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GB1300881A - Improvements in or relating to stacked arrangements of semiconductor bodies - Google Patents

Improvements in or relating to stacked arrangements of semiconductor bodies

Info

Publication number
GB1300881A
GB1300881A GB1398871A GB1398871A GB1300881A GB 1300881 A GB1300881 A GB 1300881A GB 1398871 A GB1398871 A GB 1398871A GB 1398871 A GB1398871 A GB 1398871A GB 1300881 A GB1300881 A GB 1300881A
Authority
GB
United Kingdom
Prior art keywords
bodies
crosspieces
frames
frame
stacked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1398871A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of GB1300881A publication Critical patent/GB1300881A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06579—TAB carriers; beam leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)

Abstract

1300881 Semi-conductor devices SIEMENS AG 10 May 1971 [11 May 1970] 13988/71 Heading H1K A stacked arrangement of semi-conductor bodies, placed one upon another, has connecting leads at right angles to the major surfaces of the bodies. In one embodiment the connecting leads may be formed from two metallic frames 12, 13 associated with each body 1, the frame 12 including cross-pieces 2 which make contact to contact areas 5 on the body. The frame 13 is positioned on frame 12, and also has crosspieces 3 which correspond to, but are shorter than, crosspieces 2. Such frames and bodies may be stacked as shown, Fig. 2, the frames being soldered together, and an insulating resin 8 being injected between the bodies, prior to severing the crosspieces 2 and 3 from the frames along line 10. When severed the crosspieces have no lateral connections but retain vertical connections between bodies, rendering the arrangement, when the bodies are integrated circuits, suitable for data memory stores. In an alternative embodiment, vertical connections are made by means of conducting pins which penetrate bores in the contacts 5 and the part of the body therebelow.
GB1398871A 1970-05-11 1971-05-10 Improvements in or relating to stacked arrangements of semiconductor bodies Expired GB1300881A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702022895 DE2022895B2 (en) 1970-05-11 1970-05-11 STACKED ARRANGEMENT OF SEMICONDUCTOR BODIES AND PROCESS FOR THEIR PRODUCTION

Publications (1)

Publication Number Publication Date
GB1300881A true GB1300881A (en) 1972-12-20

Family

ID=5770762

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1398871A Expired GB1300881A (en) 1970-05-11 1971-05-10 Improvements in or relating to stacked arrangements of semiconductor bodies

Country Status (8)

Country Link
AT (1) AT322059B (en)
CA (1) CA922818A (en)
CH (1) CH519247A (en)
DE (1) DE2022895B2 (en)
FR (1) FR2088490A1 (en)
GB (1) GB1300881A (en)
NL (1) NL7106459A (en)
SE (1) SE369028B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2150749A (en) * 1983-12-03 1985-07-03 Standard Telephones Cables Ltd Integrated circuits
EP0706217A3 (en) * 1994-09-30 1996-11-06 Ibm IC contacts having improved electromigration characteristics and fabrication methods therefor

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2806685A1 (en) * 1978-02-16 1979-08-23 Siemens Ag Stacked semiconductor structure using film mounting - comprises stack of substrates holding semiconductor chips connected to main substrate or circuit board with terminals
JPS5837948A (en) * 1981-08-31 1983-03-05 Toshiba Corp Stacked semiconductor memory device
US4982264A (en) * 1985-02-27 1991-01-01 Texas Instruments Incorporated High density integrated circuit package
DE3640072A1 (en) * 1986-11-24 1988-06-01 Rolf Tiedeken Electronic data storage unit with a number of static RAM chips
FR2645681B1 (en) * 1989-04-07 1994-04-08 Thomson Csf DEVICE FOR VERTICALLY INTERCONNECTING PADS OF INTEGRATED CIRCUITS AND ITS MANUFACTURING METHOD
US5059557A (en) * 1989-08-08 1991-10-22 Texas Instruments Incorporated Method of electrically connecting integrated circuits by edge-insertion in grooved support members

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2150749A (en) * 1983-12-03 1985-07-03 Standard Telephones Cables Ltd Integrated circuits
EP0706217A3 (en) * 1994-09-30 1996-11-06 Ibm IC contacts having improved electromigration characteristics and fabrication methods therefor
US5696030A (en) * 1994-09-30 1997-12-09 International Business Machines Corporation Integrated circuit contacts having improved electromigration characteristics and fabrication methods therefor
US5760477A (en) * 1994-09-30 1998-06-02 International Business Machines Corporation Integrated circuit contacts having resistive electromigration characteristics

Also Published As

Publication number Publication date
FR2088490A1 (en) 1972-01-07
NL7106459A (en) 1971-11-15
DE2022895A1 (en) 1971-12-30
AT322059B (en) 1975-05-12
DE2022895B2 (en) 1976-12-02
CH519247A (en) 1972-02-15
CA922818A (en) 1973-03-13
SE369028B (en) 1974-07-29

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees