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GB1380644A - Manufacture of bases for electrical-component envelopes - Google Patents

Manufacture of bases for electrical-component envelopes

Info

Publication number
GB1380644A
GB1380644A GB99272A GB99272A GB1380644A GB 1380644 A GB1380644 A GB 1380644A GB 99272 A GB99272 A GB 99272A GB 99272 A GB99272 A GB 99272A GB 1380644 A GB1380644 A GB 1380644A
Authority
GB
United Kingdom
Prior art keywords
preform
conductors
mould
placing
sleeve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB99272A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1380644A publication Critical patent/GB1380644A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

1380644 A base for supporting an electrical component PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd 10 Jan 1972 [13 Jan 1971] 992/72 Heading B5A [Also in Divisions C1 and H1] A rectangular base for the envelope of an electric component, e.g. a semi-conductor device is formed by placing a preform 5 of heat softenable, insulating material on a pressing member 4 positioned in a T-shaped mould 2, 3, placing a grid of flat conductors shaped as shown on the member 4 so that the legs 8 of the conductors lie between the member 4 and the corresponding mould wall, placing a rectangular metal sleeve 11 in the mould, applying a cover-plate 12, placing the mould in a furnace and urging the member 4 against the preform 5 to force the bent ends 10 of the conductors against the coverplate 12 and the softened material of the preform 5 between the upper parts of the conductors (see Figs. 3, 4) to form a hermetic seal with the sleeve 11. The sleeve 11 may be provided with a flange for welding to a lid. A metal plate 7 which may be positioned in a recess 6 in the preform 5 may be provided. The preform 5 may be synthetic resin or crystallized or uncrystallized glass which may be preformed by sintering into the rectangular block shown. The conductors may be formed by etching or punching a metal strip and may have straight or bent legs 8 (Fig. 4). One or more bases may be formed at a time. To form several bases simultaneously, a series of interconnected conductor grids (24, Fig. 7) is laid in a multi-cavity graphite mould.
GB99272A 1971-01-13 1972-01-10 Manufacture of bases for electrical-component envelopes Expired GB1380644A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7100410A NL7100410A (en) 1971-01-13 1971-01-13

Publications (1)

Publication Number Publication Date
GB1380644A true GB1380644A (en) 1975-01-15

Family

ID=19812245

Family Applications (1)

Application Number Title Priority Date Filing Date
GB99272A Expired GB1380644A (en) 1971-01-13 1972-01-10 Manufacture of bases for electrical-component envelopes

Country Status (7)

Country Link
US (1) US3780429A (en)
CA (1) CA953504A (en)
DE (1) DE2163855A1 (en)
FR (1) FR2121744A1 (en)
GB (1) GB1380644A (en)
IT (1) IT946430B (en)
NL (1) NL7100410A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4100675A (en) * 1976-11-01 1978-07-18 Mansol Ceramics Company Novel method and apparatus for hermetic encapsulation for integrated circuits and the like
US5074036A (en) * 1989-02-10 1991-12-24 Honeywell Inc. Method of die bonding semiconductor chip by using removable frame
US4979289A (en) * 1989-02-10 1990-12-25 Honeywell Inc. Method of die bonding semiconductor chip by using removable non-wettable by solder frame
US5101550A (en) * 1989-02-10 1992-04-07 Honeywell Inc. Removable drop-through die bond frame
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
DE4428319C2 (en) * 1994-08-10 1996-08-14 Duerrwaechter E Dr Doduco Carrier made of plastic for an electronic circuit with bondable contact pins

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2526588A (en) * 1946-03-22 1950-10-17 Raytheon Mfg Co Molding apparatus
US2958100A (en) * 1955-05-16 1960-11-01 Erie Resistor Corp Mold for forming a plurality of electrical elements with embedded terminals
NL258072A (en) * 1960-11-17
US3379823A (en) * 1965-04-29 1968-04-23 Corning Glass Works Hermetic enclosure for electronic devices

Also Published As

Publication number Publication date
DE2163855A1 (en) 1972-07-20
NL7100410A (en) 1972-07-17
CA953504A (en) 1974-08-27
FR2121744A1 (en) 1972-08-25
IT946430B (en) 1973-05-21
US3780429A (en) 1973-12-25

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees