CN109323135A - A kind of filament of integrated control chip and LED wafer - Google Patents
A kind of filament of integrated control chip and LED wafer Download PDFInfo
- Publication number
- CN109323135A CN109323135A CN201811242956.7A CN201811242956A CN109323135A CN 109323135 A CN109323135 A CN 109323135A CN 201811242956 A CN201811242956 A CN 201811242956A CN 109323135 A CN109323135 A CN 109323135A
- Authority
- CN
- China
- Prior art keywords
- control chip
- integrated control
- led wafer
- filament
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The present invention provides the filament of a kind of integrated control chip and LED wafer, including resin photic zone, along its length the multiple LED wafers arranged, the filament further includes multiple conducting wires and integrated control chip, the LED wafer both ends are electrically connected with wherein two conducting wires respectively, the resin photic zone is wrapped in the LED wafer, outside the conducting wire, the integrated control chip is connected and fixed with the conducting wire, which has a pair of of input pin for connecting to power supply and multiple output pins for connecting with multiple conducting wires.Integrated control chip makes the LED filament realize several lighting modules by the time and direction for controlling the size of current of output pin and the electric current output of each output pin.
Description
Technical field
The present invention relates to field of light fittings, especially a kind of filament of integrated control chip and LED wafer.
Background technique
LED is called light emitting diode, is a kind of solid state semiconductor devices that can convert electrical energy into visible light, it can
Directly to convert electricity to light.The heart of LED is the chip (LED wafer) of a semiconductor, and one end of chip is attached to a branch
On frame, one end is cathode, and the other end connects the anode of power supply, is encapsulated entire chip by epoxy resin.Semiconductor wafer
Consist of two parts, a part is P-type semiconductor, and hole is occupied an leading position inside it, and the other end is N-type semiconductor, at this
While being mainly electronics.But when both semiconductors connect, a P-N junction is just formed between them.When electric current passes through
When conducting wire acts on this chip, electronics will be pushed to the area P, and electronics, then will be with light with hole-recombination in the area P
The form of son issues energy, and here it is the principles that LED light shines.And the wavelength of light i.e. the color of light, it is by formation P-N junction
Material determine.
The light-emitting component of LED mainly has LED lamp bead (straight cutting, patch), two kinds of forms of LED filament.The luminous mould of LED filament
Formula is single.In order to obtain there are many lamps and lanterns of light-emitting mode, usually luminaire manufacturer manufactures or purchases respectively circuit board (containing control
Device processed), lamp bead, after lamp bead is welded one by one on circuit boards, the quantity of lamp bead is more.
Fig. 2 is referred to, notification number is that the Chinese invention patent of CN204442783U discloses a kind of Bluetooth LED lamp, is wrapped
Include chassis, cover at the lampshade on chassis, several LED light source structures on chassis, be set to chassis on and with LED light source knot
The LED intelligent controller of structure connection.Several LED lamp beads that LED light source structure includes substrate, is laid on substrate；LED is intelligently controlled
The intelligent control circuit of the interior illumination effect for being equipped with receivable Bluetooth control signal and controlling LED lamp bead of device processed；Intelligent control electric
Road includes fuse F1, power supply circuit, the control module connecting with power supply circuit, connect with control module and by control module control
The the first control switch circuit and the second control switch circuit of system, the first control switch circuit, the second control switch circuit difference
It is connect with LED lamp bead；The bluetooth module that can receive external Bluetooth control signal is equipped in control module, being additionally provided with can be according to indigo plant
Tooth controls signal to regulate and control the control processing module of the illumination effect of LED lamp bead.
The prior art can not control multiple LED lamp beads by controller simultaneously, therefore that there are light-emitting modes is more single
Problem.
Summary of the invention
In order to overcome the above problem, the present invention provides a kind of integrated control chip with several lighting modules and LED is brilliant
The filament of piece.
In order to achieve the above-mentioned advantages, the present invention provides the filament of a kind of integrated control chip and LED wafer, including resin light transmission
Layer, the multiple LED wafers arranged along its length, which further includes multiple conducting wires and integrated control chip, the LED wafer
Both ends are electrically connected with wherein two conducting wires respectively, and the resin photic zone is wrapped in the LED wafer, outside the conducting wire, described
Integrated control chip is connected and fixed with the conducting wire, which has a pair of of input pin for connecting to power supply
With multiple output pins for being connected with multiple conducting wires.
In one embodiment of the present of invention, the LED filament further includes the substrate being made of insulating material, which is used for
The fixed LED wafer, the conducting wire.
In one embodiment of the present of invention, the substrate is also used to fix multiple pins.
In one embodiment of the present of invention, there is at least one described LED wafer between every two conducting wires.
In one embodiment of the present of invention, between two conducting wires at least one positive described LED wafer and
The reversed LED wafer.
In one embodiment of the present of invention, there are multiple pads connecting with conducting wire on the substrate, the pad is logical
Gold thread is crossed to be electrically connected with LED wafer.
In one embodiment of the present of invention, the substrate is pcb board.
In one embodiment of the present of invention, the integrated control chip is also used to control the size of current of the output end.
In one embodiment of the present of invention, the electric current that the integrated control chip is used to control each output end is defeated
Time and direction out.
In one embodiment of the present of invention, the conducting wire is printed circuit.
In the present invention, integrated control chip passes through the size of current and each output pin for controlling output pin
The time of electric current output and direction make the LED filament realize several lighting modules.
Detailed description of the invention
Fig. 1 show the structural schematic diagram of the Bluetooth LED lamp of the prior art.
Fig. 2 show the structural schematic diagram of the integrated control chip of first embodiment of the invention and the filament of LED wafer.
Fig. 3 show the partial enlarged view at the A of the integrated control chip of Fig. 2 and the filament of LED wafer.
Fig. 4 show the cut-away illustration of the integrated control chip of Fig. 2 and the filament of LED wafer.
Fig. 5 show the structural schematic diagram of the integrated control chip of second embodiment of the invention and the filament of LED wafer.
Fig. 6 show the structural schematic diagram of the integrated control chip of second embodiment of the invention and the filament of LED wafer.
Fig. 7 show the structural schematic diagram of the integrated control chip of third embodiment of the invention and the filament of LED wafer.
Fig. 8 show the structural schematic diagram of the integrated control chip of fourth embodiment of the invention and the filament of LED wafer.
Fig. 9 show the structural schematic diagram of the integrated control chip of fifth embodiment of the invention and the filament of LED wafer.
Figure 10 show the structural schematic diagram of the LED wafer of Fig. 9.
Figure 11 show the structural schematic diagram of the integrated control chip of sixth embodiment of the invention and the filament of LED wafer.
Figure 12 show the cut-away illustration of the integrated control chip of Figure 11 and the filament of LED wafer.
Specific embodiment
It is of the invention to reach the technical means and efficacy that predetermined goal of the invention is taken further to illustrate, below in conjunction with
Attached drawing and preferred embodiment, to specific embodiment, structure, feature and its effect is proposed according to the present invention, detailed description is as follows.
Refer to Fig. 2, Fig. 3, the integrated control chip of first embodiment of the invention and the filament of LED wafer, including resin
Photic zone 1, the multiple LED wafers 2 arranged along its length, the filament further include multiple conducting wires 5 and integrated control chip 3, institute
It states 2 both ends of LED wafer to be electrically connected with wherein two conducting wires 5 respectively, the resin photic zone 1 is wrapped in the LED wafer 2, institute
It states outside conducting wire 5, the integrated control chip 3 is connected and fixed with the conducting wire 5, which, which has, is used for and power supply
A pair of of input pin 31 of connection and multiple output pins 32 for being connected with multiple conducting wires.
Fig. 4 is referred to, LED filament further includes the substrate 6 being made of insulating material, and the substrate 6 is brilliant for fixing the LED
Piece 2, the conducting wire 5.The substrate 6 is pcb board.There is multiple pads 61 connecting with conducting wire 5, the weldering on the substrate 6
Contact 61 is electrically connected by gold thread 62 with LED wafer 2.The substrate 6 is also used to fix multiple input pins 31 and output
Pin 32.
Conducting wire 5 is printed circuit.There is at least one described LED wafer 2 between every two conducting wires 5.Conducting wire 5 includes
First conducting wire 5a, the second conducting wire 5b and privates 5c.LED wafer 2 includes L1, L2, L3, L4, L5, L6.First conducting wire 5a with
It is connected with L1, L2 between second conducting wire 5b, L1 is parallel with one another with L2.Be connected between first conducting wire 5a and privates 5c L3,
L4, L3 and L4 are parallel with one another.It is connected with L5, L6 between second conducting wire 5b and privates 5c, L5 is parallel with one another with L6.
