[go: up one dir, main page]

GB2389229A - A light emitting diode - Google Patents

A light emitting diode Download PDF

Info

Publication number
GB2389229A
GB2389229A GB0212251A GB0212251A GB2389229A GB 2389229 A GB2389229 A GB 2389229A GB 0212251 A GB0212251 A GB 0212251A GB 0212251 A GB0212251 A GB 0212251A GB 2389229 A GB2389229 A GB 2389229A
Authority
GB
United Kingdom
Prior art keywords
light emitting
emitting diode
die
control
controller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0212251A
Other versions
GB0212251D0 (en
Inventor
Lee Robinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Roke Manor Research Ltd
Original Assignee
Roke Manor Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roke Manor Research Ltd filed Critical Roke Manor Research Ltd
Priority to GB0212251A priority Critical patent/GB2389229A/en
Publication of GB0212251D0 publication Critical patent/GB0212251D0/en
Priority to PCT/EP2003/005481 priority patent/WO2003101154A1/en
Priority to EP03755131A priority patent/EP1510109A1/en
Priority to AU2003242572A priority patent/AU2003242572A1/en
Publication of GB2389229A publication Critical patent/GB2389229A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30Driver circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40Details of LED load circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10Controlling the light source
    • H05B47/175Controlling the light source by remote control
    • H05B47/18Controlling the light source by remote control via data-bus transmission
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20Controlling the colour of the light

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)

Abstract

A light emitting diode 1 includes an integrated circuit controller 4 encapsulated with a light emitting die 2. The control IC includes a programmable memory which holds its address. The address can be programmed during manufacture or at a later stage. The controller responds to an addressed command on the data signal. The command contains information on the desired output of the device, such as on/off, intensity and colour, it can also contain a new address for re-programming the device. The diode has two, three or four leads 6 for power, ground, clock and data signals. The clock and data may be combined for a three lead device or combined with the power supply for a two lead device. This simplifies the connections required compared to a conventional array of LEDs. Connection 8 provides a ground connection for the controller and connection 5 proves the output to the LED die. The LED can also be mounted on the control IC with different connections.

Description

f A Light Emitting Diode This invention relates to a light emitting diode.
5 Light emitting diodes (LED) are solid-state devices which are used as light sources in displays. They are typically two lead devices which when driven by a suitable supply may be made to emit light. A problem occurs with the use of such LEDs when it is desired to selectively energise one or some of those in the display. In order to cater for selective energisaton it is necessary to provide a multiplicity of lo connecting wires.
The present invention arose from a realization by the inventor that it might be possible to overcome or at least alleviate some of the drawbacks of prior arrangements.
5 According to the invention there is provided a light emitting diode Including a light emitting die and a controller for the die which controller being responsive to an address on a control hne to selectively operate the light emitting die.
By operate it is meant to control an aspect of the LED's function which could 20 include for example, on or off, an increase or decrease in intensity or a variation to the colour or wavelength of the radiation produced.
Specific embodiments of the light emitting diode will now be described by way of example only with reference to the drawings in which: 2s Figures I to 4 show longitudinal sections through different embodiments of the invention; and Figure 5 shows a control signal structure.
( In the description of the embodiments like components are given the same
reference numerals. As is shown In figure 1, a light emitting diode (led) 1 comprises a light emitting diode die 2 of AllnGaP material bonded to a metal cathode leg 3 (other materials may be used), a CMOS control IC 4 wired to the die 2 by a connection 5 and s metal legs 6. The components are encapsulated in an epoxy encapsulation compound 7 of standard type to produce a unitary component. The epoxy compound may be clear or coloured as required for the particular application.
The first embodiment shown in figure 1 has three metals legs 6 which protrude lo beyond the encapsulation. The first leg 6a is a ground connection to the led die 2. The second leg 6b is a data and clock connection to the control IC 4 and the third leg 6c is a power connection to the control IC 4. A further connection 8 to the control IC 4 is provided between the metal leg and the control 1C 4. This further connection connects the control 1C 4 to the ground to ensure that the control IC is provided with a complete 5 power connection between supply and ground.
In the second embodiment two metal legs are provided. The first of these 6a is identical to that disclosed in the first embodiment. The second leg 6d is a connection to power, clock and data. The third embodiment shown in figure 3 has the same two-leg 20 arrangement as the figure 2 embodiment. However, the controller 1C 4 is mounted on the metal cathode underneath the led die 2. Thus in this embodiment there is a direct connection to the ground leg 6 a and a wire link 10 from the dower clock data leg 6d to the control JC 4.
25 The last embodiment is provided with four metal legs. The first leg 6a provides a connection to ground. The second leg providing a connection to data. The third]cg 6f providing a connection to a clock and the fourth leg 6c providing a connection to power. The legs be, f and g are connected to the control IC4 and a power connection made to the led die 2 by wire link 5.
( In essence all the embodiments provide a led controller and a led die in one encapsulation. The way in which the control IC 4 operates to control the LED will now be 5 described. This description is applicable to all the embodiments.
The control 1C includes a programmable memory area which in use holds binary value of its address. The address is programmed during manufacture although it may also be possible to make it programmable at a later stage for example in use or lo during installation of the led into other equipment such as a display. In order to instruct the control IC and hence to affect the operation of the led die itself a data signal Is applied to a data bus (not shown) to which the data leg is connected.
The data signal 50 is shown in figure 5 and comprises a number of fields. The
5 first field 51 is a start field and the last field 52 is a stop field. These include a
sequence to indicate that a message starts and ends to enabic a control IC to Identify the messages In a stream of such messages. The second field 53 is a destination address
field. This field contains the address of the Intended LED control IC. A number of
further data fields 54 are provided which may include error checking information or
20 other signalling data. The next significant field is an address update field 55. This
field contains a new address to be used by the control IC If the following program set
field 56 Is set to 1. This enables the re-programming of each led if required. Field is
the on-off field. If the contents of this field are a I then the control IC switches the
LED die on. If zero the LED die is switched off.
2s The other data fields enable other control functions such as the setting of other
led die properties. For example it may be possible to thereby control the output intensity or the wavelength or colour of the light emitted.
30 The fourth embodiment is controlled In an asynchronous manner requiring the extra leg for the external clock to the control IC.

