CN1996582B - Carrier board comprising multilayer interconnect structure and methods of manufacture, recycling and application thereof - Google Patents
Carrier board comprising multilayer interconnect structure and methods of manufacture, recycling and application thereof Download PDFInfo
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- CN1996582B CN1996582B CN 200610005788 CN200610005788A CN1996582B CN 1996582 B CN1996582 B CN 1996582B CN 200610005788 CN200610005788 CN 200610005788 CN 200610005788 A CN200610005788 A CN 200610005788A CN 1996582 B CN1996582 B CN 1996582B
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- connection line
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
本发明提供一种包含多层内连线结构的载板，其包含一载板以及位在该载板上的一多层内连线结构，其中该多层内连线结构与该载板间仅在部分区域实质附着；且多层内连线结构与载板的分离简单、快速且低成本。本发明也提供上述包含多层内连线结构的载板的制造方法、回收方法以及使用其的封装方法与多层内连线装置的制造方法。
The present invention provides a carrier board including a multi-layer interconnect structure, which includes a carrier board and a multi-layer interconnect structure located on the carrier board, wherein the multi-layer interconnect structure is substantially attached to the carrier board only in a partial area; and the separation of the multi-layer interconnect structure from the carrier board is simple, fast and low-cost. The present invention also provides a manufacturing method and a recycling method of the carrier board including the multi-layer interconnect structure, a packaging method using the same, and a manufacturing method of a multi-layer interconnect device.
Description
[technical field]
The invention relates to a kind of manufacturing approach that comprises support plate and manufacturing, recovery method, the method for packing that uses it and the multiple layer inner connection line apparatus of multi-layer internal connection line; Especially about a kind of support plate that comprises multi-layer internal connection line; Between its multi-layer internal connection line and the support plate in the subregion essence adhere to and the manufacturing approach of manufacturing, recovery method, the method for packing that uses it and multiple layer inner connection line apparatus.
[background technology]
Progress along with present semiconductor fabrication process; The live width of wafer, distance between centers of tracks and size are all more and more little; The desired transmission speed of wafer is more and more fast, power output is more and more high; Therefore it is more and more high that wafer is electrically connected to the outside also corresponding requirement of structure packing technique, lead will be more and more many and wire pitch also need more and more intensively, so the technology of chip assembly is changeed gradually from the pin insert type and is entered surface adhesion type; Gradually change the mode of using projection that enters from the connection kenel that lead frame is beaten gold thread, circuit board changes gradually from PCB hardboard, flexible printed wiring board FPC and enters the IC substrate.
Heavily about 4 grams of the PCB hardboard of general six layers of BT material, the about 1mm of thickness, thereby can't deflection; And flexible printed wiring board only can be made 2 layers of intraconnections under the situation of the about 50 μ m of thickness, and is relative; Under the situation of the about 50 μ m of thickness, the IC substrate can be produced 6 layers of intraconnections substrate, about 0.21 gram of total weight; Therefore the flexibility of IC substrate is best, and the most frivolous.On this external intraconnections density, the through hole minimum of PCB hardboard and flexible printed wiring board is required to be 50 μ m, and through hole weld pad minimum is required to be 100 μ m; Live width and distance between centers of tracks minimum are required to be 25 μ m; And relative, the through hole minimum of IC substrate is required to be 20 μ m, and through hole weld pad minimum is required to be 25 μ m; Live width and distance between centers of tracks minimum are required to be 20 μ m, so the IC substrate can significantly increase intraconnections density.
Downsizing along with the circuit board size; Requirement for circuit board precision also improves; The fabrication schedule of circuit board also is faced with new challenges; Especially it is very important in fabrication schedule, how improving line density, and the key of raising line density is the dimensional stability of circuit board in the fabrication schedule.A kind of solution of convention is on a hard support plate, to carry out the making of IC substrate; Increasing the dimensional stability of IC substrate in processing procedure by the preferable dimensional stability of support plate, is a big problem of this type of technology but after the IC substrate manufacture is accomplished, will how the IC substrate be separated with support plate.
In No. the 4812191st, United States Patent (USP); Disclose a kind of to sacrifice the method that the support plate manufacturing technology is made multi-layer internal connection line; Wherein be on support plate, to make multi-layer internal connection line; The thermal coefficient of expansion of support plate is less than multi-layer internal connection line; Then harden, in the program that heats up, lowers the temperature, make to be adsorbed on the enough tension force of generation between support plate and the multi-layer internal connection line mode that reaches acid liquor etching on the multi-layer internal connection line with supportive device again multi-layer internal connection line and support plate are separated.
In No. the 5258236th, United States Patent (USP); Disclose a kind of method of separating support plate and multi-layer internal connection line with laser lift-off; As shown in Figure 1; Wherein the order with polymeric layer 2, metal level 3 and multi-layer internal connection line 4 be formed in order on the transparent support plate 1 after, see through transparent support plate 1 with the laser ultraviolet light again and be radiated at decomposing copolymer layer 2 on the polymeric layer 2, and make transparent support plate 1 to separate with other part-structures.
Yet; The separation method of above-mentioned known techniques is comparatively loaded down with trivial details, complicated; Therefore, how a method and structure are provided, simultaneously the high IC substrate of manufactured size precision; Can make IC substrate and separating of support plate again is simply, cheaply, is still that circuit board manufacturing process at present makes great efforts to pursue.
[summary of the invention]
The object of the present invention is to provide a kind of support plate and manufacturing approach thereof that comprises multi-layer internal connection line, wherein multi-layer internal connection line be separating of support plate simply, fast and cheaply; The present invention more provides and uses this to comprise the method for packing of the support plate of multi-layer internal connection line, and reclaims the method that this comprises the support plate of multi-layer internal connection line.
At a kind of support plate that comprises multi-layer internal connection line provided by the invention, comprise: a support plate; And a multi-layer internal connection line, this multi-layer internal connection line position on this support plate, wherein between this multi-layer internal connection line and this support plate only in the subregion essence adhere to.Wherein this subregion can be at support plate outer peripheral areas, be spot distribution or distribute as net shape or the like.
In a kind of manufacturing approach that comprises the support plate of multi-layer internal connection line of the present invention, comprise: a support plate is provided; And form a multi-layer internal connection line on this support plate, wherein between this multi-layer internal connection line and this support plate only in the subregion essence adhere to.Wherein this subregion can be at support plate outer peripheral areas, be spot distribution or distribute as net shape or the like.
The present invention provides a kind of electron element packaging method in addition, uses the above-mentioned support plate that comprises multi-layer internal connection line, and this method for packing comprises: be electrically connected at least one electronic component and comprise the support plate of multi-layer internal connection line to this; Sealing is on this electronic component; And cut this multi-layer internal connection line, make the multiple layer inner connection line apparatus that is packaged with electronic component and this support plate natural separation that cuts down.Wherein this electronic component is a plurality of; Sealing is in being only not have sealing on the specific region of support plate of this multi-layer internal connection line of these a plurality of electronic components on these a plurality of electronic components; Making does not have sealing on the remaining area, uses and keeps the flexibility that this is packaged with the multiple layer inner connection line apparatus of electronic component.
The present invention provides a kind of electron element packaging method in addition, uses as the above-mentioned support plate that comprises multi-layer internal connection line, and this method for packing comprises: cut this multi-layer internal connection line, feasible multiple layer inner connection line apparatus and this support plate natural separation that cuts down; Be electrically connected at least one electronic component to this multiple layer inner connection line apparatus; And sealing is on this electronic component.Wherein this electronic component is a plurality of; Sealing is on these a plurality of electronic components being only sealing on this multiple layer inner connection line apparatus specific region of these a plurality of electronic components of nothing; Making does not have sealing on the remaining area, uses and keeps the flexibility that this is packaged with the multiple layer inner connection line apparatus of electronic component.
The present invention provides a kind of recovery method that reclaims like the above-mentioned support plate that comprises multi-layer internal connection line in addition, and comprising provides the support plate that comprises multi-layer internal connection line, and this multi-layer internal connection line is removed from this support plate.Wherein this multi-layer internal connection line is to have part to be cut to remove; This removes step and can use sulfuric acid and mixed solution of hydrogen peroxide to carry out this multi-layer internal connection line is removed from this support plate; To grind this multi-layer internal connection line is removed from this support plate, or this multi-layer internal connection line is removed from this support plate with the mode of tearing off.
The present invention provides a kind of manufacturing approach of multiple layer inner connection line apparatus in addition, comprises: a support plate is provided; Form a multi-layer internal connection line on this support plate, wherein between this multi-layer internal connection line and this support plate only in the subregion essence adhere to; And cut this multi-layer internal connection line, make multiple layer inner connection line apparatus and this support plate natural separation that cuts down.Wherein this subregion can be at support plate outer peripheral areas, be spot distribution or distribute as net shape or the like.
By technological means of the present invention, must multi-layer internal connection line be separated with support plate with complicated modes such as solvent, laser compared to known techniques, the present invention can make the multiple layer inner connection line apparatus with mode simply, fast and cheaply.
[description of drawings]
Fig. 1 shows that a kind of convention separates the method for support plate and multi-layer internal connection line with laser lift-off;
Fig. 2 A, 2B show as top view and the drawing in side sectional elevation that comprises the support plate of multi-layer internal connection line of the present invention;
Fig. 3 A-3D demonstration is electrically connected electronic component with the support plate that comprises multi-layer internal connection line of the present invention, and accomplishes a method of encapsulation;
Fig. 4 A-4D demonstration is electrically connected electronic component with the support plate that comprises multi-layer internal connection line of the present invention, and accomplishes another method of encapsulation;
Fig. 5 shows after encapsulating like method for packing of the present invention, the remaining support plate that comprises multi-layer internal connection line;
Fig. 6 shows as constituency of the present invention adhering zone is latticed;
Fig. 7 shows as constituency of the present invention adhering zone is a point-like.
[embodiment]
To preferred embodiment of the present invention be described with reference to graphic now, each element all indicate reference symbol so that explanation with understand.Notice that the described embodiment of the invention only is to serve as illustrative, and non-limiting, exist only if particularly pointed out this kind restriction in an embodiment.
Fig. 2 A, 2B show as top view and the drawing in side sectional elevation that comprises the support plate of multi-layer internal connection line of the present invention.The illustrative multi-layer internal connection line of present embodiment is to be a two-sided substrate, and the promptly positive and back side all is electrically connected to the outside, in this double-sided substrate; Substrate front side is to be electrically connected to substrate back; But multi-layer internal connection line also can be other inner connection modes, like interior connection or other various situations of coplanar multiple spot, in addition; The number of plies of multi-layer internal connection line is not restriction also, can should be used for suitable variation according to various.
In addition; Must note in Fig. 2 A, 2B; Only schematically illustrate a multi-layer internal connection line 19 is used as a substrate; Can know that but have the knack of this technological personage a multi-layer internal connection line 19 can be made into hundreds of thousands of substrates in the successive process cutting, has been merely convenience at this and has represented to simplify with explanation.
In this embodiment, the carrier plate 11 is a silicon wafer six o'clock, the carrier plate 11 in turn overlaps the dielectric layer and the metal layer to form a multilayer interconnection structure 19, wherein the dielectric layers 12, 14, 16, 18 is an optional low-dielectric constant (less than 4) of polyimide PI (polyimide), a thickness of 8μm, the upper metal layer 17 and the lower metal layer 13 is used Cr / Cu / Ni / Au bump metallization structure ( UBM, under? bump? metallurgy), as a follow-up is electrically connected to the TIN using the ball, in the middle of the metal layer 15 used Cr / Cu / Cr multilayer metal wire.
On multi-layer internal connection line 19, can utilize engraving method or method for drilling holes to connect dielectric layer 18,14 or 16, make metal interconnecting to be electrically connected each other, or be electrically connected to the outside.
Must notice that in the present invention support plate can be all solid materials, comprises metal, glass, pottery, Silicon Wafer, sapphire substrate, GaAs, pi or the like.Dielectric layer material can be any organic material; Comprise pi PI (polyimide), benzocyclobutene BCB (benzo-cyclobutene), polymetylmethacrylate (poly (methyl-methacrylate)), liquid crystal polymer LCP (liquid crystal polymer) or the like; For base plate for packaging is used; Low-k, low dielectric consume help at a high speed, the application of high-effect encapsulation; Suitably the material of engineering properties (like thermal coefficient of expansion CTE, young's modulus) is selected the engineering properties with coupling electronic component and multiple layer inner connection line apparatus, more can help the reliability of encapsulating products.The mode of dielectric layer coating can be rotary coating, plsitive mold coating, roller coating.Metal interconnecting can use engraving method, metal-stripping method (MetalLift-off) or the like mode to make.
In the present invention; It can be the primary characteristic of utilizing the support plate surface that the constituency is adhered to, or utilizes the mode that promotes surface energy, as handling or the like with the electricity slurry; Or utilize to strengthen interface molecule crosslinked with the material of entwining, reinforcing agent that like silicon-coated methane is or the like mode is reached.Table one shows the example of the various constituencies adhering mode that various different carrier plate material and dielectric layer material can be selected for use, but is not limited thereto.
Table one:
<tables num="0001"> <table > <tgroup cols="4"> <colspec colname = "c001" colwidth = "15 % " /> <colspec colname="c002" colwidth="28%" /> <colspec colname="c003" colwidth="28%" /> <colspec colname =" c004 "colwidth =" 28% " /> <tbody > <row > <entry morerows="1"> carrier board material </entry> <entry morerows="1"> dielectric layer </entry> <entry morerows="1"> attachment France </entry> <entry morerows = "1 "> No attachment region </entry> </row> <row > <entry morerows="1"> aluminum nitride silicon dioxide glass </entry> <entry morerows = "1"> Polyimide </entry> <entry morerows="1"> silane is enhancer </entry> <entry morerows = " 1 "> does not handle </entry> </row> <row > <entry morerows="1"> silicon </entry> <entry morerows =" 1 "> Polyimide </entry> <entry morerows="1"> 1. coated polyimide 2 special. hardening 3. comprehensiveness plasma treatment 4. coated dielectric layer </entry> <entry morerows="1"> not addressed, the plasma treatment does not require a mask obscured </entry> </row> <row > <entry morerows =" 1 "> silicon dioxide glass, aluminum nitride ceramic </entry> <entry morerows="1"> polyimide </entry> <entry morerows = "1"> physical vapor deposition (PVD) chromium film </entry> <entry morerows="1"> not handle, chrome plating mask when the required block </entry> </row> </tbody> </tgroup> </table> </tables>
Then, explain and utilize the above-mentioned support plate that comprises multi-layer internal connection line to be electrically connected electronic component, and accomplish the method for encapsulation.
Fig. 3 A to Fig. 3 D demonstration is electrically connected electronic component with the support plate that comprises multi-layer internal connection line of the present invention, and accomplishes a method of encapsulation.Whether Fig. 3 A demonstration as of the present invention comprises the support plate 11 of multi-layer internal connection line 19, can test earlier, good to confirm its intraconnections situation; Then; Shown in Fig. 3 B; One electronic component 21 is electrically connected to the mode of projection 22 chip bondings comprises on the multi-layer internal connection line 19; Must notice that the quantity of electronic component is not limited to one; Also be not limited to IC, other elements such as passive device, printed circuit board (PCB) can be the elements that multi-layer internal connection line 19 of the present invention is electrically connected, in addition; The juncture that is electrically connected also can be selected other modes, like routing, anisotropic conductive film ACF (anisotropic conductive film), surface adhering technology SMT (surface mounttechnology), BGA Package BGA (ball grid array), planar lattice array LGA (landgrid array), stitch grid array PGA (pin grid array) or the like; Then; Shown in Fig. 3 C; On electronic component 21, encapsulate with sealing 23; Sealing can be used like molding for epoxy resin (epoxy molding), box dam and filling epoxy resin (Dam Fill Epoxy), box dam and filling gel (Dam Fill Silicone) or the like, and sealing region need can not kept sealing on appropriate area on whole multi-layer internal connection line 19 in addition; To keep the flexibility of multi-layer internal connection line 19, to cooperate various application scenarios at ad-hoc location; At last; Shown in Fig. 3 D, on the suitable position of multi-layer internal connection line 19, cut, the multiple layer inner connection line apparatus 24 that makes gained be packaged with electronic component 21 directly separates with support plate 11; Double-sided substrate situation to present embodiment; Will be again at substrate back with laser drill, make bottom UBM can be electrically connected to the outside, and accomplish the encapsulation of electronic component.
Fig. 4 A to Fig. 4 D demonstration is electrically connected electronic component with the support plate that comprises multi-layer internal connection line of the present invention, and accomplishes another method of encapsulation.Fig. 4 A shows as the support plate 11 that comprises multi-layer internal connection line 19 of the present invention; Then, Fig. 4 B is presented on the suitable position of multi-layer internal connection line 19 and cuts, and makes the multiple layer inner connection line apparatus 25 of gained directly separate with support plate 11; Double-sided substrate situation to present embodiment; Will be again at substrate back with laser drill, make bottom UBM can be electrically connected to the outside, in addition; Can test earlier, whether good to confirm the intraconnections situation; Then; Shown in Fig. 4 C, an electronic component 26 is electrically connected to the mode of projection 27 chip bondings comprises on the multiple layer inner connection line apparatus 25, as previously mentioned; Number of electronic components is not limited to one; Also be not limited to IC, other elements such as passive device, printed circuit board (PCB) can be the elements that multiple layer inner connection line apparatus 25 of the present invention is electrically connected, in addition; The juncture that is electrically connected also can be selected other modes, like routing, anisotropic conductive film ACF, surface adhering technology SMT, BGA Package BGA, planar lattice array LGA, stitch grid array PGA or the like; Then; Shown in Fig. 4 D, on electronic component 26, encapsulate, as aforementioned with sealing 28; Sealing 28 can be used like molding for epoxy resin (epoxymolding), box dam and filling epoxy resin (Dam & Fill Epoxy), box dam and filling gel (Dam & Fill Silicone) or the like; Sealing region need can not kept sealing on appropriate area on whole multiple layer inner connection line apparatus 25 in addition, to keep the flexibility of multiple layer inner connection line apparatus 25 on ad-hoc location; Cooperating various application scenarios, and accomplish the encapsulation of electronic component.
Above-mentioned instance is only explained the situation of electronic package on multiple layer inner connection line apparatus of the present invention; But the occupation mode of multiple layer inner connection line apparatus of the present invention is not limited thereto situation; The intermediary layer that multiple layer inner connection line apparatus of the present invention can also be connected with printed circuit board (PCB) as electronic component; The intermediary layer that printed circuit board (PCB) is connected with printed circuit board (PCB); The intermediary layer that is electrically connected each other between a plurality of electronic components, or the situation that is electrically connected of multiple layer inner connection line apparatus and other multiple layer inner connection line apparatus.
Another aspect of the present invention more comprises the recovery method for the support plate that comprises multi-layer internal connection line; Fig. 5 shows after above-mentioned two kinds of method for packing encapsulation; The remaining support plate that comprises multi-layer internal connection line can separate this multi-layer internal connection line with the above-mentioned remaining support plate that comprises multi-layer internal connection line with the various methods that remove the separate multiple layer internal connection-wire structure with support plate; For example immerse in the mixed solution of sulfuric acid and hydrogen peroxide; Mode to grind removes multi-layer internal connection line, or directly tears off out the mode of multi-layer internal connection line, reuses and can support plate be reclaimed again.
The adhering zone of constituency attachment method is not limited to the outer peripheral areas of the foregoing description; It can be different shape; Like latticed, point-like; As long as be unlikely in follow-up various processing procedures, to produce various defectives such as delamination, bubble, Fig. 6 shows as constituency of the present invention adhering zone is latticed situation, and Fig. 7 shows as constituency of the present invention adhering zone is the situation of point-like.
