GB998204A - Thermoelements used for producing a thermoelectric cooling or heating effect - Google Patents
Thermoelements used for producing a thermoelectric cooling or heating effectInfo
- Publication number
- GB998204A GB998204A GB38087/61A GB3808761A GB998204A GB 998204 A GB998204 A GB 998204A GB 38087/61 A GB38087/61 A GB 38087/61A GB 3808761 A GB3808761 A GB 3808761A GB 998204 A GB998204 A GB 998204A
- Authority
- GB
- United Kingdom
- Prior art keywords
- sectional area
- intermetallic compound
- thermoelements
- producing
- heating effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 title abstract 2
- 238000010438 heat treatment Methods 0.000 title abstract 2
- 229910000765 intermetallic Inorganic materials 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 230000002787 reinforcement Effects 0.000 abstract 1
- 229920002050 silicone resin Polymers 0.000 abstract 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
998,204. Thermo-electric devices. SANYO ELECTRIC CO. Ltd. Oct. 24, 1961 [Nov. 5, 1960; Dec. 26, 1960], No. 38087/61. Heading H1K. An intermetallic compound thermoelectric element adapted to conduct current between two opposite faces is provided with a blind or open hole in faces other than the said opposite faces, to reduce the cross-sectional area for current flow in the intermediate portion. The relative reduction of the effective sectional area saves material and if the ratio of the effective sectional area to the length of the element remains unchanged loss of efficiency for heating and cooling is avoided. In Fig. 2c and 2a, rectangular holes 24 and 25 penetrate a block of intermetallic compound such as Bi-Te-Se or Bi-Te-Sb. Surfaces 22 and 23 constitute the hot and cold junctions. The holes may be filled with epoxy resin, silicone resin or phenolic resin to act as reinforcement and an outer hoop 47 (Fig. 4) of this material may be provided to strengthen the element.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4464960 | 1960-11-05 | ||
JP5122160 | 1960-12-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB998204A true GB998204A (en) | 1965-07-14 |
Family
ID=26384597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB38087/61A Expired GB998204A (en) | 1960-11-05 | 1961-10-24 | Thermoelements used for producing a thermoelectric cooling or heating effect |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE1277398B (en) |
GB (1) | GB998204A (en) |
NL (1) | NL270854A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010049300A1 (en) * | 2010-10-22 | 2012-04-26 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Semiconductor elements consisting of thermoelectric material for use in a thermoelectric module |
WO2013006246A1 (en) * | 2011-07-07 | 2013-01-10 | Corning Incorporated | A thermoelectric element design |
CN109841723A (en) * | 2017-11-25 | 2019-06-04 | 成志华 | A kind of thermoelectric mechanism |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1026339B (en) * | 1955-12-30 | 1958-03-20 | Alfred Mattes Dipl Ing | Arrangement to utilize the Peltier or Seebeck effect |
-
0
- NL NL270854D patent/NL270854A/xx unknown
-
1961
- 1961-10-24 GB GB38087/61A patent/GB998204A/en not_active Expired
- 1961-11-02 DE DES76529A patent/DE1277398B/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010049300A1 (en) * | 2010-10-22 | 2012-04-26 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Semiconductor elements consisting of thermoelectric material for use in a thermoelectric module |
WO2012052393A3 (en) * | 2010-10-22 | 2012-08-30 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Semi-conductor elements made of thermoelectric material for use in a thermoelectric module |
WO2013006246A1 (en) * | 2011-07-07 | 2013-01-10 | Corning Incorporated | A thermoelectric element design |
CN109841723A (en) * | 2017-11-25 | 2019-06-04 | 成志华 | A kind of thermoelectric mechanism |
Also Published As
Publication number | Publication date |
---|---|
NL270854A (en) | |
DE1277398B (en) | 1968-09-12 |
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