Integrated control chip 3 is fixed on the top or the back side of substrate 6, and integrated control chip 3 draws for controlling the output
The size of current of foot 32.The electric current that 32 integrated control chip 3 of output pin is also used to control each output pin 32 is defeated
Time and direction out.
Integrated control chip 3 passes through the size of current of control output pin 32 and the electric current of each output pin 32
The time of output and direction make the LED filament realize several lighting modules.
Refer to Fig. 5, Fig. 6, in the second embodiment of the present invention, conducting wire 5 is more, and conducting wire 5 is not contacted with conducting wire 5.Position
A pair of of input pin 31 in 6 end of substrate is connect with the positive or negative pole of power supply respectively.Have at least one between two conducting wires 5
The LED wafer 2 of a forward direction and reversed LED wafer 2.
In jointing soldering points 61 and during conducting wire 5, due to conducting wire 5 and another any conducting wire 5 respectively with LED wafer 2
The pads 61 of two sides connects, it may appear that the case where intersection, therefore to avoid contact position of the conducting wire 5 with conducting wire 5, part conducting wire 5
It is fixedly connected across substrate 6 and with 6 back side of substrate.The connection type is more suitable for conducting wire 5, the more complicated LED light of structure
Silk.
Refer to Fig. 7, in the third embodiment of the present invention, conducting wire 5 is wrapped with insulating materials.Since insulating materials has
The effect of insulation, therefore conducting wire 5 can intersect with gold thread 62 or another conducting wire 5.
During conducting wire 5, one end of conducting wire 5 is electrically connected with output pin 32, part conducting wire 5 then respectively with weldering
Contact 61 is electrically connected.Then LED filament is encapsulated by resin photic zone 1.The connection type is not necessarily to printed circuit, therefore cost
It is lower.
Refer to Fig. 8, in the fourth embodiment of the present invention, the conducting wire 5 of LED filament is electrically connected with controller 8.
Controller 8 has the integrated control chip 3 for controlling LED filament, in use, integrated control chip 3
The time for controlling the size of current of multiple output pins 32 and the electric current output of each output pin 32, to make the LED
Filament realizes several lighting modules.
Refer to Fig. 9, Figure 10, in the fifth embodiment of the present invention, conducting wire 5 is two, one end of conducting wire 5 and controller 8
Connection, the free end of conducting wire 5 is connect with gold thread 62.Single led chip 2 has specific driving portion 21, and integrated control chip 3 has
There is control unit 33 corresponding with driving portion 21.
In use, integrated control chip 3 controls LED wafer 2 driving portion 21 by control unit 33, collects
It can control switch and the bright-dark degree of each LED wafer 2 at control chip 3.Therefore the LED filament is converted with multiple color
Light-emitting mode.
1, Figure 12 referring to Figure 1, in the sixth embodiment of the present invention, LED wafer 2, which is fixed on second by insulating cement 74, to be led
Above line 5b, 2 both ends of LED wafer are electrically connected with the first conducting wire 5a or the second conducting wire 5b or privates 5c respectively, the first conducting wire
5a, the second conducting wire 5b, privates 5c end be electrically connected with output pin 32.Second end conducting wire 5b two sides, which also has, to be used for
Fix the insulator 75 of the first conducting wire 5a, the second conducting wire 5b, privates 5c.
During the installation process, LED wafer 2 is fixed on above the second conducting wire 5b, and LED wafer 2 is by gold thread 62 respectively with the
One conducting wire 5a, the second conducting wire 5b or the first conducting wire 5a, privates 5c or the second conducting wire 5b, privates 5c electrical connection.It compares
In the conducting wire that first embodiment is printed circuit, the installation process of the present embodiment is more easy.
In the present invention, which multiple LED wafers 2 arranged along its length are arranged on substrate 6, then together
Encapsulation, solidification unit price are relatively low, then connect multiple output pins 32 of LED filament with conducting wire 5, pin 4 and conducting wire 5
Pad is few, and overall cost is lower.
In the present invention, size of current and each output pin that integrated control chip 3 passes through control output pin 32
The time of 32 electric current output and direction make the LED filament realize several lighting modules.
More than, it is only presently preferred embodiments of the present invention, is not intended to limit the present invention in any form, although this
Invention has been disclosed in a preferred embodiment above, and however, it is not intended to limit the invention, any person skilled in the art,
It does not depart within the scope of technical solution of the present invention, when the technology contents using the disclosure above make a little change or are modified to equivalent
The equivalent embodiment of variation, but without departing from the technical solutions of the present invention, according to the technical essence of the invention to the above reality
Any simple modification, equivalent variations and modification made by example are applied, all of which are still within the scope of the technical scheme of the invention.
Claims (10)
1. a kind of filament of integrated control chip and LED wafer, the multiple LED arranged including resin photic zone, along its length
Chip, which is characterized in that the filament further includes multiple conducting wires and integrated control chip, and the LED wafer both ends are respectively and wherein
The electrical connection of two conducting wires, the resin photic zone are wrapped in the LED wafer, outside the conducting wire, the integrated control chip with
The conducting wire is connected and fixed, and the integrated control chip is with a pair of of input pin for connecting to power supply and for leading with more
Multiple output pins of line connection.
2. the filament of integrated control chip and LED wafer according to claim 1, which is characterized in that the LED filament is also
Including the substrate being made of insulating material, the substrate is for fixing the LED wafer, the conducting wire.
3. the filament of integrated control chip and LED wafer according to claim 2, which is characterized in that the substrate is also used
In the multiple output pins of fixation.
4. the filament of integrated control chip and LED wafer according to claim 1, which is characterized in that led described in every two
There is at least one described LED wafer between line.
5. the filament of integrated control chip and LED wafer according to claim 1, which is characterized in that two conducting wires
Between at least one positive described LED wafer and the reversed LED wafer.
6. the filament of integrated control chip and LED wafer according to claim 1, which is characterized in that have on the substrate
There are multiple pads connecting with conducting wire, which is electrically connected by gold thread with LED wafer.
7. the filament of integrated control chip and LED wafer according to claim 1, which is characterized in that the substrate is PCB
Plate.
8. the filament of integrated control chip and LED wafer according to claim 1, which is characterized in that the integrated control
Chip is also used to control the size of current of the output pin.
9. the filament of integrated control chip and LED wafer according to claim 1, which is characterized in that the integrated control
Chip is used to control time and the direction of the electric current output of each output pin.
10. the filament of integrated control chip and LED wafer according to claim 1, which is characterized in that the conducting wire is print
Brush circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811242956.7A CN109323135A (en) | 2018-10-24 | 2018-10-24 | A kind of filament of integrated control chip and LED wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811242956.7A CN109323135A (en) | 2018-10-24 | 2018-10-24 | A kind of filament of integrated control chip and LED wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109323135A true CN109323135A (en) | 2019-02-12 |
Family
ID=65262887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811242956.7A Pending CN109323135A (en) | 2018-10-24 | 2018-10-24 | A kind of filament of integrated control chip and LED wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109323135A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022266810A1 (en) * | 2021-06-21 | 2022-12-29 | 京东方科技集团股份有限公司 | Driver circuit and driving method therefor, array substrate, and display device |
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| CN209084426U (en) * | 2018-10-24 | 2019-07-09 | 浙江鼎鑫工艺品有限公司 | A kind of filament of integrated control chip and LED wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101184356A (en) * | 2007-12-13 | 2008-05-21 | 尹旗 | Automatic light-changing lamp |
| CN201844279U (en) * | 2010-09-19 | 2011-05-25 | 木林森股份有限公司 | Color-changeable LED decorative lamp string |
| US20130147369A1 (en) * | 2011-12-13 | 2013-06-13 | Gemmy Industries Corporation | Led light string and led module with an integrated signal controller thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2022266810A1 (en) * | 2021-06-21 | 2022-12-29 | 京东方科技集团股份有限公司 | Driver circuit and driving method therefor, array substrate, and display device |
| US12211453B2 (en) | 2021-06-21 | 2025-01-28 | Beijing Boe Optoelectronics Technology Co., Ltd. | Driver circuit, driving method of the driver circuit, array substrate, and display device |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190212 |
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| RJ01 | Rejection of invention patent application after publication |