GB1503449A - Semiconductor components - Google Patents
Semiconductor componentsInfo
- Publication number
- GB1503449A GB1503449A GB31594/76A GB3159476A GB1503449A GB 1503449 A GB1503449 A GB 1503449A GB 31594/76 A GB31594/76 A GB 31594/76A GB 3159476 A GB3159476 A GB 3159476A GB 1503449 A GB1503449 A GB 1503449A
- Authority
- GB
- United Kingdom
- Prior art keywords
- pad
- semiconductor
- semiconductor components
- contact
- heading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
- H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Abstract
1503449 Semiconductor devices SIEMENS AG 29 July 1976 [1 Aug 1975] 31594/76 Heading H1K A contact pad 2 for a semiconductor device comprises a plurality of discrete elements 6, 7, 8 one of which, 8, is electrically connected, e.g. via track 3, to the semiconductor zone to which external contact is to be made and comprises a series of spaced elongate portions distributed throughout the pad. When a terminal lead, such as 5, is bonded to the pad 2 only a minor portion of the total area of the pad is thus capacitively coupled through the underlying insulating layer to the semiconductor substrate. Various pad configurations are possible, Fig. 1 showing one example.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2534477A DE2534477C3 (en) | 1975-08-01 | 1975-08-01 | Low-capacitance contact point |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1503449A true GB1503449A (en) | 1978-03-08 |
Family
ID=5953032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB31594/76A Expired GB1503449A (en) | 1975-08-01 | 1976-07-29 | Semiconductor components |
Country Status (5)
Country | Link |
---|---|
AT (1) | AT359128B (en) |
DE (1) | DE2534477C3 (en) |
FR (1) | FR2319975A1 (en) |
GB (1) | GB1503449A (en) |
IT (1) | IT1067180B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2631810C3 (en) * | 1976-07-15 | 1979-03-15 | Deutsche Itt Industries Gmbh, 7800 Freiburg | Planar semiconductor device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3450965A (en) * | 1966-05-28 | 1969-06-17 | Sony Corp | Semiconductor having reinforced lead structure |
-
1975
- 1975-08-01 DE DE2534477A patent/DE2534477C3/en not_active Expired
- 1975-11-03 AT AT834675A patent/AT359128B/en not_active IP Right Cessation
-
1976
- 1976-07-26 FR FR7622725A patent/FR2319975A1/en active Granted
- 1976-07-27 IT IT25722/76A patent/IT1067180B/en active
- 1976-07-29 GB GB31594/76A patent/GB1503449A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2534477B2 (en) | 1978-07-27 |
DE2534477C3 (en) | 1979-04-05 |
ATA834675A (en) | 1980-03-15 |
FR2319975B1 (en) | 1982-11-19 |
FR2319975A1 (en) | 1977-02-25 |
AT359128B (en) | 1980-10-27 |
IT1067180B (en) | 1985-03-12 |
DE2534477A1 (en) | 1977-02-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |