IL130382A - יחידת מודול תרמואלקטרית - Google Patents
יחידת מודול תרמואלקטריתInfo
- Publication number
- IL130382A IL130382A IL13038298A IL13038298A IL130382A IL 130382 A IL130382 A IL 130382A IL 13038298 A IL13038298 A IL 13038298A IL 13038298 A IL13038298 A IL 13038298A IL 130382 A IL130382 A IL 130382A
- Authority
- IL
- Israel
- Prior art keywords
- thermoelectric
- partitioning plate
- thermoelectric semiconductor
- thermoelectric module
- semiconductor elements
- Prior art date
Links
- 238000000638 solvent extraction Methods 0.000 claims abstract description 98
- 239000004065 semiconductor Substances 0.000 claims abstract description 91
- 239000002184 metal Substances 0.000 claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 claims abstract description 44
- 239000012530 fluid Substances 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000012777 electrically insulating material Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 34
- 229910052802 copper Inorganic materials 0.000 description 34
- 239000010949 copper Substances 0.000 description 34
- 238000001816 cooling Methods 0.000 description 26
- 239000002826 coolant Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000013256 coordination polymer Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 150000001622 bismuth compounds Chemical class 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000003651 drinking water Substances 0.000 description 1
- 235000020188 drinking water Nutrition 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002506 iron compounds Chemical class 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9288250A JPH11121816A (ja) | 1997-10-21 | 1997-10-21 | 熱電モジュールユニット |
| PCT/JP1998/004756 WO1999021234A1 (en) | 1997-10-21 | 1998-10-21 | Thermoelectric module unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL130382A0 IL130382A0 (en) | 2000-06-01 |
| IL130382A true IL130382A (he) | 2002-12-01 |
Family
ID=17727779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL13038298A IL130382A (he) | 1997-10-21 | 1998-10-21 | יחידת מודול תרמואלקטרית |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6233944B1 (he) |
| EP (1) | EP0963611A1 (he) |
| JP (1) | JPH11121816A (he) |
| KR (1) | KR20000069515A (he) |
| CA (1) | CA2275387A1 (he) |
| IL (1) | IL130382A (he) |
| TW (1) | TW425729B (he) |
| WO (1) | WO1999021234A1 (he) |
Families Citing this family (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU3022599A (en) * | 1998-03-30 | 1999-10-18 | Junling Gao | Thermoelectric cooling device using heat pipe for conducting and radiating |
| US6173576B1 (en) * | 1999-03-25 | 2001-01-16 | Intel Corporation | Cooling unit for an integrated circuit package |
| JP2001133105A (ja) * | 1999-11-02 | 2001-05-18 | Smc Corp | パイプクーラ及び該パイプクーラを用いた小型温調器 |
| JP3255629B2 (ja) | 1999-11-26 | 2002-02-12 | モリックス株式会社 | 熱電素子 |
| JP3510831B2 (ja) * | 1999-12-22 | 2004-03-29 | 株式会社小松製作所 | 熱交換器 |
| KR100356398B1 (ko) * | 2000-06-05 | 2002-10-19 | 주식회사 한 맥 | 열전소자와 히트파이프를 이용한 냉각시스템 |
| WO2002029908A1 (en) | 2000-10-04 | 2002-04-11 | Leonardo Technologies, Inc. | Thermoelectric generators |
| KR100403155B1 (ko) * | 2001-05-25 | 2003-10-30 | 이재혁 | 히트파이프와 열전소자를 이용한 냉난방장치 |
| KR20030052895A (ko) * | 2001-12-21 | 2003-06-27 | 재단법인 포항산업과학연구원 | 코크스로 상승관 배열회수장치 |
| US20050172991A1 (en) * | 2002-06-19 | 2005-08-11 | Kabushiki Kaisha Toshiba | Thermoelectric element and electronic component module and portable electronic apparatus using it |
| US6755026B2 (en) * | 2002-10-24 | 2004-06-29 | Tech Medical Devices Inc. | Thermoelectric system to directly regulate the temperature of intravenous solutions and bodily fluids |
| JP2006507690A (ja) * | 2002-11-25 | 2006-03-02 | ネクストリーム・サーマル・ソリューションズ | トランス熱電装置 |
| KR100505554B1 (ko) * | 2003-01-24 | 2005-08-03 | 아이큐리랩 홀딩스 리미티드 | 하이브리드형 냉각 장치 |
| DE10342655A1 (de) * | 2003-09-15 | 2005-04-07 | Müller-Werth, Bernhard | Vorrichtung für die Erzeugung elektrischer Energie |
| DE10342653A1 (de) * | 2003-09-15 | 2005-04-07 | Miliauskaite, Asta, Dr. | Vorrichtung zur Erzeugung elektrischer Energie |
| KR101013889B1 (ko) * | 2003-10-01 | 2011-02-14 | 트랜스퍼시픽 소닉, 엘엘씨 | 히트 파이프를 이용한 컴팩트 열전기 냉각 방식의 열교환장치 |
| JP4002234B2 (ja) * | 2003-12-16 | 2007-10-31 | 浜松ホトニクス株式会社 | 半導体レーザ装置及びその製造方法 |
| US6917522B1 (en) * | 2003-12-29 | 2005-07-12 | Intel Corporation | Apparatus and method for cooling integrated circuit devices |
| US20050257532A1 (en) * | 2004-03-11 | 2005-11-24 | Masami Ikeda | Module for cooling semiconductor device |
| WO2005117153A1 (ja) * | 2004-05-31 | 2005-12-08 | Denso Corporation | 熱電変換装置およびその製造方法 |
| US6880346B1 (en) * | 2004-07-08 | 2005-04-19 | Giga-Byte Technology Co., Ltd. | Two stage radiation thermoelectric cooling apparatus |
| US9184364B2 (en) | 2005-03-02 | 2015-11-10 | Rosemount Inc. | Pipeline thermoelectric generator assembly |
| JP4639850B2 (ja) * | 2005-03-02 | 2011-02-23 | 株式会社Ｉｈｉ | 冷却方法及び装置 |
| ES2401437T3 (es) * | 2005-04-04 | 2013-04-19 | Roche Diagnostics Gmbh | Termociclado de un bloque que comprende múltiples muestras |
| JP4785476B2 (ja) * | 2005-09-20 | 2011-10-05 | 大阪瓦斯株式会社 | 熱電発電構造及び発電機能付き熱交換器 |
| CN100396999C (zh) * | 2005-09-27 | 2008-06-25 | 上海理工大学 | 热电制冷振荡热管复合冷却温控系统 |
| US20070101737A1 (en) * | 2005-11-09 | 2007-05-10 | Masao Akei | Refrigeration system including thermoelectric heat recovery and actuation |
| US7310953B2 (en) | 2005-11-09 | 2007-12-25 | Emerson Climate Technologies, Inc. | Refrigeration system including thermoelectric module |
| US7586125B2 (en) * | 2006-02-20 | 2009-09-08 | Industrial Technology Research Institute | Light emitting diode package structure and fabricating method thereof |
| FR2904145B1 (fr) * | 2006-07-20 | 2008-10-17 | Commissariat Energie Atomique | Composant electronique a transfert de chaleur par ebullition et condensation et procede de fabrication |
| JP2008066459A (ja) * | 2006-09-06 | 2008-03-21 | Tohoku Okano Electronics:Kk | 熱電素子モジュールおよびそれを用いた熱電変換装置 |
| US8188359B2 (en) * | 2006-09-28 | 2012-05-29 | Rosemount Inc. | Thermoelectric generator assembly for field process devices |
| ITMI20061868A1 (it) * | 2006-09-29 | 2008-03-30 | Motorquality S P A | Dispositivo frenante dotato di un dispositivo di raffreddamento a cella di pelttier |
| JP2008108781A (ja) * | 2006-10-23 | 2008-05-08 | Fujikura Ltd | 冷却システム |
| KR100859555B1 (ko) | 2007-07-09 | 2008-09-22 | 주식회사 하라시스템 | 열전소자를 이용한 능동 히트파이프 |
| US8633371B2 (en) * | 2007-11-09 | 2014-01-21 | The Boeing Company | Device and method for generating electrical power |
| TW200941776A (en) * | 2008-03-20 | 2009-10-01 | Jun-Guang Luo | Environmental thermal power generating device |
| US8519254B2 (en) * | 2008-04-08 | 2013-08-27 | The Boeing Company | Device and method for generating electrical power |
| US20090294117A1 (en) * | 2008-05-28 | 2009-12-03 | Lucent Technologies, Inc. | Vapor Chamber-Thermoelectric Module Assemblies |
| US20100006132A1 (en) * | 2008-07-14 | 2010-01-14 | Lucent Technologies, Inc. | Stacked Thermoelectric Modules |
| ITTV20080145A1 (it) * | 2008-11-14 | 2010-05-15 | Uniheat Srl | Sistema a tubo di calore oscillante a circuito chiuso in materiale polimerico |
| JP5345832B2 (ja) * | 2008-12-18 | 2013-11-20 | 新日鐵住金株式会社 | 排熱利用発電装置 |
| EP2312661A1 (en) * | 2009-10-16 | 2011-04-20 | Alcatel Lucent | Thermoelectric assembly |
| JP2011096983A (ja) * | 2009-11-02 | 2011-05-12 | Furukawa Electric Co Ltd:The | 冷却装置 |
| JP2011153776A (ja) * | 2010-01-28 | 2011-08-11 | Mitsubishi Electric Corp | 冷却装置 |
| US20130137144A1 (en) * | 2011-06-08 | 2013-05-30 | Bio-Rad Laboratories, Inc. LSG - GXD Division | Thermal block with built-in thermoelectric elements |
