GB2064233A - Liquid crystal display device - Google Patents
Liquid crystal display device Download PDFInfo
- Publication number
- GB2064233A GB2064233A GB8030315A GB8030315A GB2064233A GB 2064233 A GB2064233 A GB 2064233A GB 8030315 A GB8030315 A GB 8030315A GB 8030315 A GB8030315 A GB 8030315A GB 2064233 A GB2064233 A GB 2064233A
- Authority
- GB
- United Kingdom
- Prior art keywords
- liquid crystal
- crystal display
- display device
- conductive material
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
A liquid crystal display device includes a sheet-like connector member (6) interposed between electrode terminals (2) juxtaposed on an end portion of a liquid crystal display cell (1) and signal terminals (5) juxtaposed on an end portion of a driving circuit board (3). The sheet-like connector member is formed of a sheet of thermosetting adhesive which contains parts of conductive material embedded therein for providing electrical connection between the corresponding electrode and signal terminals. <IMAGE>
Description
SPECIFICATION
Liquid crystal display device
The present invention relates to a liquid crystal display device, and more particularly to means for electrically connecting electrode terminals of a liquid crystal display cell to a driving circuit board.
In accordance with one conventional method of electrically connecting a liquid crystal display cell and a driving circuit board, metal connectors or conductive rubber connectors of pillar shape distributed between insulative rubber material are disposed between a number of electrode terminals juxtaposed on an end portion of the display cell and signal terminals juxtaposed on an end portion of the driving circuit board, and an electrical connection of the electrode terminals and the signal electrodes through the metal or rubber connector is realized by means of the application of a clamping pressure. In accordance with another method, a hot-melt or thermoplastic adhesive is used when a driving circuit board including connectors adhered to a flexible board such as a polyimide film is employed (see
Japanese Patent Application 53-101776 filed on
August 23, 1978 or the corresponding U.S.
Application Serial No. 68,576 filed on August 22, 1979, assigned to the same assignee as the present application).
In the former method, however, a high clamping pressure is required when a large-size cell, especially, a cell such as a matrix type display cell including a great number of electrode terminals and having a long side along which the terminals are provided, is used. Therefore, the cell is subjected to its damage. Further, it is difficult to uniformly apply the clamping pressure to all of the terminals, which leads to poor electrical connection. Furthermore, when the pitch of the terminals on the cell or the driving circuit board is extremely small, undesirable contact between adjacent terminals frequently takes place and hence high reliability cannot be expected.In an assembly fabricated in accordance with the latter method by which the above problems associated with the application of a clamping pressure can be solved, the thermoplastic adhesive may be readily attacked by oil, solvent or the like so that inferior connection or peeling-off takes place at room temperature. Further, so long as the used adhesive is of hot-melt or thermoplastic type, higher heat resistance cannot be expected. Furthermore, since the bonding strength of the adhesive greatly depends upon temperature, the adhesive substance may move by a small load at a temperature higher than the normal room temperature by 100 to 200C and hence the peeling-off may take place.
An object of the present invention is to provide a liquid crystal display device having a connection structure in which the above problems in the conventional structures are eliminated and which permits reliable, sure electrical connection.
According to the present invention, there is provided e liquid crystal display device comprising,
a a liquid crystal display cell containing a liquid
crystal material sealed between opposite
electrode substrates, a plurality of electrode terminals arranged on an end portion of said liquid crystal display cell, a driving circuit board for driving said liquid crystal display cell, a plurality of signal terminals arranged on an end portion of said driving circuit board corresponding to said electrode terminals, and sheet-like connector means disposed between said electrode terminals and said signal terminals, said connector means including conductive material parts which provide electrical connection between the corresponding electrode and signal terminals and thermosetting adhesive parts which are filled between said conductive material parts.
The present invention will now be explained referring to the accompanying drawings, in which:
Fig. 1 is a sectional view showing a main part of an embodiment of a liquid crystal display device according to the present invention; and
Figs. 2A and 2B respectively show plan and sectional views of a main part of the connector in the embodiment shown in Fig. 1.
In Fig. 1 showing an embodiment of a liquid crystal display device according to the present invention, reference numeral 1 generally designates a liquid crystal display cell containing a liquid crystal material sealed between opposite electrode substrates, numeral 2 a number of electrode terminals juxtaposed on an end portion of the cell 1, numeral 3 a driving circuit board provided with circuit elements 4 for driving the liquid crystal display cell 1, numeral 5 a number of signal terminals juxtaposed on an end portion of the upper surface of the driving circuit board 3, and numeral 6 a sheet-like connector member disposed between the electrode terminals 2 of the liquid crystal display cell 1 and the signal terminals 5 of the driving circuit board 3. The connector member 6 includes a sheet of thermosetting adhesive and is best shown in Figs.
2A and 28. The connector member 6 may be formed in such a manner that circular cylindershaped through-holes having the same pitch as the electrode and signal terminals 2 and 5 are provided in a 100 to 1,000 micron thick adhesive sheet 6a of epoxy base containing a potential curing agent such as boron fluoride complex (BF3complex) salt for causing a hardening reaction at temperatures above a critical temperature, and the through-holes are filled with paste 6b of Ag powders containing hot-melt or thermoplastic resin. The connector 6 is first positioned in a manner that respective one-side ends of Ag paste 6b coincide with the signal terminals 5 of the driving circuit board 3 and the other-side ends thereof coincide with the electrode terminals 2 of the liquid crystal display cell 1.Thereafter, a load in the order of 4 kg/cm2 is applied under the raised temperatures of 1300 to 1 500 C, thereby
hardening the adhesive sheet 6a. The hot-melt type Ag paste 6b is then hardened through natural cooling.
Facilitated operation of alignment between the
Ag paste 6b and the signal and electrode terminals and hence the subsequent hardening work may be achieved by applying a proper tackiness agent to the surfaces of the signal terminals 5 to which one-side ends of Ag paste 6b are to be adhered (and surface portions of the driving circuit board 3 between signal terminals) while applying a silane-coupling agent to the surfaces of the electrode terminals 2 to which the other-side ends of Ag paste 6b are to be adhered (and surface portions of the display cell 1 between electrode terminals).
In accordance with another example of the
connector member 6, through-holes provided in a
sheet of an epoxy base adhesive containing the
above-described potential curing agent are filled
with a thermosetting type of Ag paste containing a
curing agent of dicyandiamide base. The sheet and
the paste are hardened by the same process as the
above-mentioned.
With the connector member 6 in which the
adhesive sheet 6a and Ag paste 6b forming the
connector member 6 adhere tightly to the liquid
crystal display cell 1 and the driving circuit board
3 through the heating and pressing process, the
connector 6 does not peel off and causes no
inferior connection, thereby providing reliable
electrical connection.
The Ag paste used may contain usually more
than 30 vol.% of Ag powders, preferably, about 80
vol.% of Ag powders.
Though the paste containing silver (Ag)
powders has been exemplified, a paste containing
gold (Au), lead (Pb), or carbon (C) powders may be
employed. In more detail, since no large current is
required for driving the liquid crystal display cell 1
and hence no requirements of excellent
conductivity are imposed on the conductive parts
6b of the connector member 6, any proper
conductive material can be used for the powders
contained in the paste.
Though the adhesive sheet of epoxy base resin
has been exemplified, any proper thermosetting
resin may be used. In order to improve the
workability, the sheet may contain a base formed
of, for example, a non-woven fabric or a polyester
film.
Further, though the adhesive sheet has been
exemplified as containing a potential curing agent,
the thermosetting type of adhesive sheet may
include a resin containing any proper
thermosetting agent.
For the silane-coupling agent which may be
applied to the terminal portions of the liquid
crystal display cell before the connection between
the adhesive sheet and the electrode terminals, it
has been found that good results are obtained
when y-aminopropyltriethoxysilane or glycydoxytrimethoxysilane dissolved in ethyl
alcohol with a concentration of 0.5 to 10% by
weight is applied to the terminal portions of the
cell and then dried at a temnerature of 600C to 1200 C. The thermal drying process can be substituted with a mere drying process by air. The silane-coupling agent is not limited to these two kinds but the most effective silane-coupling agent is selected depending upon a thermosetting resin used as the adhesive sheet.
The conductive material paste portions of the connector member have been shown as having circular cylinder shapes and being aligned in the same straight line. However, any pillar shape such as elliptic cylinder or square pillar may be employed and the paste portions may be arranged in a zigzag form when the pitch of the electrode and signal terminals is very small.
As has been explained in the foregoing, a liquid crystal display device according to the present invention includes, as a connector member between the terminals on a liquid crystal display cell and the terminals on a driving circuit board, a thermosetting adhesive sheet having paste of conductive material embedded therein, whereby high reliability and sure electrical connection are achieved.
Claims (7)
1. A liquid crystal display device comprising:
a liquid crystal display cell containing a liquid crystal material sealed between opposite electrode substrates;
a plurality of electrode terminals arranged on an end portion of said liquid crystal display cell;
a driving circuit board for driving said liquid crystal display cell;
a plurality of signal terminals arranged on an end portion of said driving circuit board corresponding to said electrode terminals; and
sheet-like connector means disposed between said electrode terminals and said signal terminals, said connector means including conductive material parts which provide electrical connection between the corresponding electrode and signal terminals and thermosetting adhesive parts which are filled between said conductive material parts.
2. A liquid crystal display device according to
Claim 1, wherein said thermosetting adhesive parts of said connector means comprise a resin containing a potential curing agent.
3. A liquid crystal display device according to
Claim 2, wherein said potential curing agent is a boron fluoride complex salt.
4. A liquid crystal display device according to any one of the preceding claims, wherein said conductive material parts of said connector means comprise powders of conductive material mixed in a thermoplastic resin matrix.
5. A liquid crystal display device according to any one of claims 1 to 3, wherein said conductive material parts of said connector means comprise powders of conductive material mixed in a thermosetting resin matrix.
6. A liquid crystal display device according to claim 4 or 5, wherein said powders include at least one of Ag, Au, Pb and C.
7. A liquid crystal display device according to claim 1 substantially as hereinbefore described with reference to Figures 1 or 2a or 2b of the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14656779A JPS5670529A (en) | 1979-11-14 | 1979-11-14 | Liquid crystal display unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2064233A true GB2064233A (en) | 1981-06-10 |
| GB2064233B GB2064233B (en) | 1984-02-01 |
Family
ID=15410589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8030315A Expired GB2064233B (en) | 1979-11-14 | 1980-09-19 | Liquid crystal display device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5670529A (en) |
| GB (1) | GB2064233B (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2123224A (en) * | 1982-06-30 | 1984-01-25 | Nippon Mektron Kk | Connecting circuit boards using conductive adhesive |
| EP0110382A2 (en) * | 1982-12-01 | 1984-06-13 | Asahi Glass Company Ltd. | Display device and process for its production and decal for forming a display panel terminal |
| EP0147856A3 (en) * | 1983-12-27 | 1987-05-27 | Sony Corporation | Electrically conductive adhesive sheet, circuit board and electrical connection structure using the same |
| EP0237176A2 (en) * | 1986-02-07 | 1987-09-16 | Minnesota Mining And Manufacturing Company | Connector with fine-pitched conductive passages |
| EP0272678A2 (en) * | 1986-12-24 | 1988-06-29 | Sel Semiconductor Energy Laboratory Co., Ltd. | Conductive pattern producing method and its applications |
| EP0303256A2 (en) * | 1987-08-13 | 1989-02-15 | Shin-Etsu Polymer Co., Ltd. | A method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby |
| EP2288242A1 (en) * | 2009-07-31 | 2011-02-23 | Raytheon Company | Multi-layer microwave corrugated printed circuit board and method |
| US8043464B2 (en) | 2009-11-17 | 2011-10-25 | Raytheon Company | Systems and methods for assembling lightweight RF antenna structures |
| US8127432B2 (en) | 2009-11-17 | 2012-03-06 | Raytheon Company | Process for fabricating an origami formed antenna radiating structure |
| US8362856B2 (en) | 2009-11-17 | 2013-01-29 | Raytheon Company | RF transition with 3-dimensional molded RF structure |
