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HK1218484A1 - 模塊化數據中心 - Google Patents

模塊化數據中心

Info

Publication number
HK1218484A1
HK1218484A1 HK16106401.2A HK16106401A HK1218484A1 HK 1218484 A1 HK1218484 A1 HK 1218484A1 HK 16106401 A HK16106401 A HK 16106401A HK 1218484 A1 HK1218484 A1 HK 1218484A1
Authority
HK
Hong Kong
Prior art keywords
data center
modular data
modular
center
data
Prior art date
Application number
HK16106401.2A
Other languages
English (en)
Inventor
陳炎昌
Original Assignee
Alibaba Group Holding Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alibaba Group Holding Ltd filed Critical Alibaba Group Holding Ltd
Publication of HK1218484A1 publication Critical patent/HK1218484A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1497—Rooms for data centers; Shipping containers therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/202—Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
    • E04H5/00—Buildings or groups of buildings for industrial or agricultural purposes
    • E04H2005/005—Buildings for data processing centers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
HK16106401.2A 2014-07-16 2016-06-06 模塊化數據中心 HK1218484A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410339826.0A CN105376986B (zh) 2014-07-16 2014-07-16 模块化数据中心

Publications (1)

Publication Number Publication Date
HK1218484A1 true HK1218484A1 (zh) 2017-02-17

Family

ID=55075850

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16106401.2A HK1218484A1 (zh) 2014-07-16 2016-06-06 模塊化數據中心

Country Status (4)

Country Link
US (2) US9572290B2 (zh)
CN (1) CN105376986B (zh)
HK (1) HK1218484A1 (zh)
WO (1) WO2016011186A1 (zh)

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US11326830B2 (en) 2019-03-22 2022-05-10 Robert W. Jacobi Multiple module modular systems for refrigeration
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CN110139529A (zh) * 2019-06-11 2019-08-16 大同秦淮数据有限公司 一种模块化数据中心
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KR20210072857A (ko) * 2019-12-09 2021-06-18 삼성디스플레이 주식회사 표시 장치
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JP7498609B2 (ja) * 2020-07-14 2024-06-12 カヤバ株式会社 変速機付モータ
CN114503052B (zh) * 2020-08-27 2024-08-27 华为数字能源技术有限公司 一种数据中心及扩容方法
CN112991959B (zh) * 2021-03-31 2023-09-29 上海天马微电子有限公司 可折叠显示模组及其制作方法、可折叠显示装置
US12137536B2 (en) 2021-04-01 2024-11-05 Ovh Systems and methods for autonomously activable redundant cooling of a heat generating component
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EP4068921B1 (en) * 2021-04-01 2024-07-17 Ovh Immersion cooling systems for electronic components
CN115234568B (zh) * 2021-04-25 2023-09-19 北京小米移动软件有限公司 连接模组及显示终端
CN113423249B (zh) * 2021-07-06 2022-07-22 深圳市特发信息技术服务有限公司 一种模块化集装箱式数据中心机房
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CN105451504B (zh) * 2014-08-19 2018-02-23 阿里巴巴集团控股有限公司 机房、数据中心及数据中心系统

Also Published As

Publication number Publication date
CN105376986A (zh) 2016-03-02
US9943005B2 (en) 2018-04-10
US20160021793A1 (en) 2016-01-21
US20170105310A1 (en) 2017-04-13
CN105376986B (zh) 2018-01-02
US9572290B2 (en) 2017-02-14
WO2016011186A1 (en) 2016-01-21

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20240716