | 伝熱体 |
| DE4001960A1 (de) * | 1990-01-24 | 1991-07-25 | Roland Schnetteler | Verfahren zum elektrochemischen beschichten von stahlbaendern mit zink-nickellegierungen |
| JPH04320088A (ja) * | 1991-04-18 | 1992-11-10 | Cmk Corp | プリント配線板の製造方法 |
-
1999
- 1999-05-14 AU AU42617/99A patent/AU4261799A/en not_active Abandoned
- 1999-05-14 TR TR2000/03368T patent/TR200003368T2/xx unknown
- 1999-05-14 HU HU0102016A patent/HUP0102016A3/hu unknown
- 1999-05-14 PL PL99344529A patent/PL344529A1/xx unknown
- 1999-05-14 AT AT99952102T patent/ATE221930T1/de not_active IP Right Cessation
- 1999-05-14 RO ROA200001121A patent/RO119838B1/ro unknown
- 1999-05-14 DK DK99952102T patent/DK1080252T3/da active
- 1999-05-14 IL IL13941899A patent/IL139418A0/xx unknown
- 1999-05-14 EP EP99952102A patent/EP1080252B1/de not_active Expired - Lifetime
- 1999-05-14 CN CNB998062502A patent/CN1170965C/zh not_active Expired - Fee Related
- 1999-05-14 DE DE59902276T patent/DE59902276D1/de not_active Expired - Lifetime
- 1999-05-14 CA CA002331750A patent/CA2331750A1/en not_active Abandoned
- 1999-05-14 WO PCT/EP1999/003321 patent/WO1999060188A2/de active IP Right Grant
- 1999-05-14 US US09/674,509 patent/US6576111B1/en not_active Expired - Fee Related
- 1999-05-14 YU YU70900A patent/YU70900A/sh unknown
- 1999-05-14 RU RU2000131604/02A patent/RU2222643C2/ru not_active IP Right Cessation
- 1999-05-14 SK SK1691-2000A patent/SK16912000A3/sk unknown
- 1999-05-14 JP JP2000549788A patent/JP2002515549A/ja active Pending
- 1999-05-14 KR KR1020007012742A patent/KR100545664B1/ko not_active IP Right Cessation
-
2000
- 2000-11-02 IS IS5703A patent/IS5703A/is unknown
- 2000-11-15 NO NO20005777A patent/NO20005777D0/no not_active Application Discontinuation
- 2000-11-15 ZA ZA200006624A patent/ZA200006624B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| ZA200006624B (en) | 2001-06-01 |
| EP1080252A1 (de) | 2001-03-07 |
| US6576111B1 (en) | 2003-06-10 |
| SK16912000A3 (sk) | 2001-08-06 |
| EP1080252B1 (de) | 2002-08-07 |
| ATE221930T1 (de) | 2002-08-15 |
| HUP0102016A3 (en) | 2002-03-28 |
| KR100545664B1 (ko) | 2006-01-24 |
| IS5703A (is) | 2000-11-02 |
| AU4261799A (en) | 1999-12-06 |
| NO20005777L (no) | 2000-11-15 |
| TR200003368T2 (tr) | 2001-04-20 |
| NO20005777D0 (no) | 2000-11-15 |
| YU70900A (sh) | 2003-02-28 |
| PL344529A1 (en) | 2001-11-05 |
| JP2002515549A (ja) | 2002-05-28 |
| DK1080252T3 (da) | 2003-01-06 |
| RO119838B1 (ro) | 2005-04-29 |
| CA2331750A1 (en) | 1999-11-25 |
| KR20010043597A (ko) | 2001-05-25 |
| DE59902276D1 (de) | 2002-09-12 |
| CN1301313A (zh) | 2001-06-27 |
| WO1999060188A3 (de) | 2000-01-13 |
| WO1999060188A2 (de) | 1999-11-25 |
| CN1170965C (zh) | 2004-10-13 |
| HUP0102016A2 (hu) | 2001-09-28 |
| RU2222643C2 (ru) | 2004-01-27 |
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