[go: up one dir, main page]

HK1098877A1 - Micropin heat exchanger - Google Patents

Micropin heat exchanger

Info

Publication number
HK1098877A1
HK1098877A1 HK07106354.0A HK07106354A HK1098877A1 HK 1098877 A1 HK1098877 A1 HK 1098877A1 HK 07106354 A HK07106354 A HK 07106354A HK 1098877 A1 HK1098877 A1 HK 1098877A1
Authority
HK
Hong Kong
Prior art keywords
micropin
heat exchanger
exchanger
heat
micropin heat
Prior art date
Application number
HK07106354.0A
Other languages
English (en)
Inventor
Ravi Prasher
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of HK1098877A1 publication Critical patent/HK1098877A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
HK07106354.0A 2003-11-13 2007-06-13 Micropin heat exchanger HK1098877A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/713,236 US7365980B2 (en) 2003-11-13 2003-11-13 Micropin heat exchanger
PCT/US2004/036823 WO2005050737A1 (en) 2003-11-13 2004-11-05 Micropin heat exchanger

Publications (1)

Publication Number Publication Date
HK1098877A1 true HK1098877A1 (en) 2007-07-27

Family

ID=34573665

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07106354.0A HK1098877A1 (en) 2003-11-13 2007-06-13 Micropin heat exchanger

Country Status (7)

Country Link
US (2) US7365980B2 (zh)
KR (1) KR100830253B1 (zh)
CN (1) CN100477181C (zh)
DE (1) DE112004002172T5 (zh)
HK (1) HK1098877A1 (zh)
TW (1) TWI301744B (zh)
WO (1) WO2005050737A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7365980B2 (en) * 2003-11-13 2008-04-29 Intel Corporation Micropin heat exchanger
US7612370B2 (en) * 2003-12-31 2009-11-03 Intel Corporation Thermal interface
JP2007294891A (ja) * 2006-03-30 2007-11-08 Dowa Metaltech Kk 放熱器
US8143719B2 (en) * 2007-06-07 2012-03-27 United Test And Assembly Center Ltd. Vented die and package
US20090077553A1 (en) * 2007-09-13 2009-03-19 Jian Tang Parallel processing of platform level changes during system quiesce
WO2010059879A2 (en) * 2008-11-20 2010-05-27 Cyanto Corporation Heat exchanger apparatus and methods of manufacturing cross reference
US20120211199A1 (en) * 2011-02-22 2012-08-23 Gerald Ho Kim Silicon-Based Cooling Package with Diamond Coating for Heat-Generating Devices
US9713284B2 (en) 2015-07-15 2017-07-18 Hong Kong Applied Science And Technology Research Institute Co. Ltd. Locally enhanced direct liquid cooling system for high power applications

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6487118A (en) 1987-05-21 1989-03-31 Komatsu Mfg Co Ltd Manufacture of micropin fin for heat exchanger and tool for machining said micropin fin
CA2053055C (en) * 1990-10-11 1997-02-25 Tsukasa Mizuno Liquid cooling system for lsi packages
US5158136A (en) 1991-11-12 1992-10-27 At&T Laboratories Pin fin heat sink including flow enhancement
US5344795A (en) * 1992-09-22 1994-09-06 Microelectronics And Computer Technology Corporation Method for encapsulating an integrated circuit using a removable heatsink support block
JPH07211832A (ja) * 1994-01-03 1995-08-11 Motorola Inc 電力放散装置とその製造方法
US5852548A (en) * 1994-09-09 1998-12-22 Northrop Grumman Corporation Enhanced heat transfer in printed circuit boards and electronic components thereof
JP2573809B2 (ja) * 1994-09-29 1997-01-22 九州日本電気株式会社 電子部品内蔵のマルチチップモジュール
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
JP3090954B2 (ja) * 1996-01-04 2000-09-25 ダイムラークライスラー アクチエンゲゼルシャフト ピンを備えた冷却部材
US5796049A (en) * 1997-04-04 1998-08-18 Sundstrand Corporation Electronics mounting plate with heat exchanger and method for manufacturing same
CN2349672Y (zh) * 1998-11-26 1999-11-17 官有莹 晶片冷却循环系统装置
CN1148627C (zh) * 1999-04-08 2004-05-05 富准精密工业(深圳)有限公司 电脑芯片散热装置及其制造方法
US6244331B1 (en) * 1999-10-22 2001-06-12 Intel Corporation Heatsink with integrated blower for improved heat transfer
US6729383B1 (en) * 1999-12-16 2004-05-04 The United States Of America As Represented By The Secretary Of The Navy Fluid-cooled heat sink with turbulence-enhancing support pins
CN2447939Y (zh) * 2000-09-25 2001-09-12 万在工业股份有限公司 铝铜焊接式散热器
US6578626B1 (en) * 2000-11-21 2003-06-17 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US6653730B2 (en) * 2000-12-14 2003-11-25 Intel Corporation Electronic assembly with high capacity thermal interface
KR100778913B1 (ko) 2001-05-21 2007-11-22 앰코 테크놀로지 코리아 주식회사 냉매를 방열재로 사용한 반도체 패키지
DE10159860C2 (de) * 2001-12-06 2003-12-04 Sdk Technik Gmbh Wärmeübertragungsfläche mit einer aufgalvanisierten Mikrostruktur von Vorsprüngen
US6679315B2 (en) * 2002-01-14 2004-01-20 Marconi Communications, Inc. Small scale chip cooler assembly
KR20030068633A (ko) 2002-02-15 2003-08-25 이엠씨테크(주) 열전소자를 이용한 집적회로 냉각장치
US6986382B2 (en) * 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US20040112571A1 (en) * 2002-11-01 2004-06-17 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US7000684B2 (en) * 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US6771508B1 (en) * 2003-02-14 2004-08-03 Intel Corporation Method and apparatus for cooling an electronic component
US6820684B1 (en) * 2003-06-26 2004-11-23 International Business Machines Corporation Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader
US7365980B2 (en) 2003-11-13 2008-04-29 Intel Corporation Micropin heat exchanger

Also Published As

Publication number Publication date
KR20060085956A (ko) 2006-07-28
WO2005050737A1 (en) 2005-06-02
CN1879214A (zh) 2006-12-13
US7365980B2 (en) 2008-04-29
US7498672B2 (en) 2009-03-03
US20050104200A1 (en) 2005-05-19
KR100830253B1 (ko) 2008-05-19
DE112004002172T5 (de) 2006-09-14
US20050105272A1 (en) 2005-05-19
CN100477181C (zh) 2009-04-08
TWI301744B (en) 2008-10-01
TW200520675A (en) 2005-06-16

Similar Documents

Publication Publication Date Title
GB2424473B (en) Heat exchanger
AU2003245261A8 (en) Improved heat exchanger
GB2407151B (en) Heat exchanging element
IL162709A0 (en) Heat exchanger
EP1751486A4 (en) HEAT EXCHANGER
EP1654511A4 (en) Heat Exchanger
GB0703282D0 (en) Heat exchanger
GB2405195B (en) Heat exchanger
GB0508398D0 (en) Heat exchanger
GB2401676B (en) Heat exchanger
HK1098877A1 (en) Micropin heat exchanger
GB2421071B (en) Heat exchanger
AU2003246078A8 (en) Heat exchanger
EP1688693A4 (en) COUNTERFLOW heat exchanger
EP1710528A4 (en) Heat Exchanger
GB2417315B (en) Heat exchanging element
AU2003239714A8 (en) Heat exchanger
EP1605221A4 (en) HEAT EXCHANGER
GB0210794D0 (en) Heat exchangers
GB2394037B (en) Heat exchangers
GB0718113D0 (en) Heat exchanger
GB2404727B (en) Heat exchanger
GB0425781D0 (en) Improved heat exchanger
GB0400770D0 (en) Heat exchanger
PL362327A1 (en) Heat exchanger

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20131105