| US9072164B2 (en) | 2009-11-17 | 2015-06-30 | Raytheon Company | Process for fabricating a three dimensional molded feed structure |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58205131A (en) * | 1982-05-25 | 1983-11-30 | Toshiba Corp | Multilayered liquid crystal display element |
| JPS6035595A (en) * | 1983-08-08 | 1985-02-23 | アルプス電気株式会社 | Terminal connecting structure of electronic component |
| JPS6099566U (en) * | 1983-12-10 | 1985-07-06 | アルプス電気株式会社 | Connection structure of printed circuit board terminals |
| JPS62173434A (en) * | 1986-01-27 | 1987-07-30 | Stanley Electric Co Ltd | Manufacture of liquid crystal display |
| JPH0529460Y2 (en) * | 1987-06-15 | 1993-07-28 | ||
| JPS63316885A (en) * | 1987-06-19 | 1988-12-26 | キヤノン株式会社 | External circuit connection structure for liquid crystal panel |
| US4930876A (en) * | 1987-10-30 | 1990-06-05 | Ricoh Company, Ltd. | Liquid crystal display device |
| CH676889A5 (en) * | 1988-09-16 | 1991-03-15 | Asulab Sa |
-
1979
- 1979-11-14 JP JP14656779A patent/JPS5670529A/en active Pending
-
1980
- 1980-09-19 GB GB8030315A patent/GB2064233B/en not_active Expired
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2123224A (en) * | 1982-06-30 | 1984-01-25 | Nippon Mektron Kk | Connecting circuit boards using conductive adhesive |
| EP0110382A2 (en) * | 1982-12-01 | 1984-06-13 | Asahi Glass Company Ltd. | Display device and process for its production and decal for forming a display panel terminal |
| EP0110382A3 (en) * | 1982-12-01 | 1987-01-07 | Asahi Glass Company Ltd. | Display device and process for its production and decal for forming a display panel terminal |
| US4697885A (en) * | 1982-12-01 | 1987-10-06 | Asahi Glass Company, Ltd. | Display device and decal for forming a display panel terminal |
| EP0147856A3 (en) * | 1983-12-27 | 1987-05-27 | Sony Corporation | Electrically conductive adhesive sheet, circuit board and electrical connection structure using the same |
| AU572615B2 (en) * | 1983-12-27 | 1988-05-12 | Sony Corporation | Electrically conductive adhesive sheet circuit board and electrical connection structure |
| EP0237176A3 (en) * | 1986-02-07 | 1988-12-28 | Minnesota Mining And Manufacturing Company | Connector with fine-pitched conductive passages |
| EP0237176A2 (en) * | 1986-02-07 | 1987-09-16 | Minnesota Mining And Manufacturing Company | Connector with fine-pitched conductive passages |
| EP0272678A3 (en) * | 1986-12-24 | 1990-04-25 | Sel Semiconductor Energy Laboratory Co., Ltd. | Conductive pattern producing method and its applications |
| EP0272678A2 (en) * | 1986-12-24 | 1988-06-29 | Sel Semiconductor Energy Laboratory Co., Ltd. | Conductive pattern producing method and its applications |
| US6383327B1 (en) | 1986-12-24 | 2002-05-07 | Semiconductor Energy Laboratory Co., Ltd. | Conductive pattern producing method |
| US7288437B2 (en) | 1986-12-24 | 2007-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Conductive pattern producing method and its applications |
| EP0303256A2 (en) * | 1987-08-13 | 1989-02-15 | Shin-Etsu Polymer Co., Ltd. | A method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby |
| EP0303256A3 (en) * | 1987-08-13 | 1990-09-26 | Shin-Etsu Polymer Co., Ltd. | A method for electrically connecting ic chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby |
| EP2288242A1 (en) * | 2009-07-31 | 2011-02-23 | Raytheon Company | Multi-layer microwave corrugated printed circuit board and method |
| US9491854B2 (en) | 2009-07-31 | 2016-11-08 | Raytheon Company | Multi-layer microwave corrugated printed circuit board and method |
| US8043464B2 (en) | 2009-11-17 | 2011-10-25 | Raytheon Company | Systems and methods for assembling lightweight RF antenna structures |
| US8127432B2 (en) | 2009-11-17 | 2012-03-06 | Raytheon Company | Process for fabricating an origami formed antenna radiating structure |
| US8362856B2 (en) | 2009-11-17 | 2013-01-29 | Raytheon Company | RF transition with 3-dimensional molded RF structure |
| US8453314B2 (en) | 2009-11-17 | 2013-06-04 | Raytheon Company | Process for forming channels in a flexible circuit substrate using an elongated wedge and a channel shaped receptacle |
| US9072164B2 (en) | 2009-11-17 | 2015-06-30 | Raytheon Company | Process for fabricating a three dimensional molded feed structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5670529A (en) | 1981-06-12 |
| GB2064233B (en) | 1984-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |