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GB1377515A - Process for the depostion of metal laywers on shaped articles of polyesters - Google Patents

Process for the depostion of metal laywers on shaped articles of polyesters

Info

Publication number
GB1377515A
GB1377515A GB5824571A GB5824571A GB1377515A GB 1377515 A GB1377515 A GB 1377515A GB 5824571 A GB5824571 A GB 5824571A GB 5824571 A GB5824571 A GB 5824571A GB 1377515 A GB1377515 A GB 1377515A
Authority
GB
United Kingdom
Prior art keywords
thickened
treated
give
coated
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5824571A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kalle GmbH and Co KG
Original Assignee
Kalle GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kalle GmbH and Co KG filed Critical Kalle GmbH and Co KG
Publication of GB1377515A publication Critical patent/GB1377515A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

1377515 Photo-resist materials KALLE A G 15 Dec 1971 [17 Dec 1970] 58245/71 Heading G2C [Also in Division C7 and H1] In the manufacture of printed circuits, (A) a polyethylene terephthalate film is (1) degreased (2) treated with a solution of PdCl 2 and trichloroacetic acid (3) dried, (4) treated with a solution of NaOH and hydrazine hydrate (5) electrolessly plated in a Cu-HCHO bath (b) electrolytically thickened with Cu from a CuSO 4 bath (7) coated with a napththoquinone diazide photoresist containing a novolak and polyvinylacetate (see Example 3), exposed and developed with Na 3 PO 4 and ethylene gylcol methyl ether, (8) the bared Cu is removed by etching and (9) the photoresist is removed by solvent to leave a positive printed circuit. Alternatively, (B) A substrate is coppered using steps (A) (1) to (5) and photographically treated as at (7); one part of the board is etched and the photo-resist removed as at (8) and (9), and the remaining Cu thickened as at (6) to give a positive printed circuit; (C) the other part of the board, after steps (1) to (5) and (7) is thickened as at (6) on the bared Cu areas, and decoated (9) and etched (8) to give a negative printed circuit. Alternatively (D), procedure (C) is repeated by thickening with electrolytic Ni instead of Cu as in step (6). In Example 8, a polyethylene terephthalate film is coated with a photopolymerizable material, coated with polyethlene terephthalate by pressure rollers, the laminate is exposed, the covering film pulled off, and the photopolymer layer developed; the resulting body is degreased, neutralized, treated using steps (A) (2) to (5), the etch resist is removed by wiping with methylene chloride, and the Cu film is thickened as at A (6) to give a positive circuit diagram.
GB5824571A 1970-12-17 1971-12-15 Process for the depostion of metal laywers on shaped articles of polyesters Expired GB1377515A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2062215A DE2062215C3 (en) 1970-12-17 1970-12-17 Process for the deposition of metal layers on molded articles made of polyesters

Publications (1)

Publication Number Publication Date
GB1377515A true GB1377515A (en) 1974-12-18

Family

ID=5791316

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5824571A Expired GB1377515A (en) 1970-12-17 1971-12-15 Process for the depostion of metal laywers on shaped articles of polyesters

Country Status (14)

Country Link
JP (1) JPS5426494B1 (en)
AT (1) AT320371B (en)
AU (1) AU464464B2 (en)
BE (1) BE776681A (en)
CA (1) CA962146A (en)
CH (1) CH574505A5 (en)
DE (1) DE2062215C3 (en)
ES (1) ES397976A1 (en)
FR (1) FR2118150B1 (en)
GB (1) GB1377515A (en)
IT (1) IT945452B (en)
NL (1) NL7116792A (en)
SE (1) SE377945B (en)
ZA (1) ZA718403B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4125649A (en) * 1975-05-27 1978-11-14 Crown City Plating Pre-etch conditioning of polysulfone and other polymers for electroless plating
JPS5832489A (en) * 1981-08-20 1983-02-25 日東電工株式会社 Polyester film for printed circuit
DE3243190A1 (en) * 1982-11-23 1984-05-24 Bayer Ag, 5090 Leverkusen METHOD FOR PRODUCING METALIZED TEXTILE AREAS

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1042816A (en) * 1964-06-15 1966-09-14 Ibm Improvements in or relating to the production of metallic coatings upon the surfacesof other materials
FR1481700A (en) * 1965-06-01 1967-05-19 Photocircuits Corp Improvements to non-galvanic metal deposition processes
US3561995A (en) * 1967-04-03 1971-02-09 M & T Chemicals Inc Method of activating a polymer surface and resultant article

Also Published As

Publication number Publication date
ZA718403B (en) 1972-09-27
CH574505A5 (en) 1976-04-15
JPS5426494B1 (en) 1979-09-04
FR2118150A1 (en) 1972-07-28
DE2062215B2 (en) 1977-09-15
NL7116792A (en) 1972-06-20
ES397976A1 (en) 1974-07-01
AT320371B (en) 1975-02-10
BE776681A (en) 1972-06-14
CA962146A (en) 1975-02-04
AU3684171A (en) 1973-06-21
SE377945B (en) 1975-08-04
AU464464B2 (en) 1975-08-28
FR2118150B1 (en) 1975-10-03
DE2062215C3 (en) 1978-05-18
IT945452B (en) 1973-05-10
DE2062215A1 (en) 1972-07-06

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee