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HK1084423A1 - Device and method for electrolytically treating electrically insulated structures - Google Patents

Device and method for electrolytically treating electrically insulated structures

Info

Publication number
HK1084423A1
HK1084423A1 HK06106798A HK06106798A HK1084423A1 HK 1084423 A1 HK1084423 A1 HK 1084423A1 HK 06106798 A HK06106798 A HK 06106798A HK 06106798 A HK06106798 A HK 06106798A HK 1084423 A1 HK1084423 A1 HK 1084423A1
Authority
HK
Hong Kong
Prior art keywords
electrically insulated
contact
electrolytically treating
insulated structures
conducting structures
Prior art date
Application number
HK06106798A
Other languages
English (en)
Inventor
Michael Guggemos
Franz Kohnle
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1084423A1 publication Critical patent/HK1084423A1/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0621In horizontal cells
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005Contacting devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Processes Specially Adapted For Manufacturing Cables (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Electrolytic Production Of Metals (AREA)
HK06106798A 2003-09-12 2006-06-14 Device and method for electrolytically treating electrically insulated structures HK1084423A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10342512A DE10342512B3 (de) 2003-09-12 2003-09-12 Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
PCT/EP2004/009436 WO2005026415A1 (en) 2003-09-12 2004-08-19 Device and method for electrolytically treating electrically insulated structures

Publications (1)

Publication Number Publication Date
HK1084423A1 true HK1084423A1 (en) 2006-07-28

Family

ID=33039358

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06106798A HK1084423A1 (en) 2003-09-12 2006-06-14 Device and method for electrolytically treating electrically insulated structures

Country Status (13)

Country Link
US (1) US20060201817A1 (xx)
EP (1) EP1664390B1 (xx)
JP (1) JP4474414B2 (xx)
KR (1) KR101076947B1 (xx)
CN (1) CN1849415A (xx)
AT (1) ATE350514T1 (xx)
BR (1) BRPI0413715B1 (xx)
CA (1) CA2532451A1 (xx)
DE (2) DE10342512B3 (xx)
HK (1) HK1084423A1 (xx)
MX (1) MXPA06002649A (xx)
TW (1) TWI336358B (xx)
WO (1) WO2005026415A1 (xx)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4862513B2 (ja) * 2005-06-23 2012-01-25 東レ株式会社 給電用ローラならびに電解めっき被膜付きフィルムの製造装置および方法
DE102005031948B3 (de) * 2005-07-08 2006-06-14 Höllmüller Maschinenbau GmbH Vorrichtungen und Verfahren zur elektrolytischen Behandlung von Folien von Rolle zu Rolle
EP1919703B1 (en) 2005-08-12 2013-04-24 Modumetal, LLC Compositionally modulated composite materials and methods for making the same
CA2649786A1 (en) * 2006-04-18 2007-10-25 Basf Se Electroplating device and method
US20090178930A1 (en) * 2006-04-18 2009-07-16 Basf Se Electroplating device and method
DE102006033353B4 (de) * 2006-07-19 2010-11-18 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zum Behandeln von flachen, zerbrechlichen Substraten
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
DE102008004592A1 (de) 2008-01-16 2009-07-23 Danziger, Manfred, Dr. Bandgalvanikanlage zur elektrochemischen Verstärkung einer elektrisch leitfähigen äußeren Schicht eines Bandes
JP2009249659A (ja) * 2008-04-02 2009-10-29 Nippon Mektron Ltd 電気めっき装置及び電気めっき方法
US20100264035A1 (en) * 2009-04-15 2010-10-21 Solopower, Inc. Reel-to-reel plating of conductive grids for flexible thin film solar cells
DE102009022337A1 (de) * 2009-05-13 2010-11-18 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Behandlung eines Substrats
EA029168B1 (ru) 2009-06-08 2018-02-28 Модьюметал, Инк. Электроосажденное наноламинатное покрытие и оболочка для защиты от коррозии
US8377267B2 (en) * 2009-09-30 2013-02-19 National Semiconductor Corporation Foil plating for semiconductor packaging
CN102383159A (zh) * 2011-08-09 2012-03-21 长春一汽富维高新汽车饰件有限公司 粗化生产与三价铬电解工艺合并的装置及方法
EP2626144A1 (en) * 2012-02-07 2013-08-14 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Roll to roll manufacturing system having a clean room deposition zone and a separate processing zone
BR112015022020A8 (pt) 2013-03-15 2019-12-10 Modumetal Inc objeto ou revestimento e seu processo de fabricação
WO2014146117A2 (en) 2013-03-15 2014-09-18 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
WO2014145771A1 (en) 2013-03-15 2014-09-18 Modumetal, Inc. Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes
CA2905548C (en) 2013-03-15 2022-04-26 Modumetal, Inc. Nanolaminate coatings
US10472727B2 (en) 2013-03-15 2019-11-12 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
MX373825B (es) * 2013-08-22 2025-03-04 Ashworth Bros Inc Sistema y método para electropulir o electrochapar bandas transportadoras.
CN104195611B (zh) * 2014-08-15 2016-09-14 洛阳弘洋机械有限公司 一种棒料连续镀铬生产线
WO2016044712A1 (en) 2014-09-18 2016-03-24 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
EP3194642A4 (en) 2014-09-18 2018-07-04 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CN104928738B (zh) * 2015-05-21 2017-04-19 中国科学院山西煤炭化学研究所 一种碳纤维丝束的连续电镀金属方法及装置
CN105177660B (zh) * 2015-10-09 2017-11-21 华晶精密制造股份有限公司 一种金刚石切割线生产用水平上砂装置
US11365488B2 (en) 2016-09-08 2022-06-21 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
US12227869B2 (en) 2016-09-09 2025-02-18 Modumetal, Inc. Application of laminate and nanolaminate materials to tooling and molding processes
EA201990716A1 (ru) 2016-09-14 2019-10-31 Система для надежного, высокопроизводительного генерирования сложного электрического поля и способ получения покрытий с ней
WO2018085591A1 (en) 2016-11-02 2018-05-11 Modumetal, Inc. Topology optimized high interface packing structures
US11293272B2 (en) 2017-03-24 2022-04-05 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
CN110770372B (zh) 2017-04-21 2022-10-11 莫杜美拓有限公司 具有电沉积涂层的管状制品及其生产系统和方法
US11214884B2 (en) * 2017-07-11 2022-01-04 University Of South Florida Electrochemical three-dimensional printing and soldering
CN107523831B (zh) * 2017-09-30 2019-01-18 江阴康强电子有限公司 粗化浸镀子槽
US11519093B2 (en) 2018-04-27 2022-12-06 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN108950622B (zh) * 2018-08-28 2020-07-21 温州杰锐电子科技有限公司 一种电刷镀装置
US10807823B2 (en) * 2019-02-01 2020-10-20 Assa Abloy Ab Card stacker
CN112249702A (zh) * 2019-07-22 2021-01-22 艾里亚设计股分有限公司 导引辊装置
US11713514B2 (en) * 2019-08-08 2023-08-01 Hutchinson Technology Incorporated Systems for electroplating and methods of use thereof
CN112111775B (zh) * 2020-08-15 2023-02-03 智兴(上海)五金有限公司 一种导线快速氧化处理系统

