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GB2346103A - Method and apparatus for modeling a chemical mechanical polishing process - Google Patents

Method and apparatus for modeling a chemical mechanical polishing process

Info

Publication number
GB2346103A
GB2346103A GB0010451A GB0010451A GB2346103A GB 2346103 A GB2346103 A GB 2346103A GB 0010451 A GB0010451 A GB 0010451A GB 0010451 A GB0010451 A GB 0010451A GB 2346103 A GB2346103 A GB 2346103A
Authority
GB
United Kingdom
Prior art keywords
cmp
modeling
modeling system
empirical
mechanical polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0010451A
Other versions
GB0010451D0 (en
Inventor
Scott R Runnels
Inki Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam IPEC Corp
Original Assignee
Speedfam IPEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam IPEC Corp filed Critical Speedfam IPEC Corp
Publication of GB0010451D0 publication Critical patent/GB0010451D0/en
Publication of GB2346103A publication Critical patent/GB2346103A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

A chemical mechanical polishing (CMP) modeling system is capable of simulating both wafer-scale uniformity and feature-scale planarity results associated with a given CMP procedure. The modeling system optimizes its modeling parameters by comparing the simulated CMP results to corresponding empirical CMP results. The modeling system is also capable of optimizing the CMP process parameters such that the empirical CMP result approximates an ideal or predetermined CMP result defined by the user. The modeling system leverages historical empirical data to generate interpolation formulas for the modeling parameters. The use of such interpolation formulas enables the modeling system to simulate CMP procedures for which no empirical data exists.
GB0010451A 1997-11-18 1998-11-12 Method and apparatus for modeling a chemical mechanical polishing process Withdrawn GB2346103A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US97255197A 1997-11-18 1997-11-18
PCT/US1998/024231 WO1999025520A1 (en) 1997-11-18 1998-11-12 Method and apparatus for modeling a chemical mechanical polishing process

Publications (2)

Publication Number Publication Date
GB0010451D0 GB0010451D0 (en) 2000-06-14
GB2346103A true GB2346103A (en) 2000-08-02

Family

ID=25519800

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0010451A Withdrawn GB2346103A (en) 1997-11-18 1998-11-12 Method and apparatus for modeling a chemical mechanical polishing process

Country Status (5)

Country Link
JP (1) JP2001523586A (en)
KR (1) KR20010032223A (en)
DE (1) DE19882821T1 (en)
GB (1) GB2346103A (en)
WO (1) WO1999025520A1 (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7069101B1 (en) 1999-07-29 2006-06-27 Applied Materials, Inc. Computer integrated manufacturing techniques
AU2001249724A1 (en) * 2000-04-03 2001-10-15 Speed-Fam-Ipec Corporation System and method for predicting software models using material-centric process instrumentation
US7097534B1 (en) 2000-07-10 2006-08-29 Applied Materials, Inc. Closed-loop control of a chemical mechanical polisher
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
DE10065380B4 (en) * 2000-12-27 2006-05-18 Infineon Technologies Ag Method for characterizing and simulating a chemical-mechanical polishing process
US7082345B2 (en) 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US6910947B2 (en) 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US6913938B2 (en) 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US20020192966A1 (en) * 2001-06-19 2002-12-19 Shanmugasundram Arulkumar P. In situ sensor based control of semiconductor processing procedure
US7047099B2 (en) 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US7337019B2 (en) 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6984198B2 (en) 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
DE10208165C1 (en) * 2002-02-26 2003-10-02 Advanced Micro Devices Inc Method, control and device for controlling the chemical mechanical polishing of substrates
US7225047B2 (en) 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
KR20050026099A (en) 2002-08-01 2005-03-14 어플라이드 머티어리얼즈 인코포레이티드 Method, system, and medium for handling misrepresentative metrology data within an advanced process control system
CN1720490B (en) 2002-11-15 2010-12-08 应用材料有限公司 Method and system for controlling manufacture process having multivariate input parameters
JP4777658B2 (en) 2002-11-22 2011-09-21 アプライド マテリアルズ インコーポレイテッド Method and apparatus for polishing control
US7333871B2 (en) 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
JP4266668B2 (en) * 2003-02-25 2009-05-20 株式会社ルネサステクノロジ Simulation device
US7205228B2 (en) 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US7354332B2 (en) 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US7394554B2 (en) * 2003-09-15 2008-07-01 Timbre Technologies, Inc. Selecting a hypothetical profile to use in optical metrology
DE102005000645B4 (en) * 2004-01-12 2010-08-05 Samsung Electronics Co., Ltd., Suwon Apparatus and method for treating substrates
US7356377B2 (en) 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
US7096085B2 (en) 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
JP4952155B2 (en) * 2006-09-12 2012-06-13 富士通株式会社 Polishing condition prediction program, recording medium, polishing condition prediction apparatus, and polishing condition prediction method
US8117568B2 (en) 2008-09-25 2012-02-14 International Business Machines Corporation Apparatus, method and computer program product for fast simulation of manufacturing effects during integrated circuit design
JP6782145B2 (en) * 2016-10-18 2020-11-11 株式会社荏原製作所 Board processing control system, board processing control method, and program
WO2018074091A1 (en) * 2016-10-18 2018-04-26 株式会社 荏原製作所 Substrate processing control system, substrate processing control method, and program
JP6753758B2 (en) * 2016-10-18 2020-09-09 株式会社荏原製作所 Polishing equipment, polishing methods and programs
CN115505988A (en) * 2022-09-29 2022-12-23 日善电脑配件(嘉善)有限公司 A method and device for optimizing the uniformity of anodized film

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5599423A (en) * 1995-06-30 1997-02-04 Applied Materials, Inc. Apparatus and method for simulating and optimizing a chemical mechanical polishing system
US5637031A (en) * 1996-06-07 1997-06-10 Industrial Technology Research Institute Electrochemical simulator for chemical-mechanical polishing (CMP)

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5599423A (en) * 1995-06-30 1997-02-04 Applied Materials, Inc. Apparatus and method for simulating and optimizing a chemical mechanical polishing system
US5637031A (en) * 1996-06-07 1997-06-10 Industrial Technology Research Institute Electrochemical simulator for chemical-mechanical polishing (CMP)

Also Published As

Publication number Publication date
KR20010032223A (en) 2001-04-16
JP2001523586A (en) 2001-11-27
GB0010451D0 (en) 2000-06-14
DE19882821T1 (en) 2001-05-10
WO1999025520A1 (en) 1999-05-27

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)