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GB1463087A - Transducers - Google Patents

Transducers

Info

Publication number
GB1463087A
GB1463087A GB4058174A GB4058174A GB1463087A GB 1463087 A GB1463087 A GB 1463087A GB 4058174 A GB4058174 A GB 4058174A GB 4058174 A GB4058174 A GB 4058174A GB 1463087 A GB1463087 A GB 1463087A
Authority
GB
United Kingdom
Prior art keywords
chip
arms
diaphragm
bridge
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4058174A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Welwyn Electric Ltd
Original Assignee
Welwyn Electric Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Welwyn Electric Ltd filed Critical Welwyn Electric Ltd
Priority to GB4058174A priority Critical patent/GB1463087A/en
Publication of GB1463087A publication Critical patent/GB1463087A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

1463087 Pressure transducers WELWYN ELECTRIC Ltd 19 Aug 1975 [17 Sept 1974] 40581/74 Heading H1K A fluid pressure transducer comprises a resilient diaphragm 11, e.g. of metal, plastics or glass, secured at its periphery, e.g. to a hollow metal cylinder 12, and having bonded thereto a semi-conductor chip 1 containing at least two diffused piezoresistive regions adapted to form arms of a Wheatstone bridge. The other arms of the bridge may also be located within the chip 1 or may comprise external resistors. The piezoresistive regions are preferably located near the periphery of the diaphragm 11, with respective arms located along radial and tangential stress axes. If all four arms of the bridge are in the chip 1 they may be arranged as a rectangular frame connected at the corners or may be mutually spaced. The chip 1 may be bonded to the diaphragm 11 by an epoxy adhesive.
GB4058174A 1974-09-17 1974-09-17 Transducers Expired GB1463087A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4058174A GB1463087A (en) 1974-09-17 1974-09-17 Transducers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4058174A GB1463087A (en) 1974-09-17 1974-09-17 Transducers

Publications (1)

Publication Number Publication Date
GB1463087A true GB1463087A (en) 1977-02-02

Family

ID=10415610

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4058174A Expired GB1463087A (en) 1974-09-17 1974-09-17 Transducers

Country Status (1)

Country Link
GB (1) GB1463087A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3543261A1 (en) * 1985-12-06 1987-06-11 Siemens Ag PRESSURE SENSOR
EP0729019A2 (en) * 1995-02-27 1996-08-28 Motorola, Inc. Method of forming a piezoresistive pressure sensor and a piezoresistive pressure sensor
US6341528B1 (en) 1999-11-12 2002-01-29 Measurement Specialties, Incorporated Strain sensing structure with improved reliability
WO2002061383A1 (en) * 2001-01-31 2002-08-08 Silicon Valley Sensors, Inc. Triangular chip strain sensing structure and corner,edge on a diaphragm
FR2842353A1 (en) * 2002-07-11 2004-01-16 Denso Corp SEMICONDUCTOR DYNAMIC SIZE DETECTOR

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3543261A1 (en) * 1985-12-06 1987-06-11 Siemens Ag PRESSURE SENSOR
EP0729019A2 (en) * 1995-02-27 1996-08-28 Motorola, Inc. Method of forming a piezoresistive pressure sensor and a piezoresistive pressure sensor
EP0729019A3 (en) * 1995-02-27 1996-12-11 Motorola Inc Method of forming a piezoresistive pressure sensor and a piezoresistive pressure sensor
US6341528B1 (en) 1999-11-12 2002-01-29 Measurement Specialties, Incorporated Strain sensing structure with improved reliability
WO2002061383A1 (en) * 2001-01-31 2002-08-08 Silicon Valley Sensors, Inc. Triangular chip strain sensing structure and corner,edge on a diaphragm
FR2842353A1 (en) * 2002-07-11 2004-01-16 Denso Corp SEMICONDUCTOR DYNAMIC SIZE DETECTOR

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee