HK1108973A1 - Substrate with multi-layer interconnection structure and method of manufacturing the same - Google Patents
Substrate with multi-layer interconnection structure and method of manufacturing the sameInfo
- Publication number
- HK1108973A1 HK1108973A1 HK07114167.1A HK07114167A HK1108973A1 HK 1108973 A1 HK1108973 A1 HK 1108973A1 HK 07114167 A HK07114167 A HK 07114167A HK 1108973 A1 HK1108973 A1 HK 1108973A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- substrate
- manufacturing
- same
- interconnection structure
- layer interconnection
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610005788 CN1996582B (en) | 2006-01-06 | 2006-01-06 | Carrier board comprising multilayer interconnect structure and methods of manufacture, recycling and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HK1108973A1 true HK1108973A1 (en) | 2008-05-23 |
Family
ID=38251597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HK07114167.1A HK1108973A1 (en) | 2006-01-06 | 2007-12-27 | Substrate with multi-layer interconnection structure and method of manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN1996582B (en) |
| HK (1) | HK1108973A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI337059B (en) | 2007-06-22 | 2011-02-01 | Princo Corp | Multi-layer substrate and manufacture method thereof |
| EP2170023A4 (en) * | 2007-07-12 | 2011-07-20 | Princo Corp | Multilayer substrate and fabricating method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2823596B1 (en) * | 2001-04-13 | 2004-08-20 | Commissariat Energie Atomique | SUBSTRATE OR DISMOUNTABLE STRUCTURE AND METHOD OF MAKING SAME |
-
2006
- 2006-01-06 CN CN 200610005788 patent/CN1996582B/en not_active Expired - Fee Related
-
2007
- 2007-12-27 HK HK07114167.1A patent/HK1108973A1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1996582B (en) | 2012-02-15 |
| CN1996582A (en) | 2007-07-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20200106 |