Claims (8)

  1. / Claims
    Claim I. A light emitting diode including a light emitting die and a controller for the S die which controller being responsive to an address on a control line to selectively operate the light emitting die.
  2. Claim 2. A light emitting diode as claimed in claim 1 wherein the controller is provided as an integrated circuit.
  3. Claim 3. A light emitting diode as claimed in claim 1 or claim 2 wherein the light emitting die is provided with legs to facilitate electrical connection.
  4. Claim 4. A light emitting die as claimed in claim 3 wherein at least one of the legs 15 provides in use a data connection.
  5. Claim 5. A light emitting diode as claimed in anyone of claims I to 4 wherein the light emitting die is encapsulated.
    20 Claim
  6. 6. A light emitting diode as claimed in claim 5 wherein the controller is encapsulated with the die.
  7. Claim 7. A light emitting diode as claimed in any preceding claim wherein the legs provide a ground, a power, a clock and a data connection.
  8. Claim 8. A light emitting diode substantially as hereinbefore described with reference to, and as illustrated by, figure I or figure 2 or figure 3 or figure 4.
GB0212251A 2002-05-28 2002-05-28 A light emitting diode Withdrawn GB2389229A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB0212251A GB2389229A (en) 2002-05-28 2002-05-28 A light emitting diode
PCT/EP2003/005481 WO2003101154A1 (en) 2002-05-28 2003-05-22 A controllable light emitting diode
EP03755131A EP1510109A1 (en) 2002-05-28 2003-05-22 A controllable light emitting diode
AU2003242572A AU2003242572A1 (en) 2002-05-28 2003-05-22 A controllable light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0212251A GB2389229A (en) 2002-05-28 2002-05-28 A light emitting diode

Publications (2)

Publication Number Publication Date
GB0212251D0 GB0212251D0 (en) 2002-07-10
GB2389229A true GB2389229A (en) 2003-12-03

Family

ID=9937551

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0212251A Withdrawn GB2389229A (en) 2002-05-28 2002-05-28 A light emitting diode

Country Status (4)

Country Link
EP (1) EP1510109A1 (en)
AU (1) AU2003242572A1 (en)
GB (1) GB2389229A (en)
WO (1) WO2003101154A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070139316A1 (en) * 2005-12-21 2007-06-21 Sony Ericsson Mobile Communications Ab Led module with integrated controller

