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GB2042774B - Fabricating method of electronic watch module - Google Patents

Fabricating method of electronic watch module

Info

Publication number
GB2042774B
GB2042774B GB8001694A GB8001694A GB2042774B GB 2042774 B GB2042774 B GB 2042774B GB 8001694 A GB8001694 A GB 8001694A GB 8001694 A GB8001694 A GB 8001694A GB 2042774 B GB2042774 B GB 2042774B
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit board
flexible printed
electronic watch
watch module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8001694A
Other versions
GB2042774A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP339679U external-priority patent/JPS55105991U/ja
Priority claimed from JP4182079A external-priority patent/JPS55134386A/en
Priority claimed from JP4607479A external-priority patent/JPS55138847A/en
Priority claimed from JP4806579A external-priority patent/JPS55141742A/en
Priority claimed from JP12258279A external-priority patent/JPS5646540A/en
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Publication of GB2042774A publication Critical patent/GB2042774A/en
Application granted granted Critical
Publication of GB2042774B publication Critical patent/GB2042774B/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Electric Clocks (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electromechanical Clocks (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

A method of fabricating an electronic watch module in which a flexible printed circuit board (12) having a printed circuit pattern and a plurality of leads (42) extending therefrom is prepared and an IC chip (14) is wireless bonded to the leads (42) of said flexible printed circuit board (12), which is then inserted into a cavity of a molding die unit (50) and at least a part of one of said flexible printed circuit board (12) and said IC chip (14) is fixedly retained within the cavity of said die unit (50). A thermoplastic resin is supplied into the cavity of said molding die unit (50) for thereby encapsulating said flexible printed circuit board (12) and said IC chip (14), without distortion of the leads (42). <IMAGE>
GB8001694A 1979-01-18 1980-01-18 Fabricating method of electronic watch module Expired GB2042774B (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP339679U JPS55105991U (en) 1979-01-18 1979-01-18
JP4182079A JPS55134386A (en) 1979-04-06 1979-04-06 Circuit substrate for electronic watch
JP4607479A JPS55138847A (en) 1979-04-17 1979-04-17 Method of fabricating circuit substrate for watch
JP4806579A JPS55141742A (en) 1979-04-20 1979-04-20 Circuit board for watch
JP12258279A JPS5646540A (en) 1979-09-26 1979-09-26 Manufacture of circuit board for watch

Publications (2)

Publication Number Publication Date
GB2042774A GB2042774A (en) 1980-09-24
GB2042774B true GB2042774B (en) 1983-04-13

Family

ID=27518355

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8001694A Expired GB2042774B (en) 1979-01-18 1980-01-18 Fabricating method of electronic watch module

Country Status (2)

Country Link
CH (1) CH641626B (en)
GB (1) GB2042774B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2545653B1 (en) * 1983-05-04 1986-06-06 Pichot Michel METHOD AND DEVICE FOR ENCAPSULATING INTEGRATED CIRCUITS
EP0347974B1 (en) * 1988-06-23 1994-10-26 Teikoku Tsushin Kogyo Co. Ltd. Mount for electronic parts
DE19841498C2 (en) * 1998-09-10 2002-02-21 Beru Ag Method for producing an electronic component, in particular a Hall sensor

Also Published As

Publication number Publication date
CH641626GA3 (en) 1984-03-15
GB2042774A (en) 1980-09-24
CH641626B (en)

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930118