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GB902318A - A method of producing an assembly comprising a semi-conductor device and a cooling member for the device - Google Patents

A method of producing an assembly comprising a semi-conductor device and a cooling member for the device

Info

Publication number
GB902318A
GB902318A GB3911260A GB3911260A GB902318A GB 902318 A GB902318 A GB 902318A GB 3911260 A GB3911260 A GB 3911260A GB 3911260 A GB3911260 A GB 3911260A GB 902318 A GB902318 A GB 902318A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor
bearing surfaces
block
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3911260A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of GB902318A publication Critical patent/GB902318A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

902,318. Semi-conductor devices. SIEMENSSCHUCKERTWERKE A.G. Nov. 14, 1960 [Nov. 13, 1959], No. 39112/60. Class 37. In a method of producing a semi-conductor assembly, bearing surfaces of a semi-conductor device and a heat-conducting member are accurately matched by superfine working, at least one of the bearing surfaces is roughened and the device is detachably secured to the heatconducting member so that the bearing surfaces are in heat-conducting contact at many points distributed over the entire bearing surface of the device. As shown, a plurality of parallelconnected rectifier cells are mounted in two rows on a cooling block 2 which may be watercooled, or air-cooled, in which case it is provided with fins 12. Each cell comprises a housing 3 of Cu &c. having a base 3a of relatively large diameter and containing a Mo carrier plate 5 on which is mounted a Si wafer 4 comprising a PN junction. A flexible lead 7 from an electrode 6 on the upper surface of the wafer passes out of the housing 3 through a glass seal 8. The upper face of the block 2 and the lower face of the base 3a are ground to a superfine finish; then the latter face is roughly lapped and clamped to the upper face of the block 2 by means of clamping bars 10 of, e.g. hard spring steel, clamping rings 11, and bolts 9. Alternatively, the roughening of the bearing surface may be effected by sandblasting, and the roughened surface may be coated with a medium having good thermal conductivity, such as silicone oil.
GB3911260A 1959-11-13 1960-11-14 A method of producing an assembly comprising a semi-conductor device and a cooling member for the device Expired GB902318A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES65815A DE1117776B (en) 1959-11-13 1959-11-13 Process for the production of a semiconductor cell with a releasably attached cooling block

Publications (1)

Publication Number Publication Date
GB902318A true GB902318A (en) 1962-08-01

Family

ID=7498326

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3911260A Expired GB902318A (en) 1959-11-13 1960-11-14 A method of producing an assembly comprising a semi-conductor device and a cooling member for the device

Country Status (3)

Country Link
CH (1) CH379644A (en)
DE (1) DE1117776B (en)
GB (1) GB902318A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012038102A1 (en) * 2010-09-24 2012-03-29 Siemens Aktiengesellschaft Subsea container electrical through connector

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012038102A1 (en) * 2010-09-24 2012-03-29 Siemens Aktiengesellschaft Subsea container electrical through connector
CN103109419A (en) * 2010-09-24 2013-05-15 西门子公司 Subsea container electrical through connector
RU2540269C2 (en) * 2010-09-24 2015-02-10 Сименс Акциенгезелльшафт Electrical through connector for underwater containers
US8968037B2 (en) 2010-09-24 2015-03-03 Siemens Aktiengesellschaft Subsea container electrical through connector
CN103109419B (en) * 2010-09-24 2015-08-05 西门子公司 Subsea container electrical through connector

Also Published As

Publication number Publication date
DE1117776B (en) 1961-11-23
CH379644A (en) 1964-07-15

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