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3035944A1 (en) * 1980-09-24 1982-04-08 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Opto-electronic semiconductor display - uses LED as transmitter and receiver to effect control of intensity
US5304812A (en) * 1990-11-21 1994-04-19 Sharp Kabushiki Kaisha Optoelectronic device, information apparatus and data transmission system using optoelectronic device for simplifying wirings and reducing size, and method of controlling the optoelectronic device
JPH08101666A (en) * 1994-09-30 1996-04-16 Takiron Co Ltd Data distributer of dot matrix led display device
JPH11327489A (en) * 1998-05-11 1999-11-26 Nokeg & G Opt Electronics Kk Character display device
US20010028356A1 (en) * 2000-02-21 2001-10-11 Tibor Balogh Pixel element for a three-dimensional screen
US20020021269A1 (en) * 2000-08-07 2002-02-21 Rast Rodger H. System and method of driving an array of optical elements

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410328A (en) * 1994-03-28 1995-04-25 Trans-Lux Corporation Replaceable intelligent pixel module for large-scale LED displays
US6608453B2 (en) * 1997-08-26 2003-08-19 Color Kinetics Incorporated Methods and apparatus for controlling devices in a networked lighting system
US6885035B2 (en) * 1999-12-22 2005-04-26 Lumileds Lighting U.S., Llc Multi-chip semiconductor LED assembly
DE20018865U1 (en) * 2000-11-07 2001-02-01 Kegelbahntechnik Dortmund GmbH, 44357 Dortmund Lighting system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3035944A1 (en) * 1980-09-24 1982-04-08 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Opto-electronic semiconductor display - uses LED as transmitter and receiver to effect control of intensity
US5304812A (en) * 1990-11-21 1994-04-19 Sharp Kabushiki Kaisha Optoelectronic device, information apparatus and data transmission system using optoelectronic device for simplifying wirings and reducing size, and method of controlling the optoelectronic device
JPH08101666A (en) * 1994-09-30 1996-04-16 Takiron Co Ltd Data distributer of dot matrix led display device
JPH11327489A (en) * 1998-05-11 1999-11-26 Nokeg & G Opt Electronics Kk Character display device
US20010028356A1 (en) * 2000-02-21 2001-10-11 Tibor Balogh Pixel element for a three-dimensional screen
US20020021269A1 (en) * 2000-08-07 2002-02-21 Rast Rodger H. System and method of driving an array of optical elements

Also Published As

Publication number Publication date
EP1510109A1 (en) 2005-03-02
WO2003101154A1 (en) 2003-12-04
GB0212251D0 (en) 2002-07-10
AU2003242572A1 (en) 2003-12-12

Similar Documents

Publication Publication Date Title
US6646491B2 (en) LED lamp package for packaging an LED driver with an LED
US4992704A (en) Variable color light emitting diode
KR101134752B1 (en) LED Package
US9887185B2 (en) Packaging of LED chips and driver circuit on the same substrate
US9967928B2 (en) Replaceable lighting fixture components
US6489637B1 (en) Hybrid integrated circuit device
CN101129094B (en) Electronic device having a light bus for controlling light emitting elements
US6858870B2 (en) Multi-chip light emitting diode package
WO1996010244A1 (en) Display
CN102450103A (en) Multi-voltage and multi-brightness led lighting devices and methods of using same
JP2001057445A (en) Light-emitting diode
CN110600463A (en) Integrated packaging LED display panel based on chip stacking
CN107871806A (en) Lighting module especially for enhanced control of motor vehicles
US20110101409A1 (en) LED Lamp Package with Integral Driver
US20180097154A1 (en) Led emitter and method for manufacturing the same
JPS6182486A (en) solid state light emitting display
GB2389229A (en) A light emitting diode
JP2003150074A (en) Led module and led display device
CN209084426U (en) A kind of filament of integrated control chip and LED wafer
US20240063355A1 (en) Optoelectronic component, luminescent assembly and mounting strap
KR840008074A (en) Semiconductor memory
JP3202569U (en) LED package
CN208063525U (en) A kind of LED lamp bead encapsulating structure and LED display
CN109323135A (en) A kind of filament of integrated control chip and LED wafer
JPS6184880A (en) solid state light emitting display

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)