The present invention with way of illustration narration explanation, should be appreciated that above-mentioned explanation only is descriptive and non-limiting.Haveing the knack of this skill personage can be that various change of the present invention is revised according to above-mentioned explanation.Therefore, the present invention will comprise all modifications that fall into this case protection range and change situation.
[explanation of symbol]
1 support plate
2 polymeric layers
3 metal levels
4 multi-layer internal connection lines
11 support plates
12 dielectric layers
13 lower metal layers
14 dielectric layers
15 metal levels
16 dielectric layers
Metal level on 17
18 dielectric layers
19 multi-layer internal connection lines
20 zones
21 electronic components
22 projections
23 sealings
24 multiple layer inner connection line apparatus
25 multiple layer inner connection line apparatus
26 electronic components
27 projections
28 sealings
Claims (15)
1. support plate that comprises multi-layer internal connection line is characterized in that: comprise:
One support plate; And
One multi-layer internal connection line; The position on this support plate, wherein between this multi-layer internal connection line and this support plate only in the subregion essence adhere to, in the zone that essence is adhered to; This multi-layer internal connection line directly contacts with support plate; The interface adhesive force that adheres to the zone that makes that this essence is adhered to through the constituency is different from all the other zones, and it is to utilize the primary characteristic on support plate surface or utilize the mode that promotes surface energy to reach that the constituency is adhered to, and this multi-layer internal connection line comprises a dielectric layer; Adhere to this dielectric layer and support plate; This dielectric layer is processed by organic material, and the zone of adhering to support plate essence on this multi-layer internal connection line is a zone of removing to be cut, and this zone of removing to be cut only is arranged on this multi-layer internal connection line.
2. the support plate that comprises multi-layer internal connection line as claimed in claim 1 is characterized in that: wherein the subregion adhered to of this essence be at support plate outer peripheral areas, in support plate, be spot distribution or in support plate, distribute as net shape.
3. manufacturing approach that comprises the support plate of multi-layer internal connection line is characterized in that: comprise following steps:
One support plate is provided; And
Form a multi-layer internal connection line on this support plate; Wherein between this multi-layer internal connection line and this support plate only in the subregion essence adhere to; In the zone that essence is adhered to; This multi-layer internal connection line directly contacts with support plate, and the interface adhesive force that adheres to the zone that makes that this essence is adhered to through the constituency is different from all the other zones, and it is to utilize the primary characteristic on support plate surface or utilize the mode that promotes surface energy to reach that the constituency is adhered to; The zone of adhering to support plate essence on this multi-layer internal connection line is a zone of removing to be cut, and this zone of removing to be cut only is arranged on this multi-layer internal connection line.
4. the manufacturing approach that comprises the support plate of multi-layer internal connection line as claimed in claim 3 is characterized in that: the subregion that this essence is adhered to be at support plate outer peripheral areas, in support plate, be spot distribution or in support plate, distribute as net shape.
5. electron element packaging method is characterized in that: comprise following steps:
Provide claim 1 a described support plate that comprises multi-layer internal connection line;
Be electrically connected at least one electronic component and comprise the support plate of multi-layer internal connection line to this;
Sealing is on this electronic component; And
Cut this multi-layer internal connection line, the feasible multi-layer internal connection line that is packaged with electronic component and this support plate natural separation that cuts down.
6. electron element packaging method as claimed in claim 5 is characterized in that: this electronic component is arranged at the zone of not adhering to support plate essence on this multi-layer internal connection line.
7. electron element packaging method as claimed in claim 6; It is characterized in that: cut this multi-layer internal connection line and be meant: the zone of adhering to support plate essence on this multi-layer internal connection line is removed in cutting, makes not the multi-layer internal connection line that is packaged with electronic component and this support plate natural separation of adhering to support plate essence.
8. electron element packaging method is characterized in that: comprise following steps:
A support plate that comprises multi-layer internal connection line as claimed in claim 1 is provided;
Cut this multi-layer internal connection line, feasible multi-layer internal connection line and this support plate natural separation that cuts down;
Be electrically connected at least one electronic component to this multi-layer internal connection line; And
Sealing is on this electronic component.
9. electron element packaging method as claimed in claim 8 is characterized in that: this electronic component is arranged at the zone of not adhering to support plate essence on this multi-layer internal connection line.
10. support plate recovery method is characterized in that: comprise:
One support plate that comprises multi-layer internal connection line as claimed in claim 1 is provided;
Cut this multi-layer internal connection line, feasible multi-layer internal connection line and this support plate natural separation that cuts down; And
This remaining on this support plate multi-layer internal connection line is removed and this support plate recovery is reused again from this support plate.
11. support plate recovery method as claimed in claim 10 is characterized in that: this removes step and is to use sulfuric acid and mixed solution of hydrogen peroxide, carries out this remaining on support plate multi-layer internal connection line is removed from this support plate with lapping mode or with the mode of tearing off.
12. support plate recovery method as claimed in claim 10 is characterized in that: this removes step is that the zone of adhering to support plate essence on this multi-layer internal connection line is removed.
13. the manufacturing approach of a multiple layer inner connection line apparatus is characterized in that: comprise following steps:
One support plate is provided;
On this support plate, form a multi-layer internal connection line; Wherein between this multi-layer internal connection line and this support plate only in the subregion essence adhere to; In the zone that essence is adhered to; This multi-layer internal connection line directly contacts with support plate, and the interface adhesive force that adheres to the zone that makes that this essence is adhered to through the constituency is different from all the other zones, and it is to utilize the primary characteristic on support plate surface or utilize the mode that promotes surface energy to reach that the constituency is adhered to; And
Cut this multi-layer internal connection line, and only be cut to the support plate surface, feasible multi-layer internal connection line and this support plate natural separation that cuts down.
14. the manufacturing approach of multiple layer inner connection line apparatus as claimed in claim 13 is characterized in that: wherein the subregion adhered to of this essence be at support plate outer peripheral areas, in support plate, be spot distribution or in support plate, distribute as net shape.
15. the manufacturing approach of multiple layer inner connection line apparatus as claimed in claim 13; It is characterized in that: cut this multi-layer internal connection line and be meant: the zone of adhering to support plate essence on this multi-layer internal connection line is removed in cutting, makes not multi-layer internal connection line and this support plate natural separation of adhering to support plate essence.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610005788 CN1996582B (en) | 2006-01-06 | 2006-01-06 | Carrier board comprising multilayer interconnect structure and methods of manufacture, recycling and application thereof |
| HK07114167.1A HK1108973A1 (en) | 2006-01-06 | 2007-12-27 | Substrate with multi-layer interconnection structure and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610005788 CN1996582B (en) | 2006-01-06 | 2006-01-06 | Carrier board comprising multilayer interconnect structure and methods of manufacture, recycling and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1996582A CN1996582A (en) | 2007-07-11 |
| CN1996582B true CN1996582B (en) | 2012-02-15 |
Family
ID=38251597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610005788 Expired - Fee Related CN1996582B (en) | 2006-01-06 | 2006-01-06 | Carrier board comprising multilayer interconnect structure and methods of manufacture, recycling and application thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN1996582B (en) |
| HK (1) | HK1108973A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI337059B (en) | 2007-06-22 | 2011-02-01 | Princo Corp | Multi-layer substrate and manufacture method thereof |
| WO2009006762A1 (en) * | 2007-07-12 | 2009-01-15 | Princo Corp. | Multilayer substrate and fabricating method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1528009A (en) * | 2001-04-13 | 2004-09-08 | ����ԭ����ίԱ�� | Removable substrate or structure and method for its production |
-
2006
- 2006-01-06 CN CN 200610005788 patent/CN1996582B/en not_active Expired - Fee Related
-
2007
- 2007-12-27 HK HK07114167.1A patent/HK1108973A1/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1528009A (en) * | 2001-04-13 | 2004-09-08 | ����ԭ����ίԱ�� | Removable substrate or structure and method for its production |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2002-9202A 2002.01.11 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1996582A (en) | 2007-07-11 |
| HK1108973A1 (en) | 2008-05-23 |
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