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GB1200387A - Copper clad plastic panel - Google Patents

Copper clad plastic panel

Info

Publication number
GB1200387A
GB1200387A GB5043867A GB5043867A GB1200387A GB 1200387 A GB1200387 A GB 1200387A GB 5043867 A GB5043867 A GB 5043867A GB 5043867 A GB5043867 A GB 5043867A GB 1200387 A GB1200387 A GB 1200387A
Authority
GB
United Kingdom
Prior art keywords
resin
mat
border
copper clad
plastic panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5043867A
Inventor
Fred Ulrich Zolg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Milacron Inc
Original Assignee
Cincinnati Milling Machine Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cincinnati Milling Machine Co filed Critical Cincinnati Milling Machine Co
Priority to GB5043867A priority Critical patent/GB1200387A/en
Publication of GB1200387A publication Critical patent/GB1200387A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

1,200,387. Copper-fibreglass laminates. CINCINNATI MILLING MACHINE CO. 6 Nov., 1967, No. 50438/67. Heading B5N. [Also in Divisions G1 and H1] Laminated panels comprise copper foil bonded by heat and pressure to a thermosetting resin base, reinforced with a mat formed by laying down a plurality of glass fibre strands so that each has a lateral swirl pattern. In making the panel the mat is impregnated with and encased in the resin either before or after placing on the foil and the resulting assembly is pressed in a platen press. A yarn border may be stapled around the mat border to confine the resin during pressing. The resin may be methacrylate resin with cross-linking agents (as in the example), or polyester, phenol-formaldehyde, melamine or epoxy resin.
GB5043867A 1967-11-06 1967-11-06 Copper clad plastic panel Expired GB1200387A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB5043867A GB1200387A (en) 1967-11-06 1967-11-06 Copper clad plastic panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5043867A GB1200387A (en) 1967-11-06 1967-11-06 Copper clad plastic panel

Publications (1)

Publication Number Publication Date
GB1200387A true GB1200387A (en) 1970-07-29

Family

ID=10455887

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5043867A Expired GB1200387A (en) 1967-11-06 1967-11-06 Copper clad plastic panel

Country Status (1)

Country Link
GB (1) GB1200387A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137425A (en) * 1983-03-31 1984-10-03 Rogers Corp Shape retaining flexible electric circuit board and method of manufacture thereof
GB2179750A (en) * 1984-11-13 1987-03-11 Commw Of Australia Method of and an apparatus for applying a load to a material
JP2017224758A (en) * 2016-06-16 2017-12-21 日本化薬株式会社 Substrate for double-sided circuit suitable for high-frequency circuit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137425A (en) * 1983-03-31 1984-10-03 Rogers Corp Shape retaining flexible electric circuit board and method of manufacture thereof
GB2179750A (en) * 1984-11-13 1987-03-11 Commw Of Australia Method of and an apparatus for applying a load to a material
JP2017224758A (en) * 2016-06-16 2017-12-21 日本化薬株式会社 Substrate for double-sided circuit suitable for high-frequency circuit

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees