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HK1116595A1 - Insulation-coated electroconductive particles - Google Patents

Insulation-coated electroconductive particles

Info

Publication number
HK1116595A1
HK1116595A1 HK08106607.4A HK08106607A HK1116595A1 HK 1116595 A1 HK1116595 A1 HK 1116595A1 HK 08106607 A HK08106607 A HK 08106607A HK 1116595 A1 HK1116595 A1 HK 1116595A1
Authority
HK
Hong Kong
Prior art keywords
insulation
electroconductive particles
coated electroconductive
coated
particles
Prior art date
Application number
HK08106607.4A
Other languages
Chinese (zh)
Inventor
小西美佐夫
工藤憲明
Original Assignee
迪睿合電子材料有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 迪睿合電子材料有限公司 filed Critical 迪睿合電子材料有限公司
Publication of HK1116595A1 publication Critical patent/HK1116595A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/10—Treatment with macromolecular organic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Paints Or Removers (AREA)
HK08106607.4A 2005-02-24 2008-06-16 Insulation-coated electroconductive particles HK1116595A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005048948A JP5099284B2 (en) 2005-02-24 2005-02-24 Anisotropic connection sheet material
PCT/JP2005/003115 WO2006090467A1 (en) 2005-02-24 2005-02-25 Insulation-coated electroconductive particles

Publications (1)

Publication Number Publication Date
HK1116595A1 true HK1116595A1 (en) 2008-12-24

Family

ID=36927118

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08106607.4A HK1116595A1 (en) 2005-02-24 2008-06-16 Insulation-coated electroconductive particles

Country Status (6)

Country Link
JP (1) JP5099284B2 (en)
KR (2) KR101163436B1 (en)
CN (1) CN101128886B (en)
HK (1) HK1116595A1 (en)
TW (1) TWI257741B (en)
WO (1) WO2006090467A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4780197B2 (en) * 2006-10-17 2011-09-28 日立化成工業株式会社 Coated particle, method for producing the same, anisotropic conductive adhesive composition using coated particle, and anisotropic conductive adhesive film
JP4957695B2 (en) * 2007-10-02 2012-06-20 日立化成工業株式会社 Conductive particle, method for producing the same, method for producing insulating coated conductive particle, and anisotropic conductive adhesive film
KR101148143B1 (en) * 2008-12-17 2012-05-23 제일모직주식회사 Insulated conductive particles and anisotropic conductive film composition using the same
JP5788130B2 (en) * 2008-12-26 2015-09-30 日本発條株式会社 Conductive resin film and method for producing the same
JP4957838B2 (en) 2009-08-06 2012-06-20 日立化成工業株式会社 Conductive fine particles and anisotropic conductive materials
JP5398455B2 (en) * 2009-09-30 2014-01-29 デクセリアルズ株式会社 Anisotropic conductive film and manufacturing method thereof
JP2015079586A (en) * 2013-10-15 2015-04-23 デクセリアルズ株式会社 Anisotropic conductive film
JP6518101B2 (en) * 2014-03-26 2019-05-22 積水化学工業株式会社 PHOTO-CURABLE CONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
WO2016080515A1 (en) * 2014-11-20 2016-05-26 積水化学工業株式会社 Conductive particles, method for manufacturing conductive particles, conductive material, and connection structure
JP6592350B2 (en) * 2014-12-26 2019-10-16 積水化学工業株式会社 Anisotropic conductive material, connection structure, and manufacturing method of connection structure
JP6082843B2 (en) * 2015-02-19 2017-02-15 積水化学工業株式会社 Conductive paste and connection structure
CN106318244A (en) * 2015-07-02 2017-01-11 玮锋科技股份有限公司 Anisotropic conductive film by nuclear layer technology
WO2017033934A1 (en) * 2015-08-24 2017-03-02 積水化学工業株式会社 Conductive material and connection structure
CN110875101A (en) * 2018-08-31 2020-03-10 玮锋科技股份有限公司 Anisotropic conductive film structure and manufacturing method thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US596506A (en) * 1898-01-04 Electric switch
JPH0559338A (en) * 1991-08-30 1993-03-09 Sekisui Chem Co Ltd Tack agent composition, tack processed product and its production
JP4080573B2 (en) * 1997-08-01 2008-04-23 ソニー株式会社 Planar lens, method of manufacturing the same, and screen for rear projection projector
KR100539060B1 (en) * 1997-10-28 2007-04-25 소니 케미카루 가부시키가이샤 Anisotropic conductive adhesive and adhesive film
JP3296306B2 (en) * 1997-10-28 2002-06-24 ソニーケミカル株式会社 Anisotropic conductive adhesive and adhesive film
JP2000305181A (en) * 1999-04-23 2000-11-02 Sony Corp Planar lens, its manufacture and screen for rear projection type projector
JP2001106928A (en) * 1999-07-30 2001-04-17 Dainippon Ink & Chem Inc Resin particles encapsulated with conductive material and method for producing the same
DE10016041A1 (en) * 2000-03-31 2001-10-04 Stockhausen Chem Fab Gmbh Powdery surface crosslinked polymers
KR100832282B1 (en) * 2000-10-23 2008-05-26 세키스이가가쿠 고교가부시키가이샤 Coating particles
JP5060692B2 (en) * 2001-07-13 2012-10-31 株式会社日本触媒 Anisotropic conductive material
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
JP4050086B2 (en) * 2002-04-24 2008-02-20 ナトコ株式会社 Conductive particles, conductive materials, and anisotropic conductive films
JP2005063804A (en) * 2003-08-12 2005-03-10 Matsushita Electric Works Ltd Illuminance sensor device for remote monitoring and control system
JP4539813B2 (en) * 2003-08-19 2010-09-08 ソニーケミカル＆インフォメーションデバイス株式会社 Insulation coated conductive particles
JP5177439B2 (en) * 2009-06-23 2013-04-03 デクセリアルズ株式会社 Insulation coated conductive particles

Also Published As

Publication number Publication date
WO2006090467A1 (en) 2006-08-31
KR101246516B1 (en) 2013-03-26
TW200631240A (en) 2006-09-01
CN101128886A (en) 2008-02-20
KR101163436B1 (en) 2012-07-13
KR20070105972A (en) 2007-10-31
JP5099284B2 (en) 2012-12-19
KR20110134946A (en) 2011-12-15
TWI257741B (en) 2006-07-01
JP2006236759A (en) 2006-09-07
CN101128886B (en) 2014-03-26

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20250221