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GB993707A - A method of and means for making through connections in circuit boards - Google Patents

A method of and means for making through connections in circuit boards

Info

Publication number
GB993707A
GB993707A GB784463A GB784463A GB993707A GB 993707 A GB993707 A GB 993707A GB 784463 A GB784463 A GB 784463A GB 784463 A GB784463 A GB 784463A GB 993707 A GB993707 A GB 993707A
Authority
GB
United Kingdom
Prior art keywords
board
hole
making
circuit boards
connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB784463A
Inventor
Eric Arthur Greasley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pressac Ltd
Original Assignee
Pressac Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pressac Ltd filed Critical Pressac Ltd
Priority to GB784463A priority Critical patent/GB993707A/en
Publication of GB993707A publication Critical patent/GB993707A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

993,707. Forming sockets in circuit boards; punches. PRESSAC Ltd. Feb. 27, 1964 [Feb. 27, 1963], No. 7844/63. Headings B3A and B3W. [Also in Division H2] A method of making a " through-connection" in a printed circuit board consists in punching a hole in the board 2 by means of a punch 5 having a reduced diameter at its leading end 5a which first indents the board, then breaks away a piece of the board which is discharged through a die aperture 4, and finally imparts a circular shape to the hole in the board and wipes the edge of the pierced hole in the copper 3 into and flush with the edge of the hole formed in the board.
GB784463A 1963-02-27 1963-02-27 A method of and means for making through connections in circuit boards Expired GB993707A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB784463A GB993707A (en) 1963-02-27 1963-02-27 A method of and means for making through connections in circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB784463A GB993707A (en) 1963-02-27 1963-02-27 A method of and means for making through connections in circuit boards

Publications (1)

Publication Number Publication Date
GB993707A true GB993707A (en) 1965-06-02

Family

ID=9840875

Family Applications (1)

Application Number Title Priority Date Filing Date
GB784463A Expired GB993707A (en) 1963-02-27 1963-02-27 A method of and means for making through connections in circuit boards

Country Status (1)

Country Link
GB (1) GB993707A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2245519A (en) * 1990-06-26 1992-01-08 Nippon Cmk Kk Perforating printed circuit boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2245519A (en) * 1990-06-26 1992-01-08 Nippon Cmk Kk Perforating printed circuit boards
GB2245519B (en) * 1990-06-26 1994-04-06 Nippon Cmk Kk Method for forming perforations in a printed wiring board

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