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GB2007911A - Microwave device package - Google Patents

Microwave device package

Info

Publication number
GB2007911A
GB2007911A GB7840121A GB7840121A GB2007911A GB 2007911 A GB2007911 A GB 2007911A GB 7840121 A GB7840121 A GB 7840121A GB 7840121 A GB7840121 A GB 7840121A GB 2007911 A GB2007911 A GB 2007911A
Authority
GB
United Kingdom
Prior art keywords
plate
wall
circuit
enclosure
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7840121A
Other versions
GB2007911B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SECR DEFENCE
UK Secretary of State for Defence
Original Assignee
SECR DEFENCE
UK Secretary of State for Defence
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SECR DEFENCE, UK Secretary of State for Defence filed Critical SECR DEFENCE
Priority to GB7840121A priority Critical patent/GB2007911B/en
Publication of GB2007911A publication Critical patent/GB2007911A/en
Application granted granted Critical
Publication of GB2007911B publication Critical patent/GB2007911B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32153—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/32175—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic
    • H01L2224/32188—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic the layer connector connecting to a bonding area protruding from the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Waveguides (AREA)

Abstract

Microwave integrated circuits are hermetically sealed within an enclosure comprising a first dielectric plate carrying the circuit, a dielectric wall sealed to the surface of the first plate surrounding the circuit, and a second dielectric plate providing a lid sealed over the wall to complete the enclosure. The first plate carries planar conductors which define at least one microwave transmission line, eg microstrip, extending across the wall into the enclosure from outside to provide direct microwave coupling to the enclosed circuit thus obviating the need for transitions to and from coaxial cable. At least part of the circuit may be contained within a recess provided by forming an aperture in the first plate and sealing a third dielectric plate beneath the aperture. Techniques for reducing losses where the transmission line propagation paths traverse the wall on the surface of the first plate are disclosed. <IMAGE>
GB7840121A 1977-10-12 1978-10-11 Methods of packaging microwave intergrated circuits and to microwave intergrated circiuted packages Expired GB2007911B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB7840121A GB2007911B (en) 1977-10-12 1978-10-11 Methods of packaging microwave intergrated circuits and to microwave intergrated circiuted packages

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB4247177 1977-10-12
GB7840121A GB2007911B (en) 1977-10-12 1978-10-11 Methods of packaging microwave intergrated circuits and to microwave intergrated circiuted packages

Publications (2)

Publication Number Publication Date
GB2007911A true GB2007911A (en) 1979-05-23
GB2007911B GB2007911B (en) 1982-03-24

Family

ID=26264909

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7840121A Expired GB2007911B (en) 1977-10-12 1978-10-11 Methods of packaging microwave intergrated circuits and to microwave intergrated circiuted packages

Country Status (1)

Country Link
GB (1) GB2007911B (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0180906A1 (en) * 1984-11-02 1986-05-14 Siemens Aktiengesellschaft Wave resistance-adapted chip support for a microwave semiconductor
EP0198698A2 (en) * 1985-04-13 1986-10-22 Fujitsu Limited Integrated circuit device having strip line structure therein
EP0235503A2 (en) * 1986-02-24 1987-09-09 Hewlett-Packard Company hermetic high frequency surface mount microelectronic package
US4925024A (en) * 1986-02-24 1990-05-15 Hewlett-Packard Company Hermetic high frequency surface mount microelectronic package
GB2292833A (en) * 1994-08-30 1996-03-06 Mitsubishi Electric Corp Microwave integrated circuit and method of fabrication
EP2657964A3 (en) * 2012-04-27 2015-07-29 Canon Kabushiki Kaisha Electronic component and electronic apparatus
US9155212B2 (en) 2012-04-27 2015-10-06 Canon Kabushiki Kaisha Electronic component, mounting member, electronic apparatus, and their manufacturing methods
US9220172B2 (en) 2012-04-27 2015-12-22 Canon Kabushiki Kaisha Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0180906A1 (en) * 1984-11-02 1986-05-14 Siemens Aktiengesellschaft Wave resistance-adapted chip support for a microwave semiconductor
US4875087A (en) * 1985-04-13 1989-10-17 Fujitsu Limited Integrated circuit device having strip line structure therein
EP0198698A2 (en) * 1985-04-13 1986-10-22 Fujitsu Limited Integrated circuit device having strip line structure therein
EP0198698A3 (en) * 1985-04-13 1988-08-03 Fujitsu Limited Integrated circuit device having strip line structure therein
US4925024A (en) * 1986-02-24 1990-05-15 Hewlett-Packard Company Hermetic high frequency surface mount microelectronic package
EP0235503A3 (en) * 1986-02-24 1988-10-26 Hewlett-Packard Company Hermetic high frequency surface mount microelectronic package
EP0235503A2 (en) * 1986-02-24 1987-09-09 Hewlett-Packard Company hermetic high frequency surface mount microelectronic package
GB2292833A (en) * 1994-08-30 1996-03-06 Mitsubishi Electric Corp Microwave integrated circuit and method of fabrication
GB2292833B (en) * 1994-08-30 1998-12-02 Mitsubishi Electric Corp Microwave integrated circuit and method of fabricating microwave integrated circuit
EP2657964A3 (en) * 2012-04-27 2015-07-29 Canon Kabushiki Kaisha Electronic component and electronic apparatus
US9155212B2 (en) 2012-04-27 2015-10-06 Canon Kabushiki Kaisha Electronic component, mounting member, electronic apparatus, and their manufacturing methods
US9220172B2 (en) 2012-04-27 2015-12-22 Canon Kabushiki Kaisha Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus
US9253922B2 (en) 2012-04-27 2016-02-02 Canon Kabushiki Kaisha Electronic component and electronic apparatus

Also Published As

Publication number Publication date
GB2007911B (en) 1982-03-24

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee