[go: up one dir, main page]

GB957639A - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number
GB957639A
GB957639A GB17435/62A GB1743562A GB957639A GB 957639 A GB957639 A GB 957639A GB 17435/62 A GB17435/62 A GB 17435/62A GB 1743562 A GB1743562 A GB 1743562A GB 957639 A GB957639 A GB 957639A
Authority
GB
United Kingdom
Prior art keywords
amount
semiconductor devices
platinum
balance
palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB17435/62A
Inventor
Bert Brenner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sigmund Cohn Corp
Original Assignee
Sigmund Cohn Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US102813A priority Critical patent/US3036251A/en
Application filed by Sigmund Cohn Corp filed Critical Sigmund Cohn Corp
Priority to GB17435/62A priority patent/GB957639A/en
Priority to FR897963A priority patent/FR1322073A/en
Publication of GB957639A publication Critical patent/GB957639A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01043—Technetium [Tc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Conductive Materials (AREA)
  • Contacts (AREA)

Abstract

An alloy includes one or more metals selected from the group consisting of tungsten in the amount 1-10%, molybdenum in the amount 1-20% and chromium in the amount 1-12%, the balance consisting essentially of palladium alone or palladium and platinum, the platinum being in an amount up to 50% of said balance, the amounts being on a weight basis. The alloy is formed into a spring contact of a semi-conductor diode.
GB17435/62A 1961-04-13 1962-05-07 Semiconductor devices Expired GB957639A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US102813A US3036251A (en) 1961-04-13 1961-04-13 Spring contact element for semiconductor diodes
GB17435/62A GB957639A (en) 1961-04-13 1962-05-07 Semiconductor devices
FR897963A FR1322073A (en) 1961-04-13 1962-05-18 Contact spring intended more particularly for semiconductor diodes, and diodes comprising such a spring

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US102813A US3036251A (en) 1961-04-13 1961-04-13 Spring contact element for semiconductor diodes
GB17435/62A GB957639A (en) 1961-04-13 1962-05-07 Semiconductor devices
FR897963A FR1322073A (en) 1961-04-13 1962-05-18 Contact spring intended more particularly for semiconductor diodes, and diodes comprising such a spring

Publications (1)

Publication Number Publication Date
GB957639A true GB957639A (en) 1964-05-06

Family

ID=27246578

Family Applications (1)

Application Number Title Priority Date Filing Date
GB17435/62A Expired GB957639A (en) 1961-04-13 1962-05-07 Semiconductor devices

Country Status (3)

Country Link
US (1) US3036251A (en)
FR (1) FR1322073A (en)
GB (1) GB957639A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2484865A1 (en) * 1980-06-18 1981-12-24 United Technologies Corp NOBLE-CHROME METAL ALLOY CATALYST

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3243670A (en) * 1963-09-30 1966-03-29 Int Standard Electric Corp Mountings for semiconductor devices
US4810314A (en) * 1987-12-28 1989-03-07 The Standard Oil Company Enhanced corrosion resistant amorphous metal alloy coatings
US5236789A (en) * 1991-07-01 1993-08-17 Olin Corporation Palladium alloys having utility in electrical applications
US5139891A (en) * 1991-07-01 1992-08-18 Olin Corporation Palladium alloys having utility in electrical applications

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2438893A (en) * 1943-12-29 1948-04-06 Bell Telephone Labor Inc Translating device
US2824269A (en) * 1956-01-17 1958-02-18 Bell Telephone Labor Inc Silicon translating devices and silicon alloys therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2484865A1 (en) * 1980-06-18 1981-12-24 United Technologies Corp NOBLE-CHROME METAL ALLOY CATALYST

Also Published As

Publication number Publication date
FR1322073A (en) 1963-03-22
US3036251A (en) 1962-05-22

Similar Documents

Publication Publication Date Title
GB943860A (en) Semi-conductor device
JPS5424265B2 (en)
ES330445A1 (en) Procedure to improve the characteristics of a nickel alloy. (Machine-translation by Google Translate, not legally binding)
GB846744A (en) Improvements in or relating to the production of semi-conductor devices
GB983840A (en) A gallium arsenide semiconductor device having at least one rectifying contact formed by alloying
GB903679A (en) Improvements in and relating to chromium base alloys
GB901239A (en) A semi-conductor device
GB957639A (en) Semiconductor devices
GB918393A (en) Improvements in or relating to silicon carbide semi-conductor devices
GB816397A (en) Contact making device for use in electrical circuits
GB968198A (en) Improvements in and relating to semi-conductors
GB973990A (en) Improvements in or relating to methods of providing contacts on semiconductor ceramic bodies of n-type oxidic material
GB1082023A (en) Thermocouple
GB966594A (en) Improvements in or relating to methods of manufacturing semiconductor devices
NL224227A (en)
GB1065880A (en) Improvements in or relating to silicon diodes
GB894255A (en) Semiconductor devices and method of manufacturing them
GB887208A (en) Improvements in or relating to semiconductor devices
GB996295A (en) Improvements in or relating to methods of manufacturing silicon semi conductor devices
DK105400C (en) Process for the preparation of dimeric 1,4-bis- (cyclopentadienyl) -butene-2.
GB910063A (en) Semi-conductor devices
GB843350A (en) Improvements in or relating to producing semi-conducting devices
GB873803A (en) Improvements in or relating to semi-conductor devices
GB763927A (en) Improvements in or relating to point contact semi-conductor translating devices
GB916346A (en) Improvements in or relating to semiconductor diodes