GB1200110A - Electroplating of smooth, semi-bright gold deposits - Google Patents
Electroplating of smooth, semi-bright gold depositsInfo
- Publication number
- GB1200110A GB1200110A GB35230/67A GB3523067A GB1200110A GB 1200110 A GB1200110 A GB 1200110A GB 35230/67 A GB35230/67 A GB 35230/67A GB 3523067 A GB3523067 A GB 3523067A GB 1200110 A GB1200110 A GB 1200110A
- Authority
- GB
- United Kingdom
- Prior art keywords
- gold
- thallium
- alum
- potassium
- sulphate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
1,200,110. Electro-deposition of gold and gold alloys. SEL - REX CORP. Aug.1, 1967, [Sept.7, 1966], No. 35230/67. Heading C7B. Small parts of irregular shape are uniformly plated with gold, e.g. by barrel plating, by electro-deposition at a current density of 0À1 to 10 amp/sq.dm. at 20 to 90 C from an aqueous bath consisting of Gold (added as alkali metal gold cyanide) 1 to 75 g/l Conducting and buffering compounds 5 to 400 g/l Thallium (added as a watersoluble compound) 0À001 to 25 g/l Alum 0À100 g/l the pH being adjusted to lie within the range of 3 to 6 e. g. with phosphoric acid. By "alum" is meant the hydrated double sulphates of ammonium the alkali metals or thallium with those of aluminium, chromium or gallium. The thallium compound used may thallous or thallic sulphate, thallium chloride nitrate or fluosilicate or thallium (I) alum. The buffering compounds may be partially neutralized weak stable organic acids or alkali metal phosphate. In examples the gold is supplied as the potassium double cyanide, thallium as the sulphate and the bath is buffered with diammonium citrate or potassium phosphate. If an alum is also present potassium chromium alum is preferred. Reference is made to the product of both pure gold and bright lemon-yellow gold alloy deposits.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57761866A | 1966-09-07 | 1966-09-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1200110A true GB1200110A (en) | 1970-07-29 |
Family
ID=24309474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB35230/67A Expired GB1200110A (en) | 1966-09-07 | 1967-08-01 | Electroplating of smooth, semi-bright gold deposits |
Country Status (4)
Country | Link |
---|---|
US (1) | US3562120A (en) |
CH (1) | CH476114A (en) |
DE (1) | DE1621169B1 (en) |
GB (1) | GB1200110A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3833488A (en) * | 1971-08-20 | 1974-09-03 | Auric Corp | Gold electroplating baths and process |
GB1442325A (en) * | 1972-07-26 | 1976-07-14 | Oxy Metal Finishing Corp | Electroplating with gold and gold alloys |
US4435253A (en) * | 1983-01-28 | 1984-03-06 | Omi International Corporation | Gold sulphite electroplating solutions and methods |
JP6393526B2 (en) * | 2014-06-11 | 2018-09-19 | メタローテクノロジーズジャパン株式会社 | Cyan-based electrolytic gold plating bath and bump forming method using the same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3149057A (en) * | 1959-04-27 | 1964-09-15 | Technic | Acid gold plating |
NL277808A (en) * | 1961-05-01 |
-
1966
- 1966-09-07 US US577618A patent/US3562120A/en not_active Expired - Lifetime
-
1967
- 1967-08-01 GB GB35230/67A patent/GB1200110A/en not_active Expired
- 1967-09-04 CH CH1240967A patent/CH476114A/en not_active IP Right Cessation
- 1967-09-06 DE DE1967S0111697 patent/DE1621169B1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
DE1621169B1 (en) | 1970-05-14 |
US3562120A (en) | 1971-02-09 |
CH476114A (en) | 1969-07-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |