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HUE042821T2 - Fém nanorészecske diszperzió, eljárás fém nanorészecske diszperzió elõállítására, és ragasztási eljárás - Google Patents

Fém nanorészecske diszperzió, eljárás fém nanorészecske diszperzió elõállítására, és ragasztási eljárás

Info

Publication number
HUE042821T2
HUE042821T2 HUE14787542A HUE14787542A HUE042821T2 HU E042821 T2 HUE042821 T2 HU E042821T2 HU E14787542 A HUE14787542 A HU E14787542A HU E14787542 A HUE14787542 A HU E14787542A HU E042821 T2 HUE042821 T2 HU E042821T2
Authority
HU
Hungary
Prior art keywords
metal nanoparticle
nanoparticle dispersion
bonding method
producing
producing metal
Prior art date
Application number
HUE14787542A
Other languages
English (en)
Inventor
Keiichi Endoh
Hiromasa Miyoshi
Takashi Hinotsu
Satoru Kurita
Yoshiko KOHNO
Original Assignee
Dowa Electronics Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Electronics Materials Co Ltd filed Critical Dowa Electronics Materials Co Ltd
Publication of HUE042821T2 publication Critical patent/HUE042821T2/hu

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0545—Dispersions or suspensions of nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
HUE14787542A 2013-04-26 2014-04-25 Fém nanorészecske diszperzió, eljárás fém nanorészecske diszperzió elõállítására, és ragasztási eljárás HUE042821T2 (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013093801A JP6099472B2 (ja) 2013-04-26 2013-04-26 金属ナノ粒子分散体、金属ナノ粒子分散体の製造方法および接合方法

Publications (1)

Publication Number Publication Date
HUE042821T2 true HUE042821T2 (hu) 2019-07-29

Family

ID=51791982

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE14787542A HUE042821T2 (hu) 2013-04-26 2014-04-25 Fém nanorészecske diszperzió, eljárás fém nanorészecske diszperzió elõállítására, és ragasztási eljárás

Country Status (8)

Country Link
US (1) US9662748B2 (hu)
EP (1) EP2990142B1 (hu)
JP (1) JP6099472B2 (hu)
KR (1) KR102219208B1 (hu)
CN (1) CN105142829B (hu)
HU (1) HUE042821T2 (hu)
TW (1) TWI564913B (hu)
WO (1) WO2014175417A1 (hu)

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US11189393B2 (en) * 2015-03-23 2021-11-30 Bando Chemical Industries, Ltd. Conductive coated composite body and method for producing same
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WO2020196299A1 (ja) * 2019-03-22 2020-10-01 ハリマ化成株式会社 金属ペースト、接合方法及び接合体の製造方法
CN110033877B (zh) * 2019-04-25 2020-09-25 中国科学院深圳先进技术研究院 一种银基导电浆料及其制备方法和在封装芯片互连中的应用
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Also Published As

Publication number Publication date
WO2014175417A1 (ja) 2014-10-30
EP2990142A1 (en) 2016-03-02
KR102219208B1 (ko) 2021-02-23
JP2014214357A (ja) 2014-11-17
EP2990142B1 (en) 2018-12-19
US9662748B2 (en) 2017-05-30
US20160101486A1 (en) 2016-04-14
TWI564913B (zh) 2017-01-01
TW201501135A (zh) 2015-01-01
KR20160003787A (ko) 2016-01-11
CN105142829B (zh) 2019-02-15
CN105142829A (zh) 2015-12-09
JP6099472B2 (ja) 2017-03-22
EP2990142A4 (en) 2017-01-04

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