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GB1087604A - Interconnection methods for printed circuit boards - Google Patents

Interconnection methods for printed circuit boards

Info

Publication number
GB1087604A
GB1087604A GB2069065A GB2069065A GB1087604A GB 1087604 A GB1087604 A GB 1087604A GB 2069065 A GB2069065 A GB 2069065A GB 2069065 A GB2069065 A GB 2069065A GB 1087604 A GB1087604 A GB 1087604A
Authority
GB
United Kingdom
Prior art keywords
panel
tool
insert
printed circuit
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2069065A
Inventor
George Ellwood
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB2069065A priority Critical patent/GB1087604A/en
Publication of GB1087604A publication Critical patent/GB1087604A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

1,087,604. Connecting-pieces. STANDARD TELEPHONES & CABLES Ltd. May 13, 1966 [May 17, 1965], No. 20690/65. Heading H2E. [Also in Division B3] Electrical connection between circuitry 7 and 8, printed on opposite faces of a panel 3, is made by an insert pin 1 which is punched into the panel by a press tool 5. The insert 1 forms the cutting tip of the punch 2 of the tool 5 and during its insertion the panel 3 is gripped between the tool 5 and an aligned die 4, the insert 1 is punched into the panel, to blank out a portion 6, and remains embedded in it after removal of the tool and die. This method of connection may be used in logic matrices (Fig. 5, not shown) which comprise two orthogonal sets of conductors (7 and 8) printed on opposite faces of a panel (3), the inserts (1) being cut from a wire and their positioning in the panel being automatically controlled. The insert pins may be hollow or solid and of any cross-section.
GB2069065A 1966-05-17 1966-05-17 Interconnection methods for printed circuit boards Expired GB1087604A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2069065A GB1087604A (en) 1966-05-17 1966-05-17 Interconnection methods for printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2069065A GB1087604A (en) 1966-05-17 1966-05-17 Interconnection methods for printed circuit boards

Publications (1)

Publication Number Publication Date
GB1087604A true GB1087604A (en) 1967-10-18

Family

ID=10150061

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2069065A Expired GB1087604A (en) 1966-05-17 1966-05-17 Interconnection methods for printed circuit boards

Country Status (1)

Country Link
GB (1) GB1087604A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0363074A2 (en) * 1988-10-06 1990-04-11 Telco International Ltd., Circuit board manufacture

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0363074A2 (en) * 1988-10-06 1990-04-11 Telco International Ltd., Circuit board manufacture
EP0363074A3 (en) * 1988-10-06 1990-12-05 Telco International Ltd., Circuit board manufacture
US5025553A (en) * 1988-10-06 1991-06-25 Telco International, Ltd. Circuit board manufacture

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