| JP2013082260A (ja) * | 2011-10-06 | 2013-05-09 | Hitachi Constr Mach Co Ltd | 作業機械用暖房装置 |
| JP5843316B2 (ja) * | 2011-11-30 | 2016-01-13 | 宮本 忠 | 熱エネルギー伝導装置を利用した発電システム |
| JP5650770B2 (ja) * | 2012-04-03 | 2015-01-07 | パナソニックＩｐマネジメント株式会社 | 熱電変換モジュール |
| JP6405604B2 (ja) * | 2013-07-08 | 2018-10-17 | 富士通株式会社 | 熱電素子及びその製造方法 |
| US9685598B2 (en) | 2014-11-05 | 2017-06-20 | Novation Iq Llc | Thermoelectric device |
| US10147861B2 (en) * | 2015-04-27 | 2018-12-04 | JikoPower, Inc. | Thermoelectric generator |
| CN106610161A (zh) * | 2015-10-26 | 2017-05-03 | 卡孚特能源技术（深圳）有限公司 | 一种基于半导体温控技术的热管型冷暖保鲜箱 |
| TWI574438B (zh) | 2015-11-24 | 2017-03-11 | 財團法人工業技術研究院 | 熱電轉換裝置 |
| KR102528360B1 (ko) * | 2016-09-02 | 2023-05-03 | 엘지이노텍 주식회사 | 열전 소자 및 열전 모듈 |
| JP6685880B2 (ja) * | 2016-10-25 | 2020-04-22 | ヤンマー株式会社 | 熱電発電装置 |
| JP6896524B2 (ja) * | 2017-06-28 | 2021-06-30 | ホーチキ株式会社 | 熱感知器 |
| RU180121U1 (ru) * | 2017-11-27 | 2018-06-05 | Федеральное государственное автономное образовательное учреждение высшего образования "Уральский федеральный университет имени первого Президента России Б.Н. Ельцина" | Устройство для регулируемого охлаждения жидкого металла в трубах реакторов на быстрых нейтронах |
| JP6953365B2 (ja) * | 2018-06-07 | 2021-10-27 | 横河電機株式会社 | 温度差発電装置及び測定システム |
| WO2021016399A1 (en) * | 2019-07-22 | 2021-01-28 | Reza Monazami | Thermal management device and system |
| US11781815B2 (en) * | 2020-09-08 | 2023-10-10 | ThermAvant Technologies, LLC | Lightweight structurally and thermally efficient oscillating heat pipe panel |
| US12119285B2 (en) * | 2021-09-03 | 2024-10-15 | Microsoft Technology Licensing, Llc | Image sensor with actively cooled sensor array |
| EP4460272A2 (en) | 2022-01-04 | 2024-11-13 | Bluexthermal, Inc. | Ocular region heat transfer devices and associated systems |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2844638A (en) * | 1954-01-04 | 1958-07-22 | Rca Corp | Heat pump |
| DE1174810B (de) * | 1962-04-06 | 1964-07-30 | Siemens Elektrogeraete Gmbh | Aus mehreren Peltierelementen bestehender Block mit zwei Sekundaersystemen als Waermeaustauscher |
| US3212274A (en) * | 1964-07-28 | 1965-10-19 | Eidus William | Thermoelectric condenser |
| US3834171A (en) | 1973-03-14 | 1974-09-10 | Bahco Ventilation Ab | Arrangement in heat exchangers |
| US4253515A (en) * | 1978-09-29 | 1981-03-03 | United States Of America As Represented By The Secretary Of The Navy | Integrated circuit temperature gradient and moisture regulator |
| IL68387A0 (en) * | 1982-04-28 | 1983-07-31 | Energy Conversion Devices Inc | Thermoelectric systems and devices |
| US5713208A (en) * | 1996-04-03 | 1998-02-03 | Amana Refrigeration Inc. | Thermoelectric cooling apparatus |
-
1997
- 1997-10-21 JP JP9288250A patent/JPH11121816A/ja active Pending
-
1998
- 1998-10-21 US US09/331,276 patent/US6233944B1/en not_active Expired - Fee Related
- 1998-10-21 WO PCT/JP1998/004756 patent/WO1999021234A1/en not_active Application Discontinuation
- 1998-10-21 CA CA002275387A patent/CA2275387A1/en not_active Abandoned
- 1998-10-21 KR KR1019997005406A patent/KR20000069515A/ko not_active Application Discontinuation
- 1998-10-21 IL IL13038298A patent/IL130382A/he not_active IP Right Cessation
- 1998-10-21 EP EP98950315A patent/EP0963611A1/en not_active Withdrawn
- 1998-10-21 TW TW087117441A patent/TW425729B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US6233944B1 (en) | 2001-05-22 |
| EP0963611A1 (en) | 1999-12-15 |
| TW425729B (en) | 2001-03-11 |
| KR20000069515A (ko) | 2000-11-25 |
| JPH11121816A (ja) | 1999-04-30 |
| CA2275387A1 (en) | 1999-04-29 |
| IL130382A0 (en) | 2000-06-01 |
| WO1999021234A1 (en) | 1999-04-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| FF | Patent granted | ||
| KB | Patent renewed | ||
| MM9K | Patent not in force due to non-payment of renewal fees |