GB2389229A - A light emitting diode - Google Patents
A light emitting diode Download PDFInfo
- Publication number
- GB2389229A GB2389229A GB0212251A GB0212251A GB2389229A GB 2389229 A GB2389229 A GB 2389229A GB 0212251 A GB0212251 A GB 0212251A GB 0212251 A GB0212251 A GB 0212251A GB 2389229 A GB2389229 A GB 2389229A
- Authority
- GB
- United Kingdom
- Prior art keywords
- light emitting
- emitting diode
- die
- control
- controller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
- H05B47/10—Controlling the light source
- H05B47/175—Controlling the light source by remote control
- H05B47/18—Controlling the light source by remote control via data-bus transmission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Abstract
A light emitting diode 1 includes an integrated circuit controller 4 encapsulated with a light emitting die 2. The control IC includes a programmable memory which holds its address. The address can be programmed during manufacture or at a later stage. The controller responds to an addressed command on the data signal. The command contains information on the desired output of the device, such as on/off, intensity and colour, it can also contain a new address for re-programming the device. The diode has two, three or four leads 6 for power, ground, clock and data signals. The clock and data may be combined for a three lead device or combined with the power supply for a two lead device. This simplifies the connections required compared to a conventional array of LEDs. Connection 8 provides a ground connection for the controller and connection 5 proves the output to the LED die. The LED can also be mounted on the control IC with different connections.
Description
f A Light Emitting Diode This invention relates to a light emitting diode.
5 Light emitting diodes (LED) are solid-state devices which are used as light sources in displays. They are typically two lead devices which when driven by a suitable supply may be made to emit light. A problem occurs with the use of such LEDs when it is desired to selectively energise one or some of those in the display. In order to cater for selective energisaton it is necessary to provide a multiplicity of lo connecting wires.
The present invention arose from a realization by the inventor that it might be possible to overcome or at least alleviate some of the drawbacks of prior arrangements.
5 According to the invention there is provided a light emitting diode Including a light emitting die and a controller for the die which controller being responsive to an address on a control hne to selectively operate the light emitting die.
By operate it is meant to control an aspect of the LED's function which could 20 include for example, on or off, an increase or decrease in intensity or a variation to the colour or wavelength of the radiation produced.
Specific embodiments of the light emitting diode will now be described by way of example only with reference to the drawings in which: 2s Figures I to 4 show longitudinal sections through different embodiments of the invention; and Figure 5 shows a control signal structure.
( In the description of the embodiments like components are given the same
reference numerals. As is shown In figure 1, a light emitting diode (led) 1 comprises a light emitting diode die 2 of AllnGaP material bonded to a metal cathode leg 3 (other materials may be used), a CMOS control IC 4 wired to the die 2 by a connection 5 and s metal legs 6. The components are encapsulated in an epoxy encapsulation compound 7 of standard type to produce a unitary component. The epoxy compound may be clear or coloured as required for the particular application.
The first embodiment shown in figure 1 has three metals legs 6 which protrude lo beyond the encapsulation. The first leg 6a is a ground connection to the led die 2. The second leg 6b is a data and clock connection to the control IC 4 and the third leg 6c is a power connection to the control IC 4. A further connection 8 to the control IC 4 is provided between the metal leg and the control 1C 4. This further connection connects the control 1C 4 to the ground to ensure that the control IC is provided with a complete 5 power connection between supply and ground.
In the second embodiment two metal legs are provided. The first of these 6a is identical to that disclosed in the first embodiment. The second leg 6d is a connection to power, clock and data. The third embodiment shown in figure 3 has the same two-leg 20 arrangement as the figure 2 embodiment. However, the controller 1C 4 is mounted on the metal cathode underneath the led die 2. Thus in this embodiment there is a direct connection to the ground leg 6 a and a wire link 10 from the dower clock data leg 6d to the control JC 4.
25 The last embodiment is provided with four metal legs. The first leg 6a provides a connection to ground. The second leg providing a connection to data. The third]cg 6f providing a connection to a clock and the fourth leg 6c providing a connection to power. The legs be, f and g are connected to the control IC4 and a power connection made to the led die 2 by wire link 5.
( In essence all the embodiments provide a led controller and a led die in one encapsulation. The way in which the control IC 4 operates to control the LED will now be 5 described. This description is applicable to all the embodiments.
The control 1C includes a programmable memory area which in use holds binary value of its address. The address is programmed during manufacture although it may also be possible to make it programmable at a later stage for example in use or lo during installation of the led into other equipment such as a display. In order to instruct the control IC and hence to affect the operation of the led die itself a data signal Is applied to a data bus (not shown) to which the data leg is connected.
The data signal 50 is shown in figure 5 and comprises a number of fields. The
5 first field 51 is a start field and the last field 52 is a stop field. These include a
sequence to indicate that a message starts and ends to enabic a control IC to Identify the messages In a stream of such messages. The second field 53 is a destination address
field. This field contains the address of the Intended LED control IC. A number of
further data fields 54 are provided which may include error checking information or
20 other signalling data. The next significant field is an address update field 55. This
field contains a new address to be used by the control IC If the following program set
field 56 Is set to 1. This enables the re-programming of each led if required. Field is
the on-off field. If the contents of this field are a I then the control IC switches the
LED die on. If zero the LED die is switched off.
2s The other data fields enable other control functions such as the setting of other
led die properties. For example it may be possible to thereby control the output intensity or the wavelength or colour of the light emitted.
30 The fourth embodiment is controlled In an asynchronous manner requiring the extra leg for the external clock to the control IC.
Claims (8)
- / ClaimsClaim I. A light emitting diode including a light emitting die and a controller for the S die which controller being responsive to an address on a control line to selectively operate the light emitting die.
- Claim 2. A light emitting diode as claimed in claim 1 wherein the controller is provided as an integrated circuit.
- Claim 3. A light emitting diode as claimed in claim 1 or claim 2 wherein the light emitting die is provided with legs to facilitate electrical connection.
- Claim 4. A light emitting die as claimed in claim 3 wherein at least one of the legs 15 provides in use a data connection.
- Claim 5. A light emitting diode as claimed in anyone of claims I to 4 wherein the light emitting die is encapsulated.20 Claim
- 6. A light emitting diode as claimed in claim 5 wherein the controller is encapsulated with the die.
- Claim 7. A light emitting diode as claimed in any preceding claim wherein the legs provide a ground, a power, a clock and a data connection.
- Claim 8. A light emitting diode substantially as hereinbefore described with reference to, and as illustrated by, figure I or figure 2 or figure 3 or figure 4.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0212251A GB2389229A (en) | 2002-05-28 | 2002-05-28 | A light emitting diode |
PCT/EP2003/005481 WO2003101154A1 (en) | 2002-05-28 | 2003-05-22 | A controllable light emitting diode |
EP03755131A EP1510109A1 (en) | 2002-05-28 | 2003-05-22 | A controllable light emitting diode |
AU2003242572A AU2003242572A1 (en) | 2002-05-28 | 2003-05-22 | A controllable light emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0212251A GB2389229A (en) | 2002-05-28 | 2002-05-28 | A light emitting diode |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0212251D0 GB0212251D0 (en) | 2002-07-10 |
GB2389229A true GB2389229A (en) | 2003-12-03 |
Family
ID=9937551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0212251A Withdrawn GB2389229A (en) | 2002-05-28 | 2002-05-28 | A light emitting diode |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1510109A1 (en) |
AU (1) | AU2003242572A1 (en) |
GB (1) | GB2389229A (en) |
WO (1) | WO2003101154A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070139316A1 (en) * | 2005-12-21 | 2007-06-21 | Sony Ericsson Mobile Communications Ab | Led module with integrated controller |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3035944A1 (en) * | 1980-09-24 | 1982-04-08 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Opto-electronic semiconductor display - uses LED as transmitter and receiver to effect control of intensity |
US5304812A (en) * | 1990-11-21 | 1994-04-19 | Sharp Kabushiki Kaisha | Optoelectronic device, information apparatus and data transmission system using optoelectronic device for simplifying wirings and reducing size, and method of controlling the optoelectronic device |
JPH08101666A (en) * | 1994-09-30 | 1996-04-16 | Takiron Co Ltd | Data distributer of dot matrix led display device |
JPH11327489A (en) * | 1998-05-11 | 1999-11-26 | Nokeg & G Opt Electronics Kk | Character display device |
US20010028356A1 (en) * | 2000-02-21 | 2001-10-11 | Tibor Balogh | Pixel element for a three-dimensional screen |
US20020021269A1 (en) * | 2000-08-07 | 2002-02-21 | Rast Rodger H. | System and method of driving an array of optical elements |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5410328A (en) * | 1994-03-28 | 1995-04-25 | Trans-Lux Corporation | Replaceable intelligent pixel module for large-scale LED displays |
US6608453B2 (en) * | 1997-08-26 | 2003-08-19 | Color Kinetics Incorporated | Methods and apparatus for controlling devices in a networked lighting system |
US6885035B2 (en) * | 1999-12-22 | 2005-04-26 | Lumileds Lighting U.S., Llc | Multi-chip semiconductor LED assembly |
DE20018865U1 (en) * | 2000-11-07 | 2001-02-01 | Kegelbahntechnik Dortmund GmbH, 44357 Dortmund | Lighting system |
-
2002
- 2002-05-28 GB GB0212251A patent/GB2389229A/en not_active Withdrawn
-
2003
- 2003-05-22 EP EP03755131A patent/EP1510109A1/en not_active Withdrawn
- 2003-05-22 AU AU2003242572A patent/AU2003242572A1/en not_active Abandoned
- 2003-05-22 WO PCT/EP2003/005481 patent/WO2003101154A1/en not_active Application Discontinuation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3035944A1 (en) * | 1980-09-24 | 1982-04-08 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Opto-electronic semiconductor display - uses LED as transmitter and receiver to effect control of intensity |
US5304812A (en) * | 1990-11-21 | 1994-04-19 | Sharp Kabushiki Kaisha | Optoelectronic device, information apparatus and data transmission system using optoelectronic device for simplifying wirings and reducing size, and method of controlling the optoelectronic device |
JPH08101666A (en) * | 1994-09-30 | 1996-04-16 | Takiron Co Ltd | Data distributer of dot matrix led display device |
JPH11327489A (en) * | 1998-05-11 | 1999-11-26 | Nokeg & G Opt Electronics Kk | Character display device |
US20010028356A1 (en) * | 2000-02-21 | 2001-10-11 | Tibor Balogh | Pixel element for a three-dimensional screen |
US20020021269A1 (en) * | 2000-08-07 | 2002-02-21 | Rast Rodger H. | System and method of driving an array of optical elements |
Also Published As
Publication number | Publication date |
---|---|
EP1510109A1 (en) | 2005-03-02 |
WO2003101154A1 (en) | 2003-12-04 |
GB0212251D0 (en) | 2002-07-10 |
AU2003242572A1 (en) | 2003-12-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |