GB2351804A - Controlling measurement equipment in semiconductor factory automation system - Google Patents
Controlling measurement equipment in semiconductor factory automation system Download PDFInfo
- Publication number
- GB2351804A GB2351804A GB0015837A GB0015837A GB2351804A GB 2351804 A GB2351804 A GB 2351804A GB 0015837 A GB0015837 A GB 0015837A GB 0015837 A GB0015837 A GB 0015837A GB 2351804 A GB2351804 A GB 2351804A
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- measurement
- equipment
- semiconductor
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- measurement data
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- General Factory Administration (AREA)
Abstract
A method for controlling measurement equipment to measure semiconductor wafers in a semiconductor factory automation (FA) system, comprises (a) establishing a communication mode between an operator interface server and the measurement equipment from an offline to an online communication mode; (b) loading a semiconductor wafer cassette containing wafers to the measurement equipment; (c) sending a measurement recipe and a command directly inputted from an operator to the measurement equipment, wherein the measurement recipe represents a set of measurement conditions corresponding to the semiconductor wafer cassette and the command includes control commands controlling the measurement equipment; (d) measuring the semiconductor wafers contained in the cassette according to the recipe, thereby generating measurement data; (e) comparing the measurement data with reference data to determine whether the measurement data is conformable; (f) commanding the measurement equipment to again measure the semiconductor wafers if the measurement data does not conform; and (g) storing the measurement data in a real-time database.
Description
2351804 SEMICONDUCTOR FACTORY AUTOMATION SYSTEM AND METHOD FOR CONTROLLING
MEASUREMENT EQUIPMENT TO MEASURE SEMICONDUCTOR WAFERS The present invention relates to a semiconductor factory automation (FA) system; and, more particularly, to a semiconductor FA svstem and method for controlling a measurement equipment to measure semiconductor wafers.
Generally, a conventional semiconductor FA system includes equipments (hereinafter, referred to as EQs) including measurement equipments and process equipments, stockers and an automatic guide vehicle (hereinafter, referred to as AGV). An EQ processes the semiconductor wafers or measures processed semiconductor wafers. For example, an ellipsometer equipment as a measurement equipment measures a thickn-eas of a thin film deposited on a substrate of a semiconductor wafer.
A stocker stocks a semiconductor wafer cassette containing the semiconductor wafers to be processed or measured 3.n the EQ. Further, the stocker stocks the semiconductor wafer cassette, which has been already processed or measured in the EQ.
The AGV-transports the semiconductor wafer cassette from the EQ to another EQ. Further, the AGV transports the semiconductor wafer cassette from the stocker to the E6. Furthermore, the AGV transports the semiconductor wafer cassette from the EQ to the stocker.
The conventional semiconductor FA system further includes an EQ server (hereinafter, referred to as an EQS) coupled to the EQ, e.g., the ellipsometer equipment. The EQS controls the ellipsometer equipment to control a semiconductor measurement. Further, after the ellipsometer equipment has completed the semiconductor measurement, the EQS stores measurement data. When the EQS controls the semiconductor measurement and stores the measurement data, an overload may occur in the EQS. Therefore, the conventional semiconductor FA system strongly needs a scheme capable of effectively saving the overload occurring in the EQS.
It is, therefore, an object of the present invention to provide a semiconductor FA system and method for controlling a measurement equipment, which is capable of effectively saving an overload occurring in an equipment server coupled to the measurement equipment. I In accordance with an aspect of the present invention, there is provided a semiconductor factory automation (FA) system, comprising: a measurement means for measuring semiconductor wafers contained in a semiconductor wafer cassette according to a measurement recipe, thereby generating measurement data, wherein said measurement means converts a communication mode from an off line communication mode to an online communication mode in response to 3 a communication mode conversion command and the measurement recipe represents a set of measurement conditions corresponding to the semiconductor wafer cassette; an operator interface means for sending the measurement recipe and a command directly inputted from an operator to said measurement means, wherein the command includes control commands controlling said measurement equipment and the control command includes the communication mode conversion command; and a storage means coupled to said operator interface means for storing the measurement data, wherein the operator loads the semiconductor wafer cassette to said measurement means; and compares the measurement data with reference data to determine whether the measurement data is conformable, and commands said measurement means to again measure the semiconductor wafers if the measurement data is not conformable.
In accordance with another aspect of the present invention, there is provided a method for controlling a measurement equipment to measure semiconductor wafers in a semiconductor factory automation (FA) system, eMprising the steps of: a) establishing a communication mode between an operator interface server and the measurement equipment from an offline communication mode to an online communication mode; b) loading a semiconductor wafer cassette containing the semiconductor wafers to the measurement equipment; c) sending a measurement recipe and a command directly inputted from an operator to the measurement equipment, wherein the measurement recipe represents a set of measurement conditions corresponding to the semiconductor wafer cassette and the command includes control commands controlling the measurement equipment; d) measuring the it semiconductor wafers contained in the semiconductor wafer cassette according to the measurement recipe, thereby generating measurement data; e) comparing the measurement data with reference data to determine whether the measurement data is conformable; f) commanding S the measurement equipment to again measure the semiconductor wafers if the measurement data is not conformable; and g) storing the measurement data in a real-time database.
The above and other object5 and features of the instant invention will become apparent from the following description of preferred embodiments taken in conjunction with the accompanying drawings, in which:
Fig. I is a block diagram describing a semiconductor FA system for controlling a measurement equipment in accordance with the present invention; Fig. 2 is a block diagram illustrating a transportation control portion shown in Fig. 1; and Figs. 3 to 6 are flowcharts showing a method for controlling a measurement equipment in accordance with the present invention.
Ref erring to Fig., 1, there is shown a block diagram showing a semiconductor factory automation (FA.system for controlling a measurement equipment in accordance with an embodiment of the present invention. As S ' i shown, the semiconductor FA system includez at least one cell, which has a predetermined number, e. g., 4, of semiconductor producti-on baYs 400. A semiconductor production bay 400 is provided with equipments (EQs) 204 including measurement equipments and process equipments, stockers 216 and an automatic guide vehicle (AGV) 214. An EQ 204 as a process equipment processes semiconductor wafers in order to obtain semiconductor devices. The EQ 204 as a measurement equipment measures the processed semiconductor wafers.
The EQ 204 includes, e.g., an etching equipment, a photo- lithography equipment, a furnace equipment, an ellipsometer equipment as the measurement equipment and the like. Particularly, the ellipsometer equipment measures a thickness of a thin film deposited on a substrate of a semiconductor wafer.
A stocker 216 temporarily stores a number of semiconductor wafer cassettes. Each of semiconductor wafer cassettes has a predetermined number of semiconductor wafers, which is referred to as a lot. The semiconductor wafer cassettes are selectively transported to the EQ 204 by using the AGV 214. The semiconductor wafer cassette stocked in the stocker 216 is transported to another semiconductor prcduction bay 400.
An equipment server (EQS) 202 is coupled to a common communication line 500, e.g,, Ethernetrm supplied by Xerox Corporation. An AGV controller (AGVC) 212 controls the AGV 214.
The semiconductor FA system also includes a cell management portion 100, a real-time database 300 connected to the cell management portion 100, a temporary storage unit 31'0, a history management portion 312 connected to the temporary storage unit 310 and a history database 314 connected to the history management portion 312. The cell management portion 100 and the history management portion 312 are respectively connected to the common communication line 500 for communication therebetween.
The cell management portion 100 includes a cell management server (CMS) 206, an operator interface server (hereinafter, referred to as OIS) 201 and a data gathering server (hereinafter, referred to as OGS) 207. The DGS 207 stores semiconductor process data associated with the lot in the real-time database 300.
The EQ 204 as the measurement equipment measures semiconductor wafers contained in a semiconductor wafer cassette according to a measurement recipe, thereby generating measurement data. The measurement recipe represents a set of measurement conditions corresponding to the semiconductor.wafer cassette.
The measurement equipment, e.g., the ellipsometer equipment, operates at a semi-automation mode as an operating mode when the ellipsometer equipment is based on an online mode and the semiconductor wafer cassette is loaded to the ellipsometer equipment by an operator. Further, the measurement equipment, e.g., the ellipsometer equipment, operates at a. full-automation mode as the operating mode when the ellipsometer equipment is based on the online mode and the semiconductor wafer cassette is loaded to the ellipsometer equipment by the AGV 214.
The OIS 201 sends the measurement recipe, a semiconductor wafer 25 cassette identifier and a command directly inputted from the operator to the measurement equipment, wherein the command includes control commands controlling the measurement eqiipment and the control commands includes a communication mode conversion command. The DGS 207 gathers the measurement data. The real-time database 300 stores the measurement data in a real time. The operator loads the semiconductor wafer cassette to the measurement equipment and compares the measurement data with reference data to determine whether the measurement data is conformable. The operator commands the measurem6nt equipment to aga3.n measure the semiconductor wafers if the measurement data is not conformable.
The EQS 202 connects the measurement equipment to the OIS 201 for communication. Then, the measurement equipment, e.g., the ellipsometer equipment, measures a thickness of a thin film deposited on a substrate of a semiconductor wafer until all the semiconductor wafers has been measured.
The OIS 201 informs the measurement equipment that the measurement data is conformable if the measurement data is substantially same as the reference data. Further, the OIS 201 informs the measurement equipment that the measurement data is not conformable if the measurement data is not substantially same as the reference data.
The measurement equipment sends a data conformity- report containing a semiconductor wafer cassette identifier via the EQS 202 to the OIS 201 if the measurement data is conformable. Further, the measurement equipment sends a data nonconformity report containing the semiconductor wafer cassette identifier via the EQS 202 to the OIS 201 if the measurement data is not conformable.
Referring to Fig. 2, there is shown a block diagram illustrating a transportation control portion shown ir Fig, 1. As shown, the transportation control portion 116 include's intrabay control servers (ICSs) 210 coupled to the common communication line 500 and stocker control servers (SCSs) 218. The ICS 210 converts a transportation message into a transportation command from the common communication line 500. The SCS 218 generates a stocker control command to control the stockers 216 in response to the transportation command. The AGVC 212 generates an AGV control command to control an AGV 214 in response to the transportation command.
Referring to Figs. 3 to 6, there are flowcharts showing a method for controlling a measurement equipment to measure semiconductor wafers in accordance with the present invention.
Referring to Fig. 3, at step S302, the OIS 201 sends a communication mode conversion command inputted from an operator to the EQ 204 as an ellipsometer equipment coupled to the EQS 202.
is At step 5304, the ellipsometer equipment sends a communication connection request to the EQS 202 so that a communication between the ellipsometer equipment and the EQS 202 is connected, At step S306, the L'QS 202 converts a communication mode between the ellipsometer equipment and the EQS 202 from an offline mode' to an online mode in response to the communication connection request.
At step S308, the operator loads a semiconductor wafer cassette containing semiconductor wafers to the ellipsometer equipment.
At step S310, the OIS 201 sends a measurement recipe as a set of measurement conditions and a semiconductor wafer cassette identifier inputted from the operator to the ellipsometer equipment.
At step S312, the OIS 201 sends a measurement start command inputted from the operator to the ellips6neter equipment.
Referring to Fig. 4, at step S314,' te ellipsometer equipment measures a thickness of a thin film deposited on a substrate of a semiconductor wafer, At step S316, the ellipsometer equipment generates measurement data and sends the measurement data to the EQS 202.
At step S318, it is determined whether the ellipsometer equipment has measured all the semiconductor wafers contained in the semiconductor wafer cassette.
at step S320, if the ellipsometer equipment has measured all the semiconductor wafers contained in the semiconductor wafer cassette, the ellipscmeter equipment sends a measurement completion signal to the EQS 202. Further, if the ellipsometer equipment has not measured all the semiconductor wafers contained in the semiconductor wafer cassette, the seps S314 and S320 are repeated. 15 At step, S322, the EQS 202 sends the measurement data and a measurement completion message via the common communication line 500 to the OIS 201. At step S324, the operator compares the measurement data with reference data. ' 20 Referring to Fig. 5, at step S326, the operator determines whether the measurement data is substantially same as the reference data. At step S328, if the measurement data is substantially same as the reference data, the operator informs the ellipsometer equipment that the measurement data is conformable.
At step S330, the ellipsometer equipment sends a data conformity report containing the semiconductor wafer cissette identifier to the to ZQS 202. At step S332, the operator unloads the semiconductor wafer cassette from the ellipsometer equipment. At step S334, the DGS 207 gathers the measurement data. 5 At step S336, the real-time database 300 stores the gathered measurement data in a real time. Referring to Fig. 6, at step S338, if the measurement data is not substantially same as the reference data, the ellipsometer equipment again measures the semicondVctor wafers. 10 At step S340, the ellipsometer equipment sends a measurement completion signal to the EQS 202. At step S342, the EQS 202 sends measurement data and a measurement completion message to the OIS 201. At step S344, the operator compares the measurement data with reference data.
At step S346, the operator determines whether the measurement data is substantially same as the reference data.
At step S348, if the measurement data is not substantially same as the reference data, the operator informs the ellipsometer equipment that the measurement data is not conformable. If the measurement data is substantially same as the reference data, the steps S326 to S348 are repeated.
At step S350, the ellipsometer equipment sends a data nonconformity report containing the semiconductor wafer cassette 25 identifier. Then, the steps S332 to S350 are repeated.
Although the preferred embodiments of the invention have been disclosed for illustrative purposes, those skilled in the art will k\ appreciate that various mcdi:Eic:ations, additions and substitutions are possible, withcut departing from the scope of the invention as disclosed in the accompanying claims.
What is e-l;;img,,d isa 1. A semiconductor factory automation (FA) system, comprising: a measurement means for measuring semiconductor wafers contained in a semiconductor wafer cassette according to a measurement recipe, thereby generating measurement data, wherein said measurement means converts a communication mode f rom an of f line communication mode to an.online communication mode in response to a communication mode conversion command and the measurement recipe represents a set of measurement conditions corresponding to the semiconductor wafer cassette; an operator interface means for sending the measurement recipe and a command directly inputted from an operator to said measurement means, wherein the command includes control commands controlling said measurement equipment and the control command includes the communication mode conversion command; and a storage means coupled to said operator interface means for storing the measurement data, wherein the operator loads the semiconductor wafer cassette to said measurement means; and compares the measurement data with reference data to determine whether the measurement data is conformable; and commands said measurement means.to again measure the semiconductor wafers if the measurement data is not conformable.
2. The semiconductor FA system as recited in claim 1, further comprising a communication connection means:based on the online communication mode for connecting said meas'urement means to said operator interface means for communication.
3. The semiconductor FA system as recited in claim 1, wherein said measurement means includes an ellipsometer equipment for measuring a thickness of a thin film deposited on a substrate of a semiconductor wafer, 4. The semiconductor FA system as recited in claim 3, wherein the measurement recipe includes a semiconductor wafer cassette identifier.
5. The semiconductor FA system as recited in claim 4, wherein said operator interface means informs said measurement means that is the measurement data is conformable if the measurement data is substantially same as the reference data.
6. The semiconductor FA system as recited in claim 5, wherein said operator interface intans informs said measurement means that the measurement data is not conformable if the measurement data is 1 not substantially same as the reference data.
7. The semiconductor FA system as recited in claim 6, wherein said measurement means sends a data conformity report containing the semiconductor wafer cassette identifier vici said communication connection means to said operator interface means if the measurement data is conformable.
