GB602591A - Improvements in or relating to the electro-deposition of metals - Google Patents
Improvements in or relating to the electro-deposition of metalsInfo
- Publication number
- GB602591A GB602591A GB344045A GB344045A GB602591A GB 602591 A GB602591 A GB 602591A GB 344045 A GB344045 A GB 344045A GB 344045 A GB344045 A GB 344045A GB 602591 A GB602591 A GB 602591A
- Authority
- GB
- United Kingdom
- Prior art keywords
- ethylene oxide
- molecular
- specifications
- compound
- equivalent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Polyethers (AREA)
Abstract
Polyethers of the general formula R1X((R2O)n(R3On1))n11R4, where X is oxygen or NH or sulphur, R1 and R4 are hydrogen, hydroxyl or a monovalent organic radical, R2 and R3 are bivalent hydrocarbon radicals and n, n1 and n11 are integers are employed as addition agents in electroplating baths. Reference is made to Specifications 592,442 and 595,148. In addition to general methods of preparation of the polyethers described in the above-mentioned Specifications, the following specific preparations are described: (a) ethylene oxide is passed through molten beta-naphthol to which 0.5 per cent of sodium was added as catalyst until approximately 15 molecular equivalents of ethylene oxide have combined with 1 molecular equivalent of beta-naphthol; (b) the following are obtained by similar methods to the above: (i) a compound having 1 molecular equivalent of para-hydroxydiphenyl to 13 of ethylene oxide; (ii) a compound having 1 molecular equivalent of terpineol to 12 of ethylene oxide; (iii) a compound having 1 molecular equivalent of mercaptobenzathiazole to 18 of ethylene oxide; (iv)phenol polyethylene oxides having molecular equivalents of 1 : 6, 1 : 11 and 1 : 14; (v) pinene mercaptan polyethylene oxide having a molecular ratio 1 : 11; (c) ethylene oxide is bubbled through lauryl thiocyanate catalysed with sodium until materials having molecular ratios 1 : 6, 1 : 15 and 1 : 26 were obtained, the larger figures representing the molecular proportions of ethylene oxide; (d) ethylene oxide is passed through molten octadecyl alcohol until 20 molecular equivalents of ethylene oxide have reacted with the alcohol. Specifications 346,550, 380,431, 406,443, 420,137, 420,518, 432,356, 434,424, 465,048, 488,907 and 505,016 also are referred to.ALSO:Polyethers of the general formula <FORM:0602591/IV(b)/1> where X is oxygen or NH or sulphur, R1 and R4 are hydrogen, hydroxyl or a monovalent organic radical, R2 and R3 are bivalent hydrocarbon radicals and n, n1 and n11 are integers employed as addition agents in electroplating baths other than those for tin and lead. Reference is made to Specifications 592,442 and 595,148 wherein the use of polyethers in tin and lead baths respectively is described. In addition to general methods of preparation of the polyethers described in the abovementioned Specifications, the following specific preparations are described: (a) Ethylene oxide is passed through molten beta-naphthol to which 0.5 per cent of sodium was added as catalyst until approximately 15 molecular equivalents of ethylene oxide have combined with 1 molecular equivalent of beta-naphthol. (b) The following are obtained by similar methods to the above: (i) a compound having 1 molecular equivalent of para-hydroxydiphenyl to 13 of ethylene oxide; (ii) a compound having 1 molecular equivalent of terpineol to 12 of ethylene oxide; (iii) a compound having 1 molecular equivalent of mercaptobenzathiazole to 18 of ethylene oxide; (iv) phenol polyethylene oxides having molecular equivalents of 1 : 6, 1 : 11 and 1 : 14; (v) pinene mercaptan polyethylene oxide having a molecular ration 1 : 11. (c) Ethylene oxide is bubbled through lauryl thi<\>pocyanate catalysed with sodium until materials having molecular ratios 1 : 6, 1 : 15 and 1 : 26 were obtained, the larger figures representing the molecular proportions of ethylene oxide. (d) Ethylene oxide is passed through molten octadecyl alcohol until 20 molecular equivalents of ethylene oxide have reacted with the alcohol. Specifications 346,550, 380,431, 406,443, 420,137, 420,518, 432,356, 434,424, 465,048, 488,907 and 505,016 also are referred to.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB344045A GB602591A (en) | 1945-02-12 | 1945-02-12 | Improvements in or relating to the electro-deposition of metals |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB344045A GB602591A (en) | 1945-02-12 | 1945-02-12 | Improvements in or relating to the electro-deposition of metals |
Publications (1)
Publication Number | Publication Date |
---|---|
GB602591A true GB602591A (en) | 1948-05-31 |
Family
ID=9758364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB344045A Expired GB602591A (en) | 1945-02-12 | 1945-02-12 | Improvements in or relating to the electro-deposition of metals |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB602591A (en) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE950548C (en) * | 1950-04-05 | 1956-10-11 | Bayer Ag | Process for the production of polyglycol ethers |
DE1025855B (en) * | 1953-04-17 | 1958-03-13 | Atlas Powder Co | Process for the production of moisture-retaining sorbitol monoethers of 1,2-alkylene glycols |
