GB1062759A - The bevelling of edges of semi-conductor components - Google Patents
The bevelling of edges of semi-conductor componentsInfo
- Publication number
- GB1062759A GB1062759A GB4059364A GB4059364A GB1062759A GB 1062759 A GB1062759 A GB 1062759A GB 4059364 A GB4059364 A GB 4059364A GB 4059364 A GB4059364 A GB 4059364A GB 1062759 A GB1062759 A GB 1062759A
- Authority
- GB
- United Kingdom
- Prior art keywords
- holder
- semi
- lap
- bevelling
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 abstract 2
- 238000005498 polishing Methods 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 235000011187 glycerol Nutrition 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
1,062,759. Grinding. SIEMENS-SCHUCKERTWERKE A.G. Oct. 5, 1964 [Nov. 13, 1963], No. 40593/64. Heading B3D. [Also in Division H1] A method of bevelling an edge of a semiconductor component (see Division H1) comprises securing the component to a support member 13 rotatably supported in a holder 12 with the edge of the semi-conductor component in contact with the working surface of a plateform lap 11, and effecting relative motion parallel to the working surface of the lap between the holder and lap so that the support member and semi-conductor component rotates with respect to the holder, the axis of rotation being oblique with respect to the working surface so that the edge is lapped to provide the required bevelling. The holder may receive a plurality of support members 13 which are rotatably disposed in oblique bores in the holder and have semi-conductor components clamped, adhesively secured or cemented to their lower faces. The holder bears against rollers 15 on a guide 14 when the lap 11 is rotated so that the support member with the semi-conductor components rotate about their axes and the holder rotates about its axis to form the bevel on the components. A lapping agent consisting of aluminium oxide powder and lapping oil or glycerine may be used. After lapping the holder with the support members may be mounted over a polishing disc of velvet for polishing the bevels.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0088260 | 1963-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1062759A true GB1062759A (en) | 1967-03-22 |
Family
ID=7514326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4059364A Expired GB1062759A (en) | 1963-11-13 | 1964-10-05 | The bevelling of edges of semi-conductor components |
Country Status (3)
| Country | Link |
|---|---|
| CH (1) | CH416359A (en) |
| GB (1) | GB1062759A (en) |
| NL (1) | NL6410192A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5117590A (en) * | 1988-08-12 | 1992-06-02 | Shin-Etsu Handotai Co., Ltd. | Method of automatically chamfering a wafer and apparatus therefor |
-
1964
- 1964-08-31 CH CH1135664A patent/CH416359A/en unknown
- 1964-09-02 NL NL6410192A patent/NL6410192A/xx unknown
- 1964-10-05 GB GB4059364A patent/GB1062759A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| NL6410192A (en) | 1965-05-14 |
| CH416359A (en) | 1966-06-30 |
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