1-4 B. The semiconductor FA system as recited in claim 7, wherein said measurement means sends a data nonconformity report containing the semiconductor wafer cassette identifier via said communication connect"Aon means to said operator interface means if the measurement data is not conformable. 9. The semiconductor FA system as recited in claim 8, wherein said storage means includes: 10 a gathering means for- gathering the measurement data; and a real-time database for storing the measurement data in a real time. 10. The semiconductor FA system as recited in claim 9, wherein said measurement means operates at a semi-automation mode at an operating mode when said measurement means is based on the online communication mode and the semiconductor wafer cassette is loaded to said measurement means by the operator.
11. The semiconductor FA system as recited in claim 10, further comprising:
a transportation means for transporting the semiconductor wafer cassette.
12. The semiconductor FA system as recited in claim 11, wherein said measurement means operates at a full-automation mode as the operating mode when said measurement means is based on the online \5 communication mode and the semiconductor wafer cassette is loaded to said measurement means by said transportation means.
13. A method for controlling a measurement equipment to measure semiconductor wafers in a semiconductor factory automation (FA) system, comprising the steps of:
a) establishing a communication mode between an operator interface server and the measurement equipment from an offline communication mode to an online communication mode; b) loading a semiconductor wafer cassette containing the semiconductor wafers to the measurement equipment; c) sending a measurement recipe and a command directly inputted from an operator to the measurement equipment, wherein the measurement recipe represents a set of measurement conditicns corresponding to the semiconductor wafer cassette and the command includes control commands controlling the measurement equipment; d) measuring the semiconductor wafers contained in the semiconductor wafer cassette according to the measurement recipe, thereby generating measurement data; 2Q e) comparing the measurement data with reference data to determine whether the measurement data is conformable; f) commanding the measurement equipment to again measure the semiconductor wafers if the measurement data is not conformable; and g) storing the measurement data in a real-time database. 25 14. The method as'recited in claim 13, wherein sa.id step d) includes the step of:
measuring a thickness of a thin film deposited on a substrate of each semiconductor wafer until all the semiconductor wafers has been measured.
15. The method as recited in claim 14, wherein the measurement recipe includes a semiconductor wafer cassette identifier.
16. The method as recited in claim 15, wherein said step e) further includes the steps of:
el) informing the measurement equipment that the measurement data is conformable if the measurement data is substantially same as the reference data; and e2) informing the measurement equipment that the measurement data is not conformable if the measurement data Is not substantially same as the reference data.
17. The method as recited in claim 16, wherein said step f) further includes the steps of:
f3) sending a data conformity report via an equipment server to the operator interface server if the measurement data is conformable; and f 4) sending a data nonconformity report via the equipment server to the operator interface server if the measurement data is not conf ormable.
18. The method as recited in claim 17, wherein said step g) includes the steps of:
gl) gathering the measurement data; and g2) storing the measurement data in the real-time database.
19. A semiconductor factory automation (FA) system substantially as hereinbefore described with reference to the accompanying Figures.
20. A method for controlling a measurement equipment to measure semiconductor wafers in a semiconductor factory automation (FA) system substantially as hereinbefore described with reference to Figures 3 to 6.
1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-1999-0024870A KR100498600B1 (en) | 1999-06-28 | 1999-06-28 | Method for collecting data detected by prometrix equipment during manufacturing semiconductor |
| KR10-1999-0024934A KR100498601B1 (en) | 1999-06-28 | 1999-06-28 | Method for collecting data detected by ellipsometer equipment during manufacturing semiconductor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB0015837D0 GB0015837D0 (en) | 2000-08-23 |
| GB2351804A true GB2351804A (en) | 2001-01-10 |
| GB2351804B GB2351804B (en) | 2003-09-24 |
Family
ID=26635597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0015837A Expired - Fee Related GB2351804B (en) | 1999-06-28 | 2000-06-28 | Semiconductor factory automation system and method for controlling measurement equipment to measure semiconductor wafers |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2001076982A (en) |
| CN (1) | CN1279424A (en) |
| DE (1) | DE10031478A1 (en) |
| GB (1) | GB2351804B (en) |
| TW (1) | TW466577B (en) |
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| US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| US7101799B2 (en) | 2001-06-19 | 2006-09-05 | Applied Materials, Inc. | Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| US6910947B2 (en) | 2001-06-19 | 2005-06-28 | Applied Materials, Inc. | Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| US7201936B2 (en) | 2001-06-19 | 2007-04-10 | Applied Materials, Inc. | Method of feedback control of sub-atmospheric chemical vapor deposition processes |
| US7047099B2 (en) | 2001-06-19 | 2006-05-16 | Applied Materials Inc. | Integrating tool, module, and fab level control |
| US6913938B2 (en) | 2001-06-19 | 2005-07-05 | Applied Materials, Inc. | Feedback control of plasma-enhanced chemical vapor deposition processes |
| US7337019B2 (en) | 2001-07-16 | 2008-02-26 | Applied Materials, Inc. | Integration of fault detection with run-to-run control |
| US6984198B2 (en) | 2001-08-14 | 2006-01-10 | Applied Materials, Inc. | Experiment management system, method and medium |
| US7225047B2 (en) | 2002-03-19 | 2007-05-29 | Applied Materials, Inc. | Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements |
| US6792328B2 (en) * | 2002-03-29 | 2004-09-14 | Timbre Technologies, Inc. | Metrology diffraction signal adaptation for tool-to-tool matching |
| KR20050026099A (en) | 2002-08-01 | 2005-03-14 | 어플라이드 머티어리얼즈 인코포레이티드 | Method, system, and medium for handling misrepresentative metrology data within an advanced process control system |
| CN1720490B (en) | 2002-11-15 | 2010-12-08 | 应用材料有限公司 | Method and system for controlling manufacture process having multivariate input parameters |
| US7333871B2 (en) | 2003-01-21 | 2008-02-19 | Applied Materials, Inc. | Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools |
| US7205228B2 (en) | 2003-06-03 | 2007-04-17 | Applied Materials, Inc. | Selective metal encapsulation schemes |
| CN100342485C (en) * | 2003-06-10 | 2007-10-10 | 旺宏电子股份有限公司 | Furnace Tube Productivity Monitoring System and Its Operation Method |
| US7354332B2 (en) | 2003-08-04 | 2008-04-08 | Applied Materials, Inc. | Technique for process-qualifying a semiconductor manufacturing tool using metrology data |
| US7356377B2 (en) | 2004-01-29 | 2008-04-08 | Applied Materials, Inc. | System, method, and medium for monitoring performance of an advanced process control system |
| US6961626B1 (en) | 2004-05-28 | 2005-11-01 | Applied Materials, Inc | Dynamic offset and feedback threshold |
| US7096085B2 (en) | 2004-05-28 | 2006-08-22 | Applied Materials | Process control by distinguishing a white noise component of a process variance |
| CA2784437C (en) * | 2009-12-22 | 2018-05-22 | Unitract Syringe Pty Ltd | Retractable syringe with improved delivery efficiency and locking system |
| CN105185731B (en) * | 2015-08-17 | 2018-10-16 | 北京北方华创微电子装备有限公司 | A kind of the chip dispatch control method and system of semiconductor heat treatment equipment |
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- 2000-06-28 TW TW89112724A patent/TW466577B/en not_active IP Right Cessation
- 2000-06-28 JP JP2000195191A patent/JP2001076982A/en active Pending
- 2000-06-28 CN CN 00122213 patent/CN1279424A/en active Pending
- 2000-06-28 DE DE2000131478 patent/DE10031478A1/en not_active Withdrawn
- 2000-06-28 GB GB0015837A patent/GB2351804B/en not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| TW466577B (en) | 2001-12-01 |
| CN1279424A (en) | 2001-01-10 |
| GB2351804B (en) | 2003-09-24 |
| JP2001076982A (en) | 2001-03-23 |
| DE10031478A1 (en) | 2001-07-12 |
| GB0015837D0 (en) | 2000-08-23 |
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Legal Events
| Date | Code | Title | Description |
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| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20090628 |