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GB8709595D0 - Wafer handling arm - Google Patents

Wafer handling arm

Info

Publication number
GB8709595D0
GB8709595D0 GB878709595A GB8709595A GB8709595D0 GB 8709595 D0 GB8709595 D0 GB 8709595D0 GB 878709595 A GB878709595 A GB 878709595A GB 8709595 A GB8709595 A GB 8709595A GB 8709595 D0 GB8709595 D0 GB 8709595D0
Authority
GB
United Kingdom
Prior art keywords
wafer handling
handling arm
arm
wafer
handling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB878709595A
Other versions
GB2193482A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of GB8709595D0 publication Critical patent/GB8709595D0/en
Publication of GB2193482A publication Critical patent/GB2193482A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
GB08709595A 1986-04-28 1987-04-23 Wafer handling arm Withdrawn GB2193482A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US85674986A 1986-04-28 1986-04-28

Publications (2)

Publication Number Publication Date
GB8709595D0 true GB8709595D0 (en) 1987-05-28
GB2193482A GB2193482A (en) 1988-02-10

Family

ID=25324414

Family Applications (2)

Application Number Title Priority Date Filing Date
GB878709064A Pending GB8709064D0 (en) 1986-04-28 1987-04-15 Wafer handling arm
GB08709595A Withdrawn GB2193482A (en) 1986-04-28 1987-04-23 Wafer handling arm

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB878709064A Pending GB8709064D0 (en) 1986-04-28 1987-04-15 Wafer handling arm

Country Status (4)

Country Link
JP (1) JPS6342142A (en)
KR (1) KR880003395A (en)
DE (1) DE3714045A1 (en)
GB (2) GB8709064D0 (en)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3704505A1 (en) * 1987-02-13 1988-08-25 Leybold Ag INSERT UNIT FOR VACUUM SYSTEMS
DE3716549A1 (en) * 1987-05-17 1988-12-08 Leitz Ernst Gmbh HANDLING MACHINE FOR PLATE-SHAPED OBJECTS
DE3717628A1 (en) * 1987-05-26 1988-12-15 Loehr & Herrmann Gmbh DEVICE FOR INPUTING AND OUTPUTING PCBS IN SLOTED REPLACEMENT PALLETS
EP0322205A3 (en) * 1987-12-23 1990-09-12 Texas Instruments Incorporated Automated photolithographic work cell
DE58909880D1 (en) * 1988-05-24 2001-12-20 Unaxis Balzers Ag Vacuum system
WO1989012907A1 (en) * 1988-06-17 1989-12-28 Epsilon Technology, Inc. Wafer handling system with bernoulli pick-up
DE3822598C2 (en) * 1988-07-04 1997-09-04 Siemens Ag Adjustment arrangement and method for adjusting a gripping device of a robot arm for handling a semiconductor wafer
JP2545591B2 (en) * 1988-09-30 1996-10-23 国際電気株式会社 Wafer processing equipment
US5064340A (en) * 1989-01-20 1991-11-12 Genmark Automation Precision arm mechanism
JPH0793348B2 (en) * 1989-05-19 1995-10-09 アプライド マテリアルズ インコーポレーテッド Multi-chamber vacuum processing apparatus and multi-chamber vacuum semiconductor wafer processing apparatus
US5241183A (en) * 1991-03-22 1993-08-31 Nippon Telegraph And Telephone Corporation Vertical xy stage
JP2751975B2 (en) * 1991-12-20 1998-05-18 株式会社日立製作所 Load lock chamber of semiconductor processing equipment
CA2094208A1 (en) * 1992-04-28 1993-10-29 Richard D. Hein Prepackaged fluid-damping article for elastomeric mounts and methods of formation and installation
CH686445A5 (en) * 1992-10-06 1996-03-29 Balzers Hochvakuum Chamber and chamber combination for a vacuum system and method for passing at least one Werkstueckes.
DE4235676C2 (en) * 1992-10-22 1997-08-28 Balzers Hochvakuum Vacuum chamber for transporting disk-shaped workpieces in a vacuum system
US5516732A (en) * 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
JP2801489B2 (en) * 1992-12-17 1998-09-21 古河電気工業株式会社 Ring frame automatic cleaning device
JPH06204316A (en) * 1992-12-28 1994-07-22 Mitsubishi Electric Corp Heatproof robot hand
DE4336792A1 (en) * 1993-10-28 1995-05-04 Leybold Ag Device for transporting workpieces in vacuum coating installations
DE4430844C1 (en) * 1994-08-31 1996-02-22 Jenoptik Technologie Gmbh Feeding device for semiconductor processing systems
DE4430846C2 (en) * 1994-08-31 1997-04-10 Jenoptik Jena Gmbh Device for the implementation of a transport object between two end positions
TW539918B (en) 1997-05-27 2003-07-01 Tokyo Electron Ltd Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process
DE19812670A1 (en) * 1998-03-23 1999-10-07 Singulus Technologies Ag Substrate transport equipment especially for transporting substrates, e.g. CDs or DVDs, between stations in a sputter coating chamber
US6277753B1 (en) 1998-09-28 2001-08-21 Supercritical Systems Inc. Removal of CMP residue from semiconductors using supercritical carbon dioxide process
US6748960B1 (en) 1999-11-02 2004-06-15 Tokyo Electron Limited Apparatus for supercritical processing of multiple workpieces
JP5073902B2 (en) 1999-11-02 2012-11-14 東京エレクトロン株式会社 Method and apparatus for supercritical processing of multiple workpieces
US6890853B2 (en) 2000-04-25 2005-05-10 Tokyo Electron Limited Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module
JP4724353B2 (en) 2000-07-26 2011-07-13 東京エレクトロン株式会社 High pressure processing chamber for semiconductor substrates
JP3883929B2 (en) 2001-09-25 2007-02-21 大日本スクリーン製造株式会社 Thin film forming apparatus and thin film forming method
US7001468B1 (en) 2002-02-15 2006-02-21 Tokyo Electron Limited Pressure energized pressure vessel opening and closing device and method of providing therefor
US7387868B2 (en) 2002-03-04 2008-06-17 Tokyo Electron Limited Treatment of a dielectric layer using supercritical CO2
US7021635B2 (en) 2003-02-06 2006-04-04 Tokyo Electron Limited Vacuum chuck utilizing sintered material and method of providing thereof
US7077917B2 (en) 2003-02-10 2006-07-18 Tokyo Electric Limited High-pressure processing chamber for a semiconductor wafer
US7225820B2 (en) 2003-02-10 2007-06-05 Tokyo Electron Limited High-pressure processing chamber for a semiconductor wafer
US7270137B2 (en) 2003-04-28 2007-09-18 Tokyo Electron Limited Apparatus and method of securing a workpiece during high-pressure processing
US7163380B2 (en) 2003-07-29 2007-01-16 Tokyo Electron Limited Control of fluid flow in the processing of an object with a fluid
US7186093B2 (en) 2004-10-05 2007-03-06 Tokyo Electron Limited Method and apparatus for cooling motor bearings of a high pressure pump
US7250374B2 (en) 2004-06-30 2007-07-31 Tokyo Electron Limited System and method for processing a substrate using supercritical carbon dioxide processing
US7307019B2 (en) 2004-09-29 2007-12-11 Tokyo Electron Limited Method for supercritical carbon dioxide processing of fluoro-carbon films
US7491036B2 (en) 2004-11-12 2009-02-17 Tokyo Electron Limited Method and system for cooling a pump
US7140393B2 (en) 2004-12-22 2006-11-28 Tokyo Electron Limited Non-contact shuttle valve for flow diversion in high pressure systems
US7434590B2 (en) 2004-12-22 2008-10-14 Tokyo Electron Limited Method and apparatus for clamping a substrate in a high pressure processing system
US7291565B2 (en) 2005-02-15 2007-11-06 Tokyo Electron Limited Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid
US7435447B2 (en) 2005-02-15 2008-10-14 Tokyo Electron Limited Method and system for determining flow conditions in a high pressure processing system
US7767145B2 (en) 2005-03-28 2010-08-03 Toyko Electron Limited High pressure fourier transform infrared cell
US7380984B2 (en) 2005-03-28 2008-06-03 Tokyo Electron Limited Process flow thermocouple
US7494107B2 (en) 2005-03-30 2009-02-24 Supercritical Systems, Inc. Gate valve for plus-atmospheric pressure semiconductor process vessels
US7789971B2 (en) 2005-05-13 2010-09-07 Tokyo Electron Limited Treatment of substrate using functionalizing agent in supercritical carbon dioxide
US7524383B2 (en) 2005-05-25 2009-04-28 Tokyo Electron Limited Method and system for passivating a processing chamber
JP4098338B2 (en) 2006-07-20 2008-06-11 川崎重工業株式会社 Wafer transfer device and substrate transfer device
CN101929535A (en) * 2009-10-29 2010-12-29 浙江大学 Method and device for realizing planar reciprocating motion by using cam and planar belt
KR102739017B1 (en) * 2013-01-18 2024-12-06 퍼시몬 테크놀로지스 코포레이션 A Robot, An electronic device processing system, and A method of transporting substrates
US9149936B2 (en) 2013-01-18 2015-10-06 Persimmon Technologies, Corp. Robot having arm with unequal link lengths
WO2016145305A2 (en) * 2015-03-12 2016-09-15 Persimmon Technologies, Corp. Robot with slaved end effector motion
KR102145848B1 (en) * 2018-11-02 2020-08-19 세메스 주식회사 Die transfer module and die bonding apparatus having the same

Also Published As

Publication number Publication date
GB2193482A (en) 1988-02-10
KR880003395A (en) 1988-05-16
GB8709064D0 (en) 1987-05-20
JPS6342142A (en) 1988-02-23
DE3714045A1 (en) 1987-11-05

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)