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GB9927423D0 - Electronic circuit including capacitative sensing probe and improved methods of testing - Google Patents

Electronic circuit including capacitative sensing probe and improved methods of testing

Info

Publication number
GB9927423D0
GB9927423D0 GBGB9927423.5A GB9927423A GB9927423D0 GB 9927423 D0 GB9927423 D0 GB 9927423D0 GB 9927423 A GB9927423 A GB 9927423A GB 9927423 D0 GB9927423 D0 GB 9927423D0
Authority
GB
United Kingdom
Prior art keywords
testing
electronic circuit
circuit including
improved methods
sensing probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9927423.5A
Other versions
GB2353401A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3Com Corp
Original Assignee
3Com Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3Com Corp filed Critical 3Com Corp
Publication of GB9927423D0 publication Critical patent/GB9927423D0/en
Publication of GB2353401A publication Critical patent/GB2353401A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
GB9927423A 1999-08-20 1999-11-20 An integrated circuit package incorporating a capacitive sensor probe Withdrawn GB2353401A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9919626A GB2353399A (en) 1999-08-20 1999-08-20 Testing printed or integrated circuits

Publications (2)

Publication Number Publication Date
GB9927423D0 true GB9927423D0 (en) 2000-01-19
GB2353401A GB2353401A (en) 2001-02-21

Family

ID=10859423

Family Applications (3)

Application Number Title Priority Date Filing Date
GB9919626A Withdrawn GB2353399A (en) 1999-08-20 1999-08-20 Testing printed or integrated circuits
GB9927426A Withdrawn GB2353402A (en) 1999-08-20 1999-11-20 A semiconductor die structure incorporating a capacitive sensing probe
GB9927423A Withdrawn GB2353401A (en) 1999-08-20 1999-11-20 An integrated circuit package incorporating a capacitive sensor probe

Family Applications Before (2)

Application Number Title Priority Date Filing Date
GB9919626A Withdrawn GB2353399A (en) 1999-08-20 1999-08-20 Testing printed or integrated circuits
GB9927426A Withdrawn GB2353402A (en) 1999-08-20 1999-11-20 A semiconductor die structure incorporating a capacitive sensing probe

Country Status (1)

Country Link
GB (3) GB2353399A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6734681B2 (en) 2001-08-10 2004-05-11 James Sabey Apparatus and methods for testing circuit boards
EP1415166B1 (en) * 2001-08-10 2004-12-15 MANIA Entwicklungsgesellschaft mbH Apparatus and method for testing bare circuit boards
GB2402026B (en) 2003-05-20 2005-07-13 Micron Technology Inc System and method for balancing capactively coupled signal lines
GB2405215B (en) 2003-08-21 2005-09-28 Micron Technology Inc System and method for testing devices utilizing capacitively coupled signalling
US6933730B2 (en) 2003-10-09 2005-08-23 Agilent Technologies, Inc. Methods and apparatus for testing continuity of electrical paths through connectors of circuit assemblies
GB2407207B (en) 2003-10-13 2006-06-07 Micron Technology Inc Structure and method for forming a capacitively coupled chip-to-chip signalling interface
US7898413B2 (en) * 2007-01-25 2011-03-01 Verifone, Inc. Anti-tamper protected enclosure
US9013336B2 (en) 2008-01-22 2015-04-21 Verifone, Inc. Secured keypad devices
US8358218B2 (en) 2010-03-02 2013-01-22 Verifone, Inc. Point of sale terminal having enhanced security
US9691066B2 (en) 2012-07-03 2017-06-27 Verifone, Inc. Location-based payment system and method
US20160026275A1 (en) 2014-07-23 2016-01-28 Verifone, Inc. Data device including ofn functionality
US9595174B2 (en) 2015-04-21 2017-03-14 Verifone, Inc. Point of sale terminal having enhanced security
US10544923B1 (en) 2018-11-06 2020-01-28 Verifone, Inc. Devices and methods for optical-based tamper detection using variable light characteristics

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4229693A (en) * 1978-11-24 1980-10-21 Honeywell Information Systems Inc. Method and apparatus for capacitance testing printed circuit boards
US4565966A (en) * 1983-03-07 1986-01-21 Kollmorgen Technologies Corporation Method and apparatus for testing of electrical interconnection networks
US4815077A (en) * 1987-01-28 1989-03-21 Westinghouse Electric Corp. Test system for electronic devices with radio frequency signature extraction means
US5124660A (en) * 1990-12-20 1992-06-23 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US6087842A (en) * 1996-04-29 2000-07-11 Agilent Technologies Integrated or intrapackage capability for testing electrical continuity between an integrated circuit and other circuitry

Also Published As

Publication number Publication date
GB2353402A (en) 2001-02-21
GB9919626D0 (en) 1999-10-20
GB2353401A (en) 2001-02-21
GB9927426D0 (en) 2000-01-19
GB2353399A (en) 2001-02-21

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)