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3535222A (en) * 1964-02-04 1970-10-20 Aluminium Lab Ltd Apparatus for continuous electrolytic treatment
GB1055001A (xx) * 1964-02-04
US4282073A (en) * 1979-08-22 1981-08-04 Thomas Steel Strip Corporation Electro-co-deposition of corrosion resistant nickel/zinc alloys onto steel substrates
US4324633A (en) * 1980-10-20 1982-04-13 Lovejoy Curtis N Electrolytic apparatus for treating continuous strip material
US4401523A (en) * 1980-12-18 1983-08-30 Republic Steel Corporation Apparatus and method for plating metallic strip
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
US4560445A (en) * 1984-12-24 1985-12-24 Polyonics Corporation Continuous process for fabricating metallic patterns on a thin film substrate
FR2653787B1 (fr) 1989-10-27 1992-02-14 Lorraine Laminage Installation et procede de revetement electrolytique d'une bande metallique.
DE4229403C2 (de) * 1992-09-03 1995-04-13 Hoellmueller Maschbau H Vorrichtung zum Galvanisieren dünner, ein- oder beidseits mit einer leitfähigen Beschichtung versehener Kunststoffolien
DE19612555C2 (de) * 1996-03-29 1998-03-19 Atotech Deutschland Gmbh Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens
DE19717512C3 (de) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
DE19951325C2 (de) * 1999-10-20 2003-06-26 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von elektrisch isolierendem Folienmaterial sowie Anwendungen des Verfahrens
DE10043814C1 (de) * 2000-09-06 2002-04-11 Egon Huebel Verfahren und Vorrichtungen zum elektrochemischen Behandeln von Gut
DE10065643C2 (de) * 2000-12-29 2003-03-20 Egon Huebel Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut
DE10065649C2 (de) * 2000-12-29 2003-03-20 Egon Huebel Vorrichtung und Verfahren zum elektrochemischen Behandeln von elektrisch leitfähigen Bändern
WO2003038158A2 (de) * 2001-10-25 2003-05-08 Infineon Technologies Ag Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen

Also Published As

Publication number Publication date
JP4474414B2 (ja) 2010-06-02
TW200510577A (en) 2005-03-16
BRPI0413715B1 (pt) 2013-09-17
KR20060058116A (ko) 2006-05-29
CA2532451A1 (en) 2005-03-24
CN1849415A (zh) 2006-10-18
DE602004004164T2 (de) 2007-10-11
MXPA06002649A (es) 2006-06-06
EP1664390A1 (en) 2006-06-07
ATE350514T1 (de) 2007-01-15
US20060201817A1 (en) 2006-09-14
BRPI0413715A (pt) 2006-10-17
DE10342512B3 (de) 2004-10-28
KR101076947B1 (ko) 2011-10-26
EP1664390B1 (en) 2007-01-03
WO2005026415A1 (en) 2005-03-24
JP2007505213A (ja) 2007-03-08
DE602004004164D1 (de) 2007-02-15
TWI336358B (en) 2011-01-21

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150819