DE1061526B (en) * | 1952-11-21 | 1959-07-16 | Mond Nickel Co Ltd | Process and bath for the electrolytic deposition of nickel |
US2903403A (en) * | 1954-02-10 | 1959-09-08 | Dehydag Gmbh | Method of copper-plating metal surfaces |
DE1521029A1 (en) * | 1966-05-28 | 1969-07-24 | Max Schloetter Fabrik Fuer Gal | Acid galvanic bright zinc bath |
US3945894A (en) * | 1975-04-11 | 1976-03-23 | Oxy Metal Industries Corporation | Bath composition and method of electrodepositing utilizing the same |
US4119502A (en) * | 1977-08-17 | 1978-10-10 | M&T Chemicals Inc. | Acid zinc electroplating process and composition |
FR2445397A1 (en) * | 1978-12-26 | 1980-07-25 | Rohco Inc | ACID ZINC-PLATED BATHS AND METHODS FOR ELECTRODEPOSITION OF SHINY ZINC DEPOSITS |
FR2470169A1 (en) * | 1979-11-19 | 1981-05-29 | Enthone | GALVANIZATION BATHS AND METHOD FOR THEIR IMPLEMENTATION |
US4512856A (en) * | 1979-11-19 | 1985-04-23 | Enthone, Incorporated | Zinc plating solutions and method utilizing ethoxylated/propoxylated polyhydric alcohols |
US4578158A (en) * | 1983-11-01 | 1986-03-25 | Nippon Steel Corporation | Process for electroplating a metallic material with an iron-zinc alloy |
WO2011012475A1 (en) * | 2009-07-30 | 2011-02-03 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
WO2011012462A3 (en) * | 2009-07-30 | 2012-01-19 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
USRE45175E1 (en) | 1994-12-09 | 2014-10-07 | Fry's Metals, Inc. | Process for silver plating in printed circuit board manufacture |
USRE45297E1 (en) | 1996-03-22 | 2014-12-23 | Ronald Redline | Method for enhancing the solderability of a surface |
US9072203B2 (en) | 1994-12-09 | 2015-06-30 | Enthone Inc. | Solderability enhancement by silver immersion printed circuit board manufacture |
USRE45842E1 (en) | 1999-02-17 | 2016-01-12 | Ronald Redline | Method for enhancing the solderability of a surface |
USRE45881E1 (en) | 1996-03-22 | 2016-02-09 | Ronald Redline | Method for enhancing the solderability of a surface |
-
1945
- 1945-02-12 GB GB344045A patent/GB602591A/en not_active Expired
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE950548C (en) * | 1950-04-05 | 1956-10-11 | Bayer Ag | Process for the production of polyglycol ethers |
DE1061526B (en) * | 1952-11-21 | 1959-07-16 | Mond Nickel Co Ltd | Process and bath for the electrolytic deposition of nickel |
DE1025855B (en) * | 1953-04-17 | 1958-03-13 | Atlas Powder Co | Process for the production of moisture-retaining sorbitol monoethers of 1,2-alkylene glycols |
US2903403A (en) * | 1954-02-10 | 1959-09-08 | Dehydag Gmbh | Method of copper-plating metal surfaces |
DE1521029A1 (en) * | 1966-05-28 | 1969-07-24 | Max Schloetter Fabrik Fuer Gal | Acid galvanic bright zinc bath |
US3945894A (en) * | 1975-04-11 | 1976-03-23 | Oxy Metal Industries Corporation | Bath composition and method of electrodepositing utilizing the same |
US4119502A (en) * | 1977-08-17 | 1978-10-10 | M&T Chemicals Inc. | Acid zinc electroplating process and composition |
FR2445397A1 (en) * | 1978-12-26 | 1980-07-25 | Rohco Inc | ACID ZINC-PLATED BATHS AND METHODS FOR ELECTRODEPOSITION OF SHINY ZINC DEPOSITS |
FR2470169A1 (en) * | 1979-11-19 | 1981-05-29 | Enthone | GALVANIZATION BATHS AND METHOD FOR THEIR IMPLEMENTATION |
US4512856A (en) * | 1979-11-19 | 1985-04-23 | Enthone, Incorporated | Zinc plating solutions and method utilizing ethoxylated/propoxylated polyhydric alcohols |
US4578158A (en) * | 1983-11-01 | 1986-03-25 | Nippon Steel Corporation | Process for electroplating a metallic material with an iron-zinc alloy |
US9072203B2 (en) | 1994-12-09 | 2015-06-30 | Enthone Inc. | Solderability enhancement by silver immersion printed circuit board manufacture |
USRE45175E1 (en) | 1994-12-09 | 2014-10-07 | Fry's Metals, Inc. | Process for silver plating in printed circuit board manufacture |
USRE45279E1 (en) | 1994-12-09 | 2014-12-09 | Fry's Metals, Inc. | Process for silver plating in printed circuit board manufacture |
USRE45297E1 (en) | 1996-03-22 | 2014-12-23 | Ronald Redline | Method for enhancing the solderability of a surface |
USRE45881E1 (en) | 1996-03-22 | 2016-02-09 | Ronald Redline | Method for enhancing the solderability of a surface |
USRE45842E1 (en) | 1999-02-17 | 2016-01-12 | Ronald Redline | Method for enhancing the solderability of a surface |
WO2011012462A3 (en) * | 2009-07-30 | 2012-01-19 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
US20120118750A1 (en) * | 2009-07-30 | 2012-05-17 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
CN102597329A (en) * | 2009-07-30 | 2012-07-18 | 巴斯夫欧洲公司 | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
WO2011012475A1 (en) * | 2009-07-30 | 2011-02-03 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
CN102597329B (en) * | 2009-07-30 | 2015-12-16 | 巴斯夫欧洲公司 | Comprise the tight submicrometer structure filling metal plating compositions of inhibitor |
US9617647B2 (en) | 2009-07-30 | 2017-04-11 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
US9869029B2 (en) | 2009-07-30 | 2